SU713670A1 - Soldering flux - Google Patents

Soldering flux Download PDF

Info

Publication number
SU713670A1
SU713670A1 SU772511051A SU2511051A SU713670A1 SU 713670 A1 SU713670 A1 SU 713670A1 SU 772511051 A SU772511051 A SU 772511051A SU 2511051 A SU2511051 A SU 2511051A SU 713670 A1 SU713670 A1 SU 713670A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solvent
chelating agent
additionally contains
amino compounds
chelating
Prior art date
Application number
SU772511051A
Other languages
Russian (ru)
Inventor
Владимир Николаевич Кузнецов
Анна Николаевна Тряпицына
Original Assignee
Предприятие П/Я Г-4444
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я Г-4444 filed Critical Предприятие П/Я Г-4444
Priority to SU772511051A priority Critical patent/SU713670A1/en
Application granted granted Critical
Publication of SU713670A1 publication Critical patent/SU713670A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

(54) ФЛЮС ДЛЯ ПАЙКИ(54) BATH FLUSH

Бетствугощее количество хелатного агента и ра- творитель , Потом .добавлют триэтаноламин. Смесь нагревают н вод ной бане до 50°С. Перемешивание продолжают до образовани  светло-ко ричневого раствора.Better amount of chelating agent and solvent, Then add triethanolamine. The mixture is heated in a water bath to 50 ° C. Stirring is continued until a light brown solution is formed.

Полученгазй раствор фильтруют через слой б зи, охлаждают до комнатной температуры. При длительном хранении флюс сохран ет свою активностThe resulting gas solution is filtered through a layer of base, cooled to room temperature. During long-term storage, the flux retains its activity.

Флюсы могут иметь следующие составы , вес,% Состав 1.Fluxes can have the following composition, weight,% Composition 1.

Гексаметилендиамин-N , N, Ы,к тетрауксусна  кислота 5,4 Триэтансшамин4,6Hexamethylenediamine-N, N, S, to tetraacetic acid 5.4 Trietans Shamin4,6

Этиловый спирт , 70,0 .Дистиллированна  вода 20,0 Состав 2.Ethyl alcohol, 70.0. Distilled water 20.0 Composition 2.

Фталева  кислота1, 4Phthalic acid1,4

Гексаметилендиамин-N ,N N,N-тетрауксусна  кислотаб , 9Hexamethylenediamine-N, N N, N-tetraacetic acid, 9

Триэтаноламин6,7Triethanolamine 6,7

Этиловый спирт65,0Ethyl alcohol 65,0

Диcт mлиpoвaннa  вода 20,0 Состав 3. fDiet water 20.0 Composition 3. f

Этилендиамин Ы,М,Ы ,N -тетрауксусна  кислота 6,7 Моноэтаноламин3 3Ethylenediamine Y, M, Y, N - tetraacetic acid 6.7 Monoethanolamine 3 3

Этиловый спирт70,0Ethyl alcohol 70,0

Дистиллированна  вода 20,0 Состав 4еDistilled water 20.0 Composition 4e

Анили H-N,Н-диуксусна  кислота8,2Anil HN, H-diacetic acid8,2

Триэтаноламин11j8Triethanolamine 11j8

Этиловый спирт60,0Ethyl alcohol 60,0

Дистиллированна  вода 2О,О Состав 5.Distilled water 2O, O Composition 5.

Гексаметилендиамин -N,N,NfN-тетрауксусна  киОюта . 5,25 Моноэтаноламин4,1Hexamethylenediamine-N, N, NfN-tetraacetic acid. 5.25 Monoethanolamine 4,1

этиловый- спирт68,0ethyl alcohol 68,0

Вода дистиллированна  20,0 Полизтиленгликоль Предложенный Алюс дл  пайки мож быть легко щ;иготовлен растворениеDistilled water 20.0 Polyethylene glycol The proposed Alum to be soldered can be easily; dissolving

компонентов в растворителе, xopot-ю смываетс  водой, не вызывает коррозии па ного соединени  и имеет достаточно высокую активность. Флюсн приведенных составов дешевы, компоненты вход иие в них, доступны. Процесс отмывки малотоксичен дл  рабочего и позвол ет экономить растворители.components in the solvent, the xopot is rinsed off with water, does not cause corrosion of the soldered compound, and has a fairly high activity. The fluxes of the compositions given are cheap, the input components in them are available. The washing process has low toxicity for the worker and saves solvents.

Claims (1)

Формула изобретени Invention Formula 1, Флюс дл  пайки легкоплавкими припо ми преимущественно радиоэлементов печатных плат, содержащий хелатный агент и растворитель, о т л и ч а ш 1Д и и с   тем, что, с целью снижени  коррозионного действи ,он дополнительно содержит аминосоединени  из р да этаноламинов с молекул рной массой 60-400 у.ед., а в качестве хелатного агента - соединени  общей формулы1 The low-melting solder flux for the predominantly radio elements of printed circuit boards, containing a chelating agent and solvent, is also one that, in order to reduce the corrosive effect, it additionally contains amino compounds from a number of ethanolamines from the molecules with a mass of 60–400 U, and as a chelating agent, a compound of the general formula .ПгОН.PGON RI-NRI-N оabout СНг-СSNG-S ОНHE где R - алкилС -С|2 заметенный алкил , арил, замещенный арил при следующем соотношении компонентов , вес.%:where R is alkylC-C | 2 is a noticeable alkyl, aryl, substituted aryl in the following ratio, wt.%: ХелатнЫй агент5- 9Chelating agent5-9 Аминосоединени  3-12 РастворительОстальноAmino compounds 3-12 Solvent Else 2 „ Флюс, по п. 1, отличающийс  тем, что он дополнительно содержит водорастворимы.е высокомолекул рные соединени , по крайней мере полиэтиленгликоли в количестве 210 вес.%.2, a flux according to claim 1, characterized in that it additionally contains water soluble high molecular weight compounds, at least polyethylene glycols in an amount of 210% by weight. Источники ииформа11ии, прин тые во внимание при экспертизеSources of information taken into account in the examination 1, Хр пин В. Е, и Лакедемонский А, В. Справочник па льника. М., Ма ганостроение, 1974, с. 107, табл, № 170, № 1.1, Hp pin V. E, and Lacedaemon A, B. Handbook of passwords. M., Ma ganostroenie, 1974, p. 107, tab., No. 170, No. 1. 2„ Патент СШ. № 3527972, кл. 148-23, 1971.2 „US Patent. No. 3527972, cl. 148-23, 1971.
SU772511051A 1977-08-01 1977-08-01 Soldering flux SU713670A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU772511051A SU713670A1 (en) 1977-08-01 1977-08-01 Soldering flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU772511051A SU713670A1 (en) 1977-08-01 1977-08-01 Soldering flux

Publications (1)

Publication Number Publication Date
SU713670A1 true SU713670A1 (en) 1980-02-10

Family

ID=20719406

Family Applications (1)

Application Number Title Priority Date Filing Date
SU772511051A SU713670A1 (en) 1977-08-01 1977-08-01 Soldering flux

Country Status (1)

Country Link
SU (1) SU713670A1 (en)

Similar Documents

Publication Publication Date Title
KR100263516B1 (en) Benzimidazole derivatives and composition for treating copper and copper alloy surfaces comprising the same
ES458109A1 (en) Novel racemization process
SU713670A1 (en) Soldering flux
US3488831A (en) Fluxing materials for soldering metal surfaces
US3796610A (en) Glycerol soldering fluxes
ES8105690A1 (en) Phenyl-alkanoic acid derivatives, the preparation thereof and pharmaceutical compositions containing them.
SU713671A1 (en) Soldering flux
SU846188A1 (en) Flux for temperature soldering
SU613590A1 (en) Derivatives of 4,4-diazidostylbene-2,2-disulfonic acid as photo-cross-linking agents
RU1796390C (en) Flux for tinning and soldering of radio equipment members
SU1533845A1 (en) Flux for low-temperature soldering with solder wave
SU1255347A1 (en) Flux for soldering with quick-solders
DK421183A (en) PROCEDURE FOR THE PREPARATION OF ALFA-ARYL-ALFA-PYRIDYLALIC ACIDS
SU715265A1 (en) Water-soluble soldering flux
SU660805A1 (en) Flux for low-temperature soldering
SU1286382A1 (en) Soldering flux
SU591290A1 (en) Water-soluble flux
SU454105A1 (en) Flux for soldering and tinning
SU1459874A1 (en) Flux for low-temperature soldering of copper and nickel
SU1660910A1 (en) Low-temperature soldering and tinning flux
SU580966A1 (en) Low-temperature soldering flux
RU1802774C (en) Flux for low-temperature soldering of radio equipment parts
SU713669A1 (en) Soldering flux
SU460147A1 (en) Solder flux for low temperature solders
SU660999A1 (en) Composition for etching surface of polyimide material