SU705540A1 - Method of manufacturing vacuum devices - Google Patents

Description

(54) METHOD OF MANUFACTURING VACUUM DEVICES

I

The invention relates to the technology of creating electronic devices and can be applied in the design and manufacture of vacuum capacitors, vacuum switches and switches.

The closest to the technical essence of the proposed method is the manufacture of vacuum devices, mainly vacuum condensers, which includes the operation of installing the getter unit in the housing opening, followed by sealing the junction and pumping operation, activating the getter, vacuuming the device 1.

The disadvantage of the considered capacitor manufacturing technology is the need to fabricate counterfeiters, the need to repeat solder operations at the pumping post, pumping out, which takes 12-14 hours to work out and, in addition, the need to separately perform an additional step of activating the gas absorber within 2.5 hours.

The purpose of the invention is to simplify the process of manufacturing vacuum devices.

For this, in a known method of manufacturing vacuum devices, mainly vacuum condensers, comprising installing a unit with a getter into the opening of the housing, then sealing the connection point and pumping out operation, activating the getter, evacuating the device, activating the getter and vacuuming the device simultaneously, and overlapping the opening after the pumping operation, melting of a radially corrugated solder ring at a temperature of laziness at 10-20 ° C temperature leaching Activation of the getter.

FIG. 1 shows a drawing of an apparatus for implementing the proposed method for manufacturing vacuum devices, for example vacuum condensers; in fig. 2 is the same, view A in FIG. one.

Claims (1)

The device comprises a case of a vacuum condenser 1, a stand 2, an evacuation device 3, a plug 4, a gas absorber 5, a corrugated solder ring 6, a hood of a vacuum furnace 7, a high-voltage input 8. In FIG. 2 shows the location of the radially corrugated solder joint between the cap of the getter unit and the condenser case; The implementation of the proposed method of making vacuum capacitors is carried out as follows. A vacuum-tight metal-dielectric case of a capacitor 1 without a traditional stem, assembled with internal fittings according to generally accepted technology, is installed on a stand 2 of an evacuation device 3. On the case of a capacitor 1, a radially corrugated ring solder 6. A cap 4 with a gas-filler 5 is installed on the ring of the solder 6. Then the hood of the vacuum furnace 7 is let in until it is intimate contact with the plate of the evacuating device VA 3 and include pumping system of the device. Due to the fact that a technological gap is provided between the case of the condenser 1 and the plug 4 with a corrugated ring of solder 6, the internal volume of the condenser is pumped out (The direction of movement of the evacuated gases is shown in Fig. 1 by arrows). After the required vacuum has been reached, the vacuum furnace is turned on and the condenser is annealed at a given temperature, and also trained by high voltage using a high-voltage bushing 8. Next, a further temperature increase is performed with continuous pumping until the corrugated solder 6 melts. , simultaneously with the heating of the melt before its melting, the getter 5 is activated. After the solder is melted, the plug 4 with the getter 5 under its own weight lowers to the condenser body 1; blocking the exhaust port, and soldering to this enclosure, providing a tight sealing of the internal volume of the capacitor. The getter 5, heated to the melting point of the solder (at 10 ~ 20 ° C above its optimal activation temperature), continues to absorb the remaining gases in the bulk of the condenser. The condenser cools to room temperature, after which it is removed from the cap of the vacuum furnace. Simplification of the method consists in that the manufacturing process of manufacturing a vacuum condenser eliminates the manufacturing and installation of a false cap, the operation of shading the vacuum-filled casing, repeated operations of soldering, pumping out, training, and the operation of activating the getter absorbing with the operation of sealing the condenser's bore. Combination of operations is achieved due to simultaneous heating of the gas absorber and the radially corrugated solder cat, which is located between the cap with the gas absorber and the condenser case, and having a melting point 10-20 ° C higher than the optimum activation temperature of the gas absorber. Thus, the proposed method for the manufacture of vacuum devices eliminates the disadvantages of the known method for manufacturing vacuum devices, which makes it possible to simplify and shorten the technological cycle of their manufacture. The method is considered on the example of its use for the manufacture of vacuum condensers. The invention method of manufacturing vacuum devices, mainly vacuum condensers, includes the operation of installing a unit with a getter in the opening of the housing, followed by sealing the junction and pumping operation, activating the getter, evacuating the device, different g & and the device is evacuated simultaneously, and the vacuum-tight overlap of the hole after the pumping operation is carried out By applying a radially corrugated solder ring at a melting temperature of 10–20 ° C above the temperature of the gas absorber. Sources of information taken into account during the examination 1. USSR Author's Certificate No. 765673, cl. And 01 9/38, 1975. To pumping system Vidl