SU651432A1 - Устройство дл прижима таблеточного полупроводникового прибора к охладителю - Google Patents

Устройство дл прижима таблеточного полупроводникового прибора к охладителю

Info

Publication number
SU651432A1
SU651432A1 SU762325411A SU2325411A SU651432A1 SU 651432 A1 SU651432 A1 SU 651432A1 SU 762325411 A SU762325411 A SU 762325411A SU 2325411 A SU2325411 A SU 2325411A SU 651432 A1 SU651432 A1 SU 651432A1
Authority
SU
USSR - Soviet Union
Prior art keywords
elastic element
semiconductor device
elastic
piston
cooler
Prior art date
Application number
SU762325411A
Other languages
English (en)
Russian (ru)
Inventor
Кафунек Павел
Райхл Павел
Ковар Йири
Покорны Олдрих
Кратина Йиндрих
Зуна Ярослав
Пелант Михал
Original Assignee
Чкд Прага, Оборовы Подник(Инопредприятие)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Чкд Прага, Оборовы Подник(Инопредприятие) filed Critical Чкд Прага, Оборовы Подник(Инопредприятие)
Application granted granted Critical
Publication of SU651432A1 publication Critical patent/SU651432A1/ru

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4081Compliant clamping elements not primarily serving heat-conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
SU762325411A 1975-02-24 1976-02-24 Устройство дл прижима таблеточного полупроводникового прибора к охладителю SU651432A1 (ru)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS119375A CS176675B1 (hu) 1975-02-24 1975-02-24

Publications (1)

Publication Number Publication Date
SU651432A1 true SU651432A1 (ru) 1979-03-05

Family

ID=5345717

Family Applications (1)

Application Number Title Priority Date Filing Date
SU762325411A SU651432A1 (ru) 1975-02-24 1976-02-24 Устройство дл прижима таблеточного полупроводникового прибора к охладителю

Country Status (6)

Country Link
CH (1) CH600570A5 (hu)
CS (1) CS176675B1 (hu)
DD (1) DD123251A1 (hu)
DE (1) DE2604070C3 (hu)
PL (1) PL97657B1 (hu)
SU (1) SU651432A1 (hu)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2721438B1 (fr) * 1994-06-21 1996-10-18 Jacques Daniel Lhomme Dispositif de serrage utilisable notamment pour les semi-conducteurs de puissance.

Also Published As

Publication number Publication date
DD123251A1 (hu) 1976-12-05
DE2604070A1 (de) 1976-09-09
PL97657B1 (pl) 1978-03-30
CH600570A5 (hu) 1978-06-15
DE2604070C3 (de) 1979-05-03
CS176675B1 (hu) 1977-06-30
DE2604070B2 (de) 1978-08-31

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