SU617196A1 - Apparatus for soldering and blanching with solder wave - Google Patents

Apparatus for soldering and blanching with solder wave

Info

Publication number
SU617196A1
SU617196A1 SU762315509A SU2315509A SU617196A1 SU 617196 A1 SU617196 A1 SU 617196A1 SU 762315509 A SU762315509 A SU 762315509A SU 2315509 A SU2315509 A SU 2315509A SU 617196 A1 SU617196 A1 SU 617196A1
Authority
SU
USSR - Soviet Union
Prior art keywords
wave
soldering
solder
blanching
inductor
Prior art date
Application number
SU762315509A
Other languages
Russian (ru)
Inventor
Георгий Ялмарович Иукканен
Александр Васильевич Ципий
Юрий Моисеевич Гельфгат
Original Assignee
Специальное Конструкторское Бюро Магнитной Гидродинамики Ан Латвийской Сср
Институт физики АН Латвийской ССР
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Специальное Конструкторское Бюро Магнитной Гидродинамики Ан Латвийской Сср, Институт физики АН Латвийской ССР filed Critical Специальное Конструкторское Бюро Магнитной Гидродинамики Ан Латвийской Сср
Priority to SU762315509A priority Critical patent/SU617196A1/en
Application granted granted Critical
Publication of SU617196A1 publication Critical patent/SU617196A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

(54) УСТРОЙСТВО ДЛЯ ПАЙКИ И ЛУЖЕНИЯ(54) DEVICE FOR SICK AND TREATMENT

ВОЛНОЙ ПРИПОЯ 12WAVE solder 12

чину электромагнитной силы, создающей напор в камерах 2, можно регулировать перемещением пластин 5 в направлении, .перпендикул рном к продольной оси индуктора 4.The order of the electromagnetic force creating a head in the chambers 2 can be adjusted by moving the plates 5 in the direction perpendicular to the longitudinal axis of the inductor 4.

Благодар  раздельному соединению камер 2, а также наличию отдельных дл  каждой камеры пластин 6, напор в одной из камер регулируетс  независимо от напора в другой .Due to the separate connection of chambers 2, as well as the presence of plates 6, which are separate for each chamber, the head in one of the chambers is regulated independently of the head in the other.

Claims (2)

Формула изобретени Invention Formula I. Устройство дл  пайки и лужени  волной прило , преимущественно дл  пайки печатных плат, содержащее ванну с припоем, электромагнитный на1гаетатель со средствами формировани  волн при1по  с двум  соллами, о тличающеес  тем, что, с целью независимого регулировани  высоты волны припо , средства дл  формировани  волн припо  выполнены в виде двух герметичных камер с размеЩеннымИ внутри них соплами, соединенными с ванной, а нагнетатель выполнен вI. Device for wave soldering and wave application, mainly for soldering printed circuit boards, containing a solder bath, an electromagnetic charger with two-salt wave-forming means, which, in order to independently adjust the height of the solder wave, means for wave formation Solder is made in the form of two hermetic chambers with spaced inside them with nozzles connected to the bathtub, and the blower is made in виде индуктора бегущего магнитного пол  сas an inductor running magnetic field with пластиной, расположенной над индуктором иplate located above the inductor and установленной с возможностью перемещени .movable. 2. Устройство по п. 1, отличающеес 2. The device according to claim 1, characterized by тем, что пластина выполнена из ферромагнитного .материала.the fact that the plate is made of ferromagnetic material. Источники информации, прин тые во внимание при экспертизе:Sources of information taken into account in the examination: 1 Авторское свидетельство СССР №490589, кл. В 23 К 3/06, 05.02.Ш71.1 USSR Author's Certificate No. 490589, cl. At 23 K 3/06, 05.02.Sh71. 2. Авторское свидетельство СССР № 395197, кл. В 23 К 3/06, 22.10.71.2. USSR author's certificate number 395197, cl. At 23 K 3/06, 10/22/71.
SU762315509A 1976-01-19 1976-01-19 Apparatus for soldering and blanching with solder wave SU617196A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU762315509A SU617196A1 (en) 1976-01-19 1976-01-19 Apparatus for soldering and blanching with solder wave

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU762315509A SU617196A1 (en) 1976-01-19 1976-01-19 Apparatus for soldering and blanching with solder wave

Publications (1)

Publication Number Publication Date
SU617196A1 true SU617196A1 (en) 1978-06-30

Family

ID=20646007

Family Applications (1)

Application Number Title Priority Date Filing Date
SU762315509A SU617196A1 (en) 1976-01-19 1976-01-19 Apparatus for soldering and blanching with solder wave

Country Status (1)

Country Link
SU (1) SU617196A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4568012A (en) * 1982-01-14 1986-02-04 Toshiba Seiki Co., Ltd. Soldering apparatus
US4651916A (en) * 1983-09-09 1987-03-24 Dolphin Machinery Limited Soldering apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4568012A (en) * 1982-01-14 1986-02-04 Toshiba Seiki Co., Ltd. Soldering apparatus
US4651916A (en) * 1983-09-09 1987-03-24 Dolphin Machinery Limited Soldering apparatus

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