SU572951A1 - Device for cooling radio components - Google Patents
Device for cooling radio componentsInfo
- Publication number
- SU572951A1 SU572951A1 SU7402070087A SU2070087A SU572951A1 SU 572951 A1 SU572951 A1 SU 572951A1 SU 7402070087 A SU7402070087 A SU 7402070087A SU 2070087 A SU2070087 A SU 2070087A SU 572951 A1 SU572951 A1 SU 572951A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- cooling
- radio components
- elements
- cooling radio
- radiators
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
1one
Изобретение относитс к устройствам охлал дени радиоэлектронной апнаратуры и используетс дл обеспечени необходимых температурных режимов высокоинтегральных элементов, рассеиваюш,их значительные мощности .The invention relates to a device for cooling electronic equipment and is used to provide the necessary temperature regimes of the high-integral elements, scattering their considerable powers.
Известны устройства дл охлаждени элементов радиоаппаратуры, представл ющие собой единую теплоотвод щую поверхность, выполненную в виде камеры из эластичного теплопроводного материала, внутри которой циркулирует под давлением охлаждающа жидкость. Камера находитс в корпусе, имеющем специальные окна, напротив этих окон при сборке радиоэлектронного устройства устанавливаютс интегральные схемы, к корпусам которых прижимаетс эластична теплопроводна поверхность камеры 1.Devices are known for cooling radio equipment elements, which are a single heat-removing surface made in the form of a chamber of elastic heat-conducting material, inside of which a cooling liquid circulates under pressure. The camera is located in a case that has special windows; in front of these windows, when assembling an electronic device, integrated circuits are installed, to the cases of which the elastic heat-conducting surface of chamber 1 is pressed.
Недостаток известных устройств заключаетс в невозможности создани усили прижима большой величины, которое обеспечивает приемлемые характеристики теплового перехода дл высокоинтегральных элементов.A disadvantage of the known devices is the impossibility of creating a large amount of clamping force that provides acceptable thermal transition characteristics for high-integral elements.
С целью повышени эффективности тепловых переходов радиаторы - пластина - элементы , в предлагаемом устройстве дл охлаждени элементов радиоаппаратуры, состо щем из трубопроводов с хладагентом и радиаторов , каждый из которых выступает одним концом в трубопровод через выполненные вIn order to increase the efficiency of thermal transitions, radiators - a plate - elements, in the proposed device for cooling radio components, consisting of refrigerant pipelines and radiators, each of which protrudes at one end into the pipeline through
стенке труоопровода отверсти , а другим размещен на поверхности тецлоотвод щей пластины , жестко закрепленной на основании и контактирующей с поверхностью охлаждаемых радиоэлементов, каждый радиатор снабжен охватывающим его сильфоном, один конец каждого из которых герметично закреплен на стенке трубопровода по периметру отверсти , а другой - на размещенном на теплоотвод щей пластине конце радиатора, причем радиатор размещен на теплоотвод щей пластине подвижно.the wall of the pipe is bore, and the other is placed on the surface of the end-plate, rigidly fixed on the base and in contact with the surface of the cooled radio elements, each radiator is equipped with a bellow covering it, one end of each of which is hermetically fixed on the wall of the pipeline along the perimeter of the hole and the other on the placed on the heat sink plate of the end of the radiator, the radiator being placed on the heat sink plate movably.
На фиг. 1 дана схема предлагаемого устройства; на фиг. 2 - разрез по А-А на фиг. 1.FIG. 1 is a diagram of the proposed device; in fig. 2 is a section along A-A in FIG. one.
Устройство дл охлаждени элементов радиоаппаратуры содержит трубопровод 1 с хладагентом и радиаторы 2, предназначенные дл охлаждени элементов 3. Каждый из радиаторов одним концом в трубопровод 1 через расположенные в его стенке отверсти , шаг которых выполнен в соответствии с тагом установки элементов 3 на печатной плате 4, а другим размещен на поверхности теплоотвод щей пластины 5, жестко закрепленной на основании и контактирующей с поверхностью охлал даемых радиоэлементов . Радиаторы 2 снабжены охватывающими их спльфонами 6, один конец каждого из этих сильфонов герметично закреплен наThe device for cooling the radio equipment contains a refrigerant piping 1 and radiators 2 for cooling the components 3. Each radiator has one end to the pipeline 1 through openings located in its wall, the pitch of which is made in accordance with the installation tag of the elements 3 on the printed circuit board 4, and the other is placed on the surface of the heat sink plate 5, rigidly fixed on the base and in contact with the surface of the cooled radio elements. Radiators 2 are provided with splofona 6 enclosing them, one end of each of these bellows is hermetically fastened to
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU7402070087A SU572951A1 (en) | 1974-10-24 | 1974-10-24 | Device for cooling radio components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU7402070087A SU572951A1 (en) | 1974-10-24 | 1974-10-24 | Device for cooling radio components |
Publications (1)
Publication Number | Publication Date |
---|---|
SU572951A1 true SU572951A1 (en) | 1977-09-15 |
Family
ID=20599206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU7402070087A SU572951A1 (en) | 1974-10-24 | 1974-10-24 | Device for cooling radio components |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU572951A1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4884167A (en) * | 1987-11-09 | 1989-11-28 | Nec Corporation | Cooling system for three-dimensional IC package |
US4942497A (en) * | 1987-07-24 | 1990-07-17 | Nec Corporation | Cooling structure for heat generating electronic components mounted on a substrate |
US4945980A (en) * | 1988-09-09 | 1990-08-07 | Nec Corporation | Cooling unit |
US4975766A (en) * | 1988-08-26 | 1990-12-04 | Nec Corporation | Structure for temperature detection in a package |
US5014777A (en) * | 1988-09-20 | 1991-05-14 | Nec Corporation | Cooling structure |
US5023695A (en) * | 1988-05-09 | 1991-06-11 | Nec Corporation | Flat cooling structure of integrated circuit |
US5036384A (en) * | 1987-12-07 | 1991-07-30 | Nec Corporation | Cooling system for IC package |
DE4312057A1 (en) * | 1993-04-13 | 1993-10-14 | Siegmund Maettig | Arrangement for cooling highly integrated multi=chip modules for data processing systems with high computing power - contains cooling plate and mechanical heat transfer devices, covering and sealing elastic plate |
DE4327895A1 (en) * | 1993-08-19 | 1995-02-23 | Abb Management Ag | Power converter module |
DE4330618A1 (en) * | 1993-09-09 | 1995-03-16 | Bayerische Motoren Werke Ag | Cooling device for a battery charger and an on-board electrical system converter in electric vehicles |
-
1974
- 1974-10-24 SU SU7402070087A patent/SU572951A1/en active
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4942497A (en) * | 1987-07-24 | 1990-07-17 | Nec Corporation | Cooling structure for heat generating electronic components mounted on a substrate |
US4884167A (en) * | 1987-11-09 | 1989-11-28 | Nec Corporation | Cooling system for three-dimensional IC package |
US5036384A (en) * | 1987-12-07 | 1991-07-30 | Nec Corporation | Cooling system for IC package |
US5023695A (en) * | 1988-05-09 | 1991-06-11 | Nec Corporation | Flat cooling structure of integrated circuit |
US4975766A (en) * | 1988-08-26 | 1990-12-04 | Nec Corporation | Structure for temperature detection in a package |
US4945980A (en) * | 1988-09-09 | 1990-08-07 | Nec Corporation | Cooling unit |
US5014777A (en) * | 1988-09-20 | 1991-05-14 | Nec Corporation | Cooling structure |
DE4312057A1 (en) * | 1993-04-13 | 1993-10-14 | Siegmund Maettig | Arrangement for cooling highly integrated multi=chip modules for data processing systems with high computing power - contains cooling plate and mechanical heat transfer devices, covering and sealing elastic plate |
DE4327895A1 (en) * | 1993-08-19 | 1995-02-23 | Abb Management Ag | Power converter module |
DE4330618A1 (en) * | 1993-09-09 | 1995-03-16 | Bayerische Motoren Werke Ag | Cooling device for a battery charger and an on-board electrical system converter in electric vehicles |
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