SU558037A1 - Aqueous solution for etching copper and its alloys - Google Patents

Aqueous solution for etching copper and its alloys

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Publication number
SU558037A1
SU558037A1 SU2199187A SU2199187A SU558037A1 SU 558037 A1 SU558037 A1 SU 558037A1 SU 2199187 A SU2199187 A SU 2199187A SU 2199187 A SU2199187 A SU 2199187A SU 558037 A1 SU558037 A1 SU 558037A1
Authority
SU
USSR - Soviet Union
Prior art keywords
aqueous solution
alloys
ferric chloride
triethanolamine
film
Prior art date
Application number
SU2199187A
Other languages
Russian (ru)
Inventor
Альбина Борисовна Ситник
Леонид Израилевич Аскадский
Геннадий Степанович Дубков
Анна Ивановна Нор
Борис Игнатьевич Кочин
Людмила Николаевна Смоктий
Ираида Александровна Денега
Original Assignee
Украинский Научно-Исследовательский Институт Полиграфической Промышленности
Всесоюзный Научно-Исследовательский Институт Гознака
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Украинский Научно-Исследовательский Институт Полиграфической Промышленности, Всесоюзный Научно-Исследовательский Институт Гознака filed Critical Украинский Научно-Исследовательский Институт Полиграфической Промышленности
Priority to SU2199187A priority Critical patent/SU558037A1/en
Application granted granted Critical
Publication of SU558037A1 publication Critical patent/SU558037A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Description

(54) ВОДНЫЙ РАСТВОР ДЛЯ ТРАВЛЕНИЯ МЕДИ И ЕЕ СПЛАВОВ(54) AQUEOUS SOLUTION FOR PROMOVING THE COPPER AND ITS ALLOYS

1one

Изобретение относитс  к химической обработке металлов, в частности, к травлению меди и ее сплавов.This invention relates to the chemical treatment of metals, in particular, to the etching of copper and its alloys.

Наиболее близким к описываемому изобретению по технической сущности и достигаемому результату  вл етс  раствор дл  химической обработки меди и ее силавов, содержащий хлорное железо, пленкообразующий компонент , например этилептиомочевину, и органическую кислоту алифатического р да, например аскарбиповую 1.The closest to the described invention to the technical essence and the achieved result is a solution for chemical processing of copper and its salts, containing ferric chloride, a film-forming component, for example, ethylethiourea, and an organic acid of aliphatic series, for example, ascarbipic 1.

Однако в указанном растворе происходит значительное подтравливание боковых граней рельефных элементов. И, кроме того, он нестабилен в работе.However, in this solution a significant undercutting of the side faces of the relief elements occurs. And besides, he is unstable in work.

Целью насто щего изобретени   вл етс  снижение бокового иодтравливани  рельефных элементов.The object of the present invention is to reduce the lateral iodotraying of the relief elements.

. Эта цель достигаетс  тем, что раствор на основе хлорного железа в качестве пленкообразующего компонента п органической кислоты алифатического р да содержит соответственно триэтаноламин п щавелевую кислоту при следующем соотнощении компонентов.. This goal is achieved by the fact that the ferric chloride-based solution as a film-forming component of organic acid of the aliphatic series contains, respectively, triethanolamine and oxalic acid at the following ratio of components.

вес. %:weight. %:

Хлорное железо Ferric chloride

35-40 Триэтаноламин 0,05-0,1 Щавелева  кислота 35-40 Triethanolamine 0.05-0.1 oxalic acid

10-20 Остальное. Вода10-20 Else. Water

Основное преимущество нредложенного раствора заключаетс  в том, что он стабилен в работе в течение длительного времени, в св зи с чем процесс травлени  в насто щем растворе без корректировки (до истощени  раствора) быть возобновлен в любой момент.The main advantage of the proposed solution is that it is stable in operation for a long time, and therefore the etching process in the present solution without correction (before depletion of the solution) can be resumed at any time.

%1II% 1II

40404040

10101010

0,050,10.050.1

ОстальноеRest

IЦЦICC

600600500600600500

333333333333

202020202020

510550320510550320

3-5 Стремитс 10-203-5 Stremits 10-20

к 0° to 0 °

Claims (1)

Формула изобретени Invention Formula Водный раствор дл  размерного травлени  меди и ее силавов, содержащий хлорное железо , пленкообразующий компонент и органическую кислоту алифатического р да, отличающийс  тем, что, с целью снижени  бокового подтравливани  рельефных элементов, он в качестве пленкообразующего компонента и органической кислоты алифатического р да содержит соответственно триэтаноламин и щаIIIAn aqueous solution for size etching of copper and its silicates, containing ferric chloride, a film-forming component and an organic acid of the aliphatic series, characterized in that, in order to reduce lateral etching of the relief elements, it contains, respectively, the triethanolamine as the film-forming component and the organic acid of the aliphatic series and III 35 10 0,0535 10 0.05 велевую кислоту при сл компонентов, вес. %:velevuyu acid at sl components, weight. %: Хлорное железо Триэтаноламин Щавелева  кислота ВодаFerric chloride Triethanolamine Oxalic acid Water Источники информации, прин тые во внимание при экспертизеSources of information taken into account in the examination 10 1. Патент США № 3458371, кл. 156-14, 1969.10 1. US Patent No. 3458371, cl. 156-14, 1969.
SU2199187A 1975-10-30 1975-10-30 Aqueous solution for etching copper and its alloys SU558037A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU2199187A SU558037A1 (en) 1975-10-30 1975-10-30 Aqueous solution for etching copper and its alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU2199187A SU558037A1 (en) 1975-10-30 1975-10-30 Aqueous solution for etching copper and its alloys

Publications (1)

Publication Number Publication Date
SU558037A1 true SU558037A1 (en) 1977-05-15

Family

ID=20640381

Family Applications (1)

Application Number Title Priority Date Filing Date
SU2199187A SU558037A1 (en) 1975-10-30 1975-10-30 Aqueous solution for etching copper and its alloys

Country Status (1)

Country Link
SU (1) SU558037A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5807493A (en) * 1995-08-01 1998-09-15 Mec Co., Ltd. Microetching method for copper or copper alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5807493A (en) * 1995-08-01 1998-09-15 Mec Co., Ltd. Microetching method for copper or copper alloy

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