SU551350A1 - The composition - Google Patents

Description

(54) COMPOSITION

This invention relates to the preparation of epoxy compounds based on epoxy resins and aminocyclophosphazenes.

Modern technology requires synthetic materials with increased strength, heat and heat resistance. The most important among them are materials based on pressure-sensitive resins, and in particular epoxy.

In order to increase the heat, heat, and flame retardant epoxy resins, cyclophosphazenes are used, including chlorine and aminocyclophosphazenes 1,3.

There is also known a method for curing epoxylibix resins by polymerization under the action of catalytic amounts of aminocyclotriphosphazenes (5-10 parts by weight of ACF per 100 parts by weight of epoxy resin) 2.

Famous compositions have their advantages and disadvantages. For example, materials that include cyclophosphazenes 3 have high heat resistance, reduced flammability and high dielectric properties, but lower heat resistance and a greater thermal effect during curing than materials obtained by polymerization {2. For the latest materials characteristic

high viability (at least 1 year) and low exothermicity of the curing process. According to the complex of physicomechanical and geshto-physicochemical properties, the materials obtained by polymerization 2 are not inferior to materials from the well-known commandeer 13.

However, the compressive strengths of materials that have been irradiated at most weighted composites do not exceed 1700 kgf / cm, while the technique requires polymers with high compressive strength.

. The purpose of the invention is to obtain materials with higher compressive strength based on certain types of epoxy resins and aminocyclophosphazenes.

According to the invention, an epoxy resin compaction is proposed which is a resorcinol diglycidyl ether containing epoxy groups (28-33%) and a viscosity of 800 spz (e.g., RES-3 epoxy resin), and 2,2-diamino-4, 4,6,6-tetrachloro-cyclotriphosphazene (ACCF), taken in an amount of 00 and 18-22 (better than 20), parts by weight, respectively, after compression, have a compressibility of 3000 kgf / cm. Introduction of AHTsF in quantity.

less than 18 weight.h. or more than 22 parts by weight, reduces the strength of the material.

The proposed composition does not lose the advantages inherent in the materials of Composition 3 in terms of technological and mechanical parameters: it also has a high durability at a new temperature (not less than 1 year), is low viscosity and is not inferior in other indicators of known materials by basis

epoxy resin and ACF.

 The outcome of the RES-3 resin (pilot industrial production of RPO Plastpolymer) is a low-viscosity liquid with an epoxy content of 29–30%.

2,2-diamino-4,46,6-tetrachlorocyclo triphosphazane (AHTFC) of the general formula PsNjCU (NN2) 2 and the structure:

"V /

.

I I.-NH2

C1 C1

/

W {

is a white crystalline substance with a melting point of 162 ° C (with decomposition) ..

Composition based on epoxy resin of the brand RES-3 (100 parts by weight) and AHTsF (18-22 parts by weight)

Example, 100 parts by weight of epoxy resorcinol resin brand RES-3 is mixed with 18 parts by weight. 2,2-diamino-4,4,6,6-tetrachloro-cyclotriphosphazene at 60 ° C for 20 minutes to obtain a single clear liquid and poured into molds. It is cured in the following mode: 80 ° С - 5 h, 00 ° С-10h, 20 ° С-5h, 160С-5ч 180 ° С- 10h. The properties of the cured material are given in table.

PRI mme R 2. 100 weight.h. epoxy resorption New resin brand is mixed with 22 parts by weight. 2,2 diamino-4, 4,6,6 - to a trekhlortsiklotrifofaza -

prepared by blending prn 60-70 ° C for 30 minutes with mixing until a homogeneous, low viscosity transparency of the liquid is obtained, which after cooling can be stored in

uncured state without change of state of aggregation during the year. The uncured composition is soluble in alcohols, KeTOHaXj aromatic hydrocarbons, and a number of other organic solvents.

The composition is cured after it is poured into molds in a stepwise mode: 80 ° C - 5 hours; 100 ° e - 5 h; 120 ° C - 5 h; 160 ° C - 5 hours and finally at 180 ° C - 10 hours. Changing the curing mode, for example, a rapid increase in temperature, is unacceptable (decomposition of hardener is possible).

The proposed epoxy composition can be used as casting and impregnating compositions, liquid one-component adhesives, as well as binders for high-strength glass-reinforced plastics, possessing not only high compressive strength and heat resistance, but also lowered flammability.

Physical and mechanical properties of epoxy

resins, hardened by previously known methods, and the properties of the proposed composition based on epoxy-resorcin resin F3C-3 and AHTsF are presented in the table ..

on at 70 ° C for 30 minutes to obtain a uniform clear liquid and pour it into molds. Cured according to the mode specified in example 1. The material properties correspond to the properties of example 1.

: Sample. 100 weight.h. Epoxy-resin resin brand RES-3 is mixed with 20 weight.h. 2,2diaminr - 4,4,6,6 - tetrachlorocyclo triphosphase at 80 ° C for 25 minutes. until a homogeneous clear low-viscosity liquid is obtained and poured into molds. Cure in the following mode: h, 00C - 0h, 120 ° C - 5 h, 160 ° C - 5 h

b

and 180 ° C 10h. The properties of the cured material are given in table.

 Formula of invention

A composition containing an epoxy otgagomer and 2,2-daamino-4,4,6,6-tetrachloro-cyclotriphosphazene, which is the fact that, in order to improve the physicomechanical properties of the composition: the following ratio of components (oars.)

Diglycidyl ester resorcinol100

2,2-Diamino-4,4, b, 6 t trachlorcyclotrifosfazene. 18-22

Sources of information taken into account in the examination:

1. USSR author's certificate N, 166825, M.Kp С 08 L 63 / 00,1964.

2. Authors certificate of the USSR RR 431196, M.C.C08 Q 59/40, 1974.

3. Patent of the GDR No. 311181, Cl. 39 in 22/10, 1964 (prototype).