SU525722A1 - Composition for conductive coatings - Google Patents

Description

(54) KGOSHGOZSCHRSH FOR CURRENT CONDUCTING COATINGS

one

The invention relates to polymeric materials with special electrical properties and can be used as antistatic and shielding coatings, for conductive circuits on panels made of dielectrics, as resistances and wires in printed circuits.

In the anticorrosion and compaction technology, when creating protective systems with special properties, there is a need for polymer coatings that have electrical conductivity.

Most economical and technological are considered polymer coatings obtained from powdered materials.

Conductive metal-filled compositions consisting of a polymeric binder and easily decomposing compounds of carbonates, such as carbonyls or C1 formate.

However, the formation of coatings from these compositions is accompanied by the release of gaseous products that impair the properties of the coatings. In addition, not all metals can be selected as easily available and inexpensive compounds that decompose at coating temperature.

MsBecTiai compositions for conductive coatings, including powder thermoplastic and metallic dashers fillers, such as silver 21, tin and nickel 3.

However, lead, tin, and aluminum are used less frequently than silver because of their rapid oxidation, which leads to a decrease in electrical power.

Also known are composites containing powdered thermoplastic and finely dispersed copper {4. And this composite has not enough high electrical conductivity.

The aim of the invention is to induce the electrical conductivity of the composition.

To achieve this goal, it is proposed to additionally introduce p-dioxmbenzene into the composition.

The composition of the composition, wt.%: LARGE te rmoplast15-27

. Finely dispersed copper 70-80

p-dioxybenzene3-5

Claims (4)

In the process of monolithization of coatings, Dloksh5enzene restores the oxide film on the surface of metal particles. as po chimerone oscio composition. holds thermotstastic polymers. } This product is a PM-1 brand copper powder, and p-dioxybenzene as an auxiliary substance. The composition is prepared by dry mixing the components in a grain mill. The method of introducing the excipient into the composition does not affect the electrical conductivity of the floor of the material. In the case of simple mixing of the components, the resulting material has the same resistance as when the metal filler is pretreated with an ether solution of p-dinox benol with the addition of polymer. Example. Four mixtures of components are prepared, each of which contains 75% by weight (or 25% by volume) of copper powder and differs from the other contents of pB-dioxane benzene (O, 1, 3, and 5% by weight), as well as the content of dispersed polyethylene high density, supplementing up to 100 weight,% composition of each mixture. The resulting compositions are applied to the aluminum foil by powder spraying in an electrostatic field. After melting of the coatings at 250 ° C, the electrical resistance of the coatings is measured and their specific volume electrical resistance is calculated. The resulting material has the specific characteristics given in this section. I Specific volumetric electrical resistance of coatings, ohm-cm 72, 31 21b 1-1 (As can be seen from the table, the optimal content of p-dioxybenzene is 3-5 weight.%, To increase it, the specific volumetric electrical resistance of coatings changes little Example 2 According to the procedure described in Example 1, two compositions are prepared based on a polymer of 3.3-bis- (chloromethyl) oxacylobutane (grade A pentaplast) with copper powder 75% by weight, and -dioxybeneol 345 wt.%. p v coatings formed at 240 ° C are 1.4-1 b and ohm "cm, respectively A. Example 3. The polymer binder is taken by; trifluorochlorostillene (fluoronolM), the content of copper powder is 80 wt.%, and p-dioxane benzene is 4 wt.%. Coatings deposited on aluminum foil are melted under npeccov at 270 ° C At a pressure of 30 kg / cm. Iloj einaie coatings have a Pv of 7.2–6.6 Thus, with optimum content of dissipation and MeiaiiieM content of metal, the proposed material has a lower electrical resistance than the known, moreover, quinah, resulting from oxidation. -recovery reaction in the polymer melt, in cmks with the unreacted part of the p-day (jsibeisol is an effective thermal and lightness & shizatorrm for polyolefies. Composition for T (liquid conductive coatings, including powdered thermoplastic and fine copper, which is so that, in order to increase the electrical conductivity of the compound, it contains p-dioxybe and air with a ratio of components, in wt.%, And powder: 80 p-Diox beneol3-5 Sources of information taken into consideration p {R1 exam: 1. Author's certificate of the USSR N 306156, M4SL.S09 d 5/10, 1969g. 2. US patent N "2774747, class 260-328, 1956. 3. US patent N "2280135, class 252-512, 1942 4. US patent N "2748099, class 260-37,1956, the (prototype).