SU430176A1 - COPPER BASED ALLOY - Google Patents
COPPER BASED ALLOYInfo
- Publication number
- SU430176A1 SU430176A1 SU1757323A SU1757323A SU430176A1 SU 430176 A1 SU430176 A1 SU 430176A1 SU 1757323 A SU1757323 A SU 1757323A SU 1757323 A SU1757323 A SU 1757323A SU 430176 A1 SU430176 A1 SU 430176A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- based alloy
- copper based
- copper
- alloy
- manganese
- Prior art date
Links
Landscapes
- Powder Metallurgy (AREA)
Description
II
Изобретение относитс к области разработки сплавов на основе меди, предназначенных дл лить микроироводов со специальными свойствами.The invention relates to the field of the development of copper-based alloys for pouring microirrods with special properties.
Известен сплав на основе меди, включающий марганец, кремний, алюминий, железо.Known alloy based on copper, including manganese, silicon, aluminum, iron.
Цель изобретени - повышение отрицательного температурного коэффициента сопротивлени .The purpose of the invention is to increase the negative temperature coefficient of resistance.
Дл этого предлагаемый сплав дополнительно содержит бор при следующем соотнощении компонентов, %:For this, the proposed alloy additionally contains boron at the following ratio of components,%:
Марганец10-16Manganese 10-16
Кремний0,2-1,5Silicon0,2-1,5
Алюминий0,05-0,2Aluminum0.05-0.2
Железо0,02-0,1Iron0.02-0.1
Бор0,2-0,8Bor0,2-0,8
МедьОстальное.Copper the rest.
Температурный коэффициент сопротивлени сплава равен -(1,0-1,5) 1/град.The temperature coefficient of resistance of the alloy is - (1.0-1.5) 1 / degree.
Предмет изобретени Subject invention
Сплав на основе меди, включающий марганец , кремний, алюминий, железо, отличающийс тем, что, с целью повышени отрицательного температурного коэффициента сопротивлени , он дополнительно содерл ит бор при следующем соотнощении компонентов, % A copper-based alloy, including manganese, silicon, aluminum, iron, characterized in that, in order to increase the negative temperature coefficient of resistance, it additionally contains boron at the following ratio of components,%
10-16 10-16
Марганец 0.2-1,5 Manganese 0.2-1.5
КремнийSilicon
Алюминий 0,05-0,2 0,02-0,1 Aluminum 0.05-0.2 0.02-0.1
Железо 0,2-0,8 Iron 0.2-0.8
Бор Остальное.Bohr Else.
МедьCopper
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1757323A SU430176A1 (en) | 1972-03-10 | 1972-03-10 | COPPER BASED ALLOY |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1757323A SU430176A1 (en) | 1972-03-10 | 1972-03-10 | COPPER BASED ALLOY |
Publications (1)
Publication Number | Publication Date |
---|---|
SU430176A1 true SU430176A1 (en) | 1974-05-30 |
Family
ID=20505954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU1757323A SU430176A1 (en) | 1972-03-10 | 1972-03-10 | COPPER BASED ALLOY |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU430176A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1473374A1 (en) * | 2003-04-30 | 2004-11-03 | Kiyohito Ishida | Copper alloy |
-
1972
- 1972-03-10 SU SU1757323A patent/SU430176A1/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1473374A1 (en) * | 2003-04-30 | 2004-11-03 | Kiyohito Ishida | Copper alloy |
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