SU399086A1 - A HEATING ELEMENT - Google Patents

Description

one

The invention relates to the field of radio engineering, in part, to devices with a teil connection.

Known heating elements, made in the form located on the substrate printed resistive tracks.

In order to provide a given law of power density distribution in the proposed heating element, the resistors are arranged concentrically one relative to another, and the distance between adjacent tracks is equal to their width.

FIG. 1 and 2 are given the design of two proposed heating elements; in fig. 3 - arrangement of heating elements for hybrid circuits; in fig. 4 - the same, single-chip circuits; in fig. 5 - addition of the laws of distribution of the power density of two elements of one device.

The heating element (Fig. 1) consists of several concentrically arranged resistive tracks 1 having a common contact pad 2 and contact pads 3 of each resistive track.

The distance of the resistive tracks from the center of the second element (Fig. 2) differs by the width of the resistive tracks of the first element. The heating elements in the hybrid version of the scheme (Fig. 3) are located on a common substrate 4 and create a localized

temperature spike near the elements.

In the center of the heater elements, temperature-sensitive components 5 are glued. With a single-crystal circuit (php. 4), the heating elements / are located on the common crystal 6 above the translucent components 7.

If it is necessary to ensure the distribution of the specific power over the heating element shown in FIG. 5, and with a dotted line, in the heating elements, the distribution of the specific MOSPHE is performed as shown in FIG. 56 and in, respectively.

At the same time, the air-sensitive components are combined in an electrical circuit (e.g., aa differential differential stages) implementing a combination of spgnals from two heating elements.

As a result of the output of the temperature-sensitive circuit, a signal is obtained that corresponds to: an equivalent power distribution in one heating element (Fig. 5, i).

In the harmonic signal mode, the variable components of the temperature, propagating from the resistors over the substrate or on the chip, are attenuated and undergo a shift in. At the location of the temperature sensitive component 5, the variable components of the temperature field create an

each resistor is added together.

Depending on the ratio of the amplitudes of the variable components, given by the law of the distribution of the specific power on the heating element, on the phase shift of each component, it is possible to obtain a different slope of the amplitude-frequency characteristic.

In the mode of a stepwise change in power in the heating element, the transient characteristics of the electric circuit are summed up by the transient characteristics of each resistor.

Depending on the distribution of specific power over the heating element, it is possible to obtain a different shape and transition characteristic.

PROBLEM AND 3 ABOUT AND

The heating element, mainly for devices with thermal coupling, made in the form of printed resistive tracks located on the substrate, characterized in that in order to impart a given distribution law of the specific power of the heating element, the resistive tracks are arranged concentrically one relative to another, and the distance between neighboring road1 ;; 1: .n; equal to their ishrin.

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