SU270940A1 - Photosensitive insulating varnish - Google Patents
Photosensitive insulating varnishInfo
- Publication number
- SU270940A1 SU270940A1 SU1203228A SU1203228A SU270940A1 SU 270940 A1 SU270940 A1 SU 270940A1 SU 1203228 A SU1203228 A SU 1203228A SU 1203228 A SU1203228 A SU 1203228A SU 270940 A1 SU270940 A1 SU 270940A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- photosensitive insulating
- insulating varnish
- rubber
- varnish
- adhesion
- Prior art date
Links
- 239000002966 varnish Substances 0.000 title description 5
- 239000004922 lacquer Substances 0.000 description 4
- 239000004641 Diallyl-phthalate Substances 0.000 description 3
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- OOORLLSLMPBSPT-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,3-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC(C(=O)OCC=C)=C1 OOORLLSLMPBSPT-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N Benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- 229920002601 Oligoester Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
Изобретение касаетс фоточу.вствительных электроизол ционных лаков на основе эноксидированных синтетических каучукОВ, примен емых в электронной промышленности при изготовлении многослойных печатных схем в .качестве межслойной фигурной изол ции.The invention relates to photo-sensitive electrically insulating varnishes based on enoxidized synthetic rubbers used in the electronics industry in the manufacture of multi-layer printed circuits in the quality of interlayer figure insulation.
Известны многочисленные виды электроизол ционных лаков ,на основе эпоксидированных каучуко.в, Модифицированных различными веществами, например кумароновыми, фенолформальдегиднымн смолами, олигоэфирами акрилового р да.Numerous types of electrical insulating varnishes are known, based on epoxidated rubber, Modified by various substances, such as coumarone, phenol formaldehyde resins, acrylic oligoesters.
Однако известные лаки имеют незначительную адгезию, не позвол ют осуществл ть контактную печать из-за небольшого промежутка времени, не дают изображений на рельефной поверхпости, недостаточно влагостойки, термостойки, а также малоэффективны электроизол ционные свойства.However, the known lacquers have a slight adhesion, do not allow contact printing due to a short period of time, do not give images on the relief surface, are not waterproof enough, are heat resistant, and also insulating properties are ineffective.
Целью насто щего изобретени вл етс устранение указанных недостатков, что достигаетс путем модификации эпоксидированного каучука р-полимерами диаллилфталата, диаллнлизофталата.The purpose of the present invention is to eliminate these drawbacks, which is achieved by modifying epoxidized rubber with p-polymers of diallyl phthalate, diallyl isophthalate.
Модификаци эпоксидированного синтетического каучука р-полнмерами диаллилфталата , дналлилизофталата з сочетании с другими комнонентами позвол ет получать химически стойкие стабильные пленки, допускающие все технологические операции процесса изготовлени печатных схем. КромеModification of epoxidized synthetic rubber with p-polmers of diallyl phthalate, diallisophthalate and combination with other components allows to obtain chemically resistant stable films that allow all the technological operations of the printed circuit manufacturing process. Besides
того, полученна лакова композици дает незначительную усадку в процессе отверждени , что особенно важно в процессе изготовлени многослойных печатных схем. Пример. Приготовлена лакова композици , котора обладает следующими свойствами: В зкость по вискозиметруIn addition, the resulting lacquer composition gives a slight shrinkage during the curing process, which is especially important in the process of making multilayer printed circuits. Example. A lacquer composition was prepared which has the following properties: Viscosity by viscometer
ВЗ-4, сек 25-40VZ-4, s 25-40
Разрешающа способность лака при толщине покрыти 40-45 мк, линий/см30-40Resolution of varnish with a coating thickness of 40-45 microns, lines / cm 30-40
Твердость по ма тниковомуTarmac hardness
прибору М-3 0,75- 0,8the device M-3 0,75- 0,8
Водопоглощение, %0,2Water absorption,% 0,2
Адгези лаковой пленки к медному проводнику, кг/см220-25.Adhesion of varnish film to copper conductor, kg / cm220-25.
Предмет изобретени Subject invention
Фоточувствительный электроизол ционный лак на основе эпоксидированного каучука с добавками инициаторов термо- и фотополимеризации , .пластификатора и модиф)икатора, отличающийс тем, что, с целью получени A photosensitive electrically insulating lacquer based on epoxidized rubber with the addition of thermal and photopolymerization initiators, a plasticizer and a modifier and an iatator, characterized in that, in order to obtain
рельефного покрыти на подложке и повышени его адгезии, механической .прочности и электроизол ционных свойств, в качестве модификатора применен р-ноли.мер диаллилфталата и (пт) диаллилизофталата в количествеembossed coating on the substrate and increasing its adhesion, mechanical strength and electrical insulating properties; as a modifier, p-nolimer of diallyl phthalate and (f) diallyl isophthalate in the amount of
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU270940A1 true SU270940A1 (en) |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2342407A1 (en) * | 1972-08-25 | 1974-03-07 | Ciba Geigy Ag | PROCESS FOR MANUFACTURING PRINTED MULTI-LAYER CIRCUITS |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2342407A1 (en) * | 1972-08-25 | 1974-03-07 | Ciba Geigy Ag | PROCESS FOR MANUFACTURING PRINTED MULTI-LAYER CIRCUITS |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20030129383A1 (en) | Liquid thermosetting resin composition, printed wiring boards and process for their production | |
| AU594644B2 (en) | A thermostable polymer system for microelectronic applications which can be cross-linked by irradiation | |
| US3914334A (en) | Flexible electrical insulating polymeric sheet | |
| US20040001961A1 (en) | Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry film | |
| EP1296188A2 (en) | Photosensitive resin composition and printed wiring board | |
| SU270940A1 (en) | Photosensitive insulating varnish | |
| JP2019133023A (en) | Photosensitive resin composition | |
| CN1689381A (en) | Method for the manufacture of printed circuit boards with integral plated resistors | |
| CN1238899A (en) | Method for adding layers to PWB which yields high levels of copper to dielectric adhesion | |
| US4243700A (en) | Method of rendering an ink strippable | |
| CN112020235A (en) | Method for manufacturing wiring board having protective film | |
| CN101336047B (en) | Method for printing circuit board and combination thereof | |
| EP0408629A1 (en) | Coating compositions | |
| US20030064304A1 (en) | Photosensitive resin composition and printed wiring board | |
| EP0623852B1 (en) | Resist compositions for circuit boards | |
| JP2934098B2 (en) | Photosensitive resin composition | |
| JP4573152B2 (en) | Photosensitive resin composition for printed wiring board production | |
| KR100199539B1 (en) | A fabrication method of multi-layer pcb | |
| US20080182025A1 (en) | Circuit board and manufacturing method of the same | |
| JPH10173336A (en) | Photosensitive additive adhesive composition | |
| JP2001288245A (en) | Flame-retardant active-energy-ray-curable resin, flame- retardant active-energy-ray-curable resin composition, printed circuit board, and multilayred printed circuit board | |
| KR101126537B1 (en) | Paste composition for polymer thick film registor and thick film registor fabrication method using the same | |
| JPH0983138A (en) | Method of manufacturing multi-layered printed wiring board | |
| JP2001075275A (en) | Active energy line-setting resin, photosensitive resin composition, and printed wiring board | |
| JPH1036682A (en) | Curing resin composition, production of multilayer printed wiring board therefrom, and multilayer printed wiring board produced thereby |