SU261965A1 - PASTE FOR METALIZATION OF CERAMIC PRODUCTS - Google Patents
PASTE FOR METALIZATION OF CERAMIC PRODUCTSInfo
- Publication number
- SU261965A1 SU261965A1 SU1150302A SU1150302A SU261965A1 SU 261965 A1 SU261965 A1 SU 261965A1 SU 1150302 A SU1150302 A SU 1150302A SU 1150302 A SU1150302 A SU 1150302A SU 261965 A1 SU261965 A1 SU 261965A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- paste
- ceramic products
- metalization
- ceramics
- molybdenum
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title description 6
- 238000001465 metallisation Methods 0.000 title description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N N#B Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 210000001503 Joints Anatomy 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- OWGOAJKLMXDFPQ-UHFFFAOYSA-N hydride;titanium(4+) Chemical compound [H-].[H-].[H-].[H-].[Ti+4] OWGOAJKLMXDFPQ-UHFFFAOYSA-N 0.000 description 1
- -1 molybdenum-manganese Chemical compound 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910000048 titanium hydride Inorganic materials 0.000 description 1
Description
Известна паста дл металлизации керамических изделий на основе молибдена и марганца не позвол ет получить надежные металлокерамические спаи, поскольку некоторые припои, например медь, легко проникают в металлизационный слой, наруша тем самым его св зь с керамикой.The known paste for the metallization of ceramic products based on molybdenum and manganese does not allow to obtain reliable cermet joints, since some solders, such as copper, easily penetrate into the metallization layer, thereby disrupting its connection with ceramics.
Описываема паста при температуре вжигани 1270-1350°С позвол ет получить прочные вакуумплотные спаи керамики с металлом , маловосприимчивые к режимам пайки.The described paste at a firing temperature of 1270–1350 ° C makes it possible to obtain strong vacuum-tight junctions of ceramics with metal, which are poorly susceptible to soldering regimes.
Зто достигаетс тем, что паста дополнительно содержит нитрид бора в количестве 2-15i /o по весу.This is achieved by the fact that the paste additionally contains boron nitride in an amount of 2-15i / o by weight.
Питрид бора может быть введен в молибдено-марганцевые пасты вместе с такими известными добавками, как гидрид титана, стекло и др.Pitride boron can be introduced into molybdenum-manganese pastes together with such well-known additives as titanium hydride, glass, etc.
Паста содержит в % по весу:Paste contains in% by weight:
Мп1,0-20,0MP1.0-20.0
BN2,0-15,0BN2.0-15.0
Моостальное.Moostalnoe.
Примен емые дл приготовлени пасты порошк И должны содержать не менее SSo/o зерен размером до 3 мкм.The powder used for the preparation of the paste must contain at least SSo / o grains up to 3 µm in size.
Введение нитрида бора в пасту преп тствует проникновению частиц припо в переходный слой, предотвраща разъединение металлоизоционного сло и повыша прочность сцеплени последнего с керамикой.The introduction of boron nitride into the paste prevents the penetration of solder particles into the transition layer, preventing separation of the metal-insulating layer and increasing the strength of adhesion of the metal with ceramics.
10ten
Предмет изобретени Subject invention
Паста дл металлизации керамических изделий на основе молибдена и марганца, отличающа с тем, что, с целью увеличени прочности спа , она доиолнительио содержит нитрид бора при следующем соотнощении компонентов в вес. A paste for the metallization of ceramic products based on molybdenum and manganese, characterized in that, in order to increase the strength of the spa, it contains additional boron nitride at the following ratio of components by weight.
1-20 1-20
Мп 2-15 BN МоMp 2-15 BN Mo
остальное.rest.
Publications (1)
Publication Number | Publication Date |
---|---|
SU261965A1 true SU261965A1 (en) |
Family
ID=
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6444271B2 (en) * | 1999-07-20 | 2002-09-03 | Lockheed Martin Corporation | Durable refractory ceramic coating |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6444271B2 (en) * | 1999-07-20 | 2002-09-03 | Lockheed Martin Corporation | Durable refractory ceramic coating |
US6749942B1 (en) | 1999-07-20 | 2004-06-15 | Lockheed Martin Corporation | Durable refractory ceramic coating |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4077888B2 (en) | Ceramic circuit board | |
KR100477866B1 (en) | Metal-Ceramic Composite Substrate, Method of Manufacturing the Same, and Soldering Materials Used in the Method | |
US7187083B2 (en) | Thermal interface material and solder preforms | |
Lu et al. | A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging | |
US4835593A (en) | Multilayer thin film metallurgy for pin brazing | |
SU261965A1 (en) | PASTE FOR METALIZATION OF CERAMIC PRODUCTS | |
JP3834351B2 (en) | Ceramic circuit board | |
JPS6146435B2 (en) | ||
EP1135348B1 (en) | Method for joining ceramic to metal | |
JP3887645B2 (en) | Manufacturing method of ceramic circuit board | |
JPH05148053A (en) | Ceramics-metal joined material | |
JP2797011B2 (en) | Joint of ceramics and metal and method for producing the same | |
WO2021106904A1 (en) | Graphene bonded body | |
JP4811661B2 (en) | Au-Sn alloy solder paste with less void generation | |
JPH05163078A (en) | Joint form made up of ceramic and metal | |
Shen et al. | Lead-free solder attach for 200° C applications | |
JPS6065776A (en) | Ceramic-metal composite mechanical part | |
JPH0597533A (en) | Composition for bonding ceramic-metal and bonded product of ceramic-metal | |
Chiu et al. | Solid-Liquid Interdiffusion Bonding between Ti/Ni/Ag/Sn Backside Metallized Si Chips and Cu/Al2O3-DBC Substrates with Au/Pd/Ni Surface Finish | |
JPH0816033B2 (en) | Composition of metallizing paste for silicon nitride and metallizing method using the same | |
JPH04285076A (en) | Paste brazing filler metal for joining ceramics | |
JPH05246769A (en) | Ceramic-metal joining composition and ceramic-metal joined body using the same | |
JPH0997865A (en) | Radiation part | |
JP4880830B2 (en) | Aluminum nitride substrate with metallized layer | |
JPH01119570A (en) | Ceramic-metal composite mechanical part |