SU179160A1 - METHOD OF ELECTROLYTIC DEPOSITION OF COPPER - Google Patents
METHOD OF ELECTROLYTIC DEPOSITION OF COPPERInfo
- Publication number
- SU179160A1 SU179160A1 SU933310A SU933310A SU179160A1 SU 179160 A1 SU179160 A1 SU 179160A1 SU 933310 A SU933310 A SU 933310A SU 933310 A SU933310 A SU 933310A SU 179160 A1 SU179160 A1 SU 179160A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- copper
- electrolyte
- electrolytic deposition
- hexametaphosphate
- deposition
- Prior art date
Links
- 239000003792 electrolyte Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- SZGVJLCXTSBVKL-UHFFFAOYSA-H 2,4,6,8,10,12-hexaoxido-1,3,5,7,9,11-hexaoxa-2$l^{5},4$l^{5},6$l^{5},8$l^{5},10$l^{5},12$l^{5}-hexaphosphacyclododecane 2,4,6,8,10,12-hexaoxide Chemical compound [O-]P1(=O)OP([O-])(=O)OP([O-])(=O)OP([O-])(=O)OP([O-])(=O)OP([O-])(=O)O1 SZGVJLCXTSBVKL-UHFFFAOYSA-H 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L Copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 229920000388 Polyphosphate Polymers 0.000 claims description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N edta Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 3
- 229940005740 hexametaphosphate Drugs 0.000 claims description 3
- 239000001205 polyphosphate Substances 0.000 claims description 3
- 235000011176 polyphosphates Nutrition 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- KEAYESYHFKHZAL-UHFFFAOYSA-N sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- GCLGEJMYGQKIIW-UHFFFAOYSA-H Sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 description 2
- 235000019982 sodium hexametaphosphate Nutrition 0.000 description 2
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 2
- 241000252203 Clupea harengus Species 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J Pyrophosphate Chemical class [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- ZGTMUACCHSMWAC-UHFFFAOYSA-L disodium;2-[2-[carboxylatomethyl(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetate Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-L oxalate Chemical compound [O-]C(=O)C([O-])=O MUBZPKHOEPUJKR-UHFFFAOYSA-L 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Description
Изобретение относитс к электролитическому осаждению меди из полифосфатного электролита на железо и сталь.This invention relates to the electrolytic deposition of copper from a polyphosphate electrolyte on iron and steel.
Известны различные способы осаждени меди из не довитых пирофосфатных, щавелевокислых и других электролитов. Однако их нельз широко использовать, так как эти электролиты неустойчивы в работе, отличаютс сравнительно невысокой рассеивающей способностью и допускают при электролизе небольшие плотности тока. Цель предлагаемого - получить мелкокристаллические осадки меди, хорошо сцепленные с основным л1еталлом , из безвредного вполне доступного и устойчивого электролита. Дл этого в состав электролита в качестве комплексообразовател ввод т один из полифосфатов, например гексаметафосфат натри . Предложенный электролит содержит (в г/л): меди сериокислой 50, гексаметафосфата натрн 370 н трилона Б 0,5-1,5. Процесс меднени ведут при комнатной температуре и плотности тока от 0,5 до 2,0 а/дм. При повышеиин температуры до 60°С и перемешивании электролита плотность тока можно повысить от 3,5 до 4,0 а/дм-. Various methods are known for the deposition of copper from unsaturated pyrophosphate, oxalate, and other electrolytes. However, they cannot be widely used, since these electrolytes are unstable in operation, differ in their relatively low scattering ability, and allow small current densities during electrolysis. The goal of the proposed project is to obtain fine crystalline copper deposits, which are well coupled with the main metal, from a harmless, quite affordable and stable electrolyte. For this purpose, one of polyphosphates, for example sodium hexametaphosphate, is introduced into the electrolyte as a complexing agent. The proposed electrolyte contains (in g / l): copper seriocarbon 50, hexametaphosphate natrn 370 n Trilon B 0.5-1.5. The copper plating process is carried out at room temperature and a current density of from 0.5 to 2.0 a / dm. With elevated temperatures up to 60 ° C and stirring of the electrolyte, the current density can be increased from 3.5 to 4.0 A / dm-.
Методика приготовлени электролита очеиь проста. В раствор гексаметафосфата натри ввод т сернокислую медь либо раствор ее и рЫ электролита довод т до 7,0 добавлениемThe electrolyte preparation method is very simple. Copper sulfate is introduced into the solution of sodium hexametaphosphate or its solution, and the PX electrolyte is adjusted to 7.0 by adding
едкого натра. Затем в раствор ввод т трилон Б (двунатриева соль этилендиаминтетрауксусной кислоты) и фильтруют.caustic soda. Then, Trilon B (ethylenediaminetetraacetic acid disodium salt) is introduced into the solution and filtered.
Проведенные исследовани показали, что покрыти , полученные по предложенному способу, отличаютс однородной мелкозернистой структурой и, начина с 7-10 мк, беспористы . Рассеивающа способность электролита равна 28-30% по Херингу и Блюму. Катодный выход по току составл ет 96-98%. При плотности тока 1,5 а/дм в течение 30 лшн толщина покрыти достигает 16-22 мк.Studies have shown that the coatings obtained by the proposed method have a homogeneous fine-grained structure and, starting with 7-10 microns, are non-porous. The scattering power of the electrolyte is 28–30% according to Hering and Blume. Cathode current efficiency is 96-98%. At a current density of 1.5 a / dm for 30 hours, the coating thickness reaches 16-22 microns.
Предмет изобретени Subject invention
Claims (2)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU179160A1 true SU179160A1 (en) |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2509832C2 (en) * | 2012-05-15 | 2014-03-20 | Сергей Сергеевич Моисеев | Method of electrolytic application of metal coatings |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2509832C2 (en) * | 2012-05-15 | 2014-03-20 | Сергей Сергеевич Моисеев | Method of electrolytic application of metal coatings |
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