SU1609751A1 - Low-melting conductive glass - Google Patents

Low-melting conductive glass Download PDF

Info

Publication number
SU1609751A1
SU1609751A1 SU894643878A SU4643878A SU1609751A1 SU 1609751 A1 SU1609751 A1 SU 1609751A1 SU 894643878 A SU894643878 A SU 894643878A SU 4643878 A SU4643878 A SU 4643878A SU 1609751 A1 SU1609751 A1 SU 1609751A1
Authority
SU
USSR - Soviet Union
Prior art keywords
low
electrically conductive
glass
soldering
temperature
Prior art date
Application number
SU894643878A
Other languages
Russian (ru)
Inventor
Николай Владимирович Петровых
Михаил Дмитриевич Лазарев
Борис Сергеевич Либенсон
Павел Иванович Литвинов
Анатолий Матвеевич Мечетин
Вера Эммануиловна Шишкина
Original Assignee
Предприятие П/Я Х-5382
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я Х-5382 filed Critical Предприятие П/Я Х-5382
Priority to SU894643878A priority Critical patent/SU1609751A1/en
Application granted granted Critical
Publication of SU1609751A1 publication Critical patent/SU1609751A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)

Abstract

Изобретение относитс  к составам легкоплавких электропроводных стекол, примен емых дл  спаивани  стекловолоконных планшайб и металлической оправки оптических окон электронно-оптических преобразователей, а также в качестве электропроводного покрыти  на стеклах титановой группы и высокоглиноземистой керамике в приборах электронной техники. С целью снижени  температуры спаивани  легкоплавкое электропроводное стекло имеет следующий состав, мас. % : P2O5 - 17-23The invention relates to compositions of low-melting electrically conductive glasses used to solder glass fiber faceplates and metal mandrels of optical windows of electron-optical converters, as well as an electrically conductive coating on titanium glass glasses and high-alumina ceramics in electronic devices. In order to reduce the temperature of soldering, low-melting electrically conductive glass has the following composition, wt. %: P 2 O 5 - 17-23

V2O5 50-53V 2 O 5 50-53

TEO2 1-8TEO 2 1-8

PBO 11-18PBO 11-18

MOO3 7-9. Температура спаивани  485-500°С, ТКЛР ((77-81).10-7К-1, электросопротивление 106 - 108 Ом.см. 2 табл.MOO 3 7-9. Soldering temperature 485-500 ° C, TCLE ((77-81) . 10 -7 K -1 , electrical resistance 10 6 - 10 8 Ohm. Cm. 2 tab.

Description

(Л(L

сwith

Изобретение относитс  к составам легкоплавких электропроводных стекол и предназначено дл  использовани  в электронной технике, в частности дл  спаивани  стекловолоконных nnatp шайб, и металлической оправки оптических окон электронно-оптических пре образователей, а также в качестве зле1 тропроврдного покрыти  на стеклах .титановой группы и высокоглино- земистой керамике в приборах электронной техники.The invention relates to compositions of low-melting electrically conductive glasses and is intended for use in electronic equipment, in particular for soldering glass fiber nnatp washers, and metal mandrel of optical windows of electron-optical converters, and also as an anti-conductive coating on titanium and high-alumina glasses. ceramics in electronic devices.

Цель изобретени  - снижение тем- пературы спаивани .The purpose of the invention is to reduce the temperature of soldering.

Предлагаемое стекло синтезируют из окислов, указанных компонентов, а дл  введени  используют его аммонийную соль (Ш4)зР04о Шихту загружают в корундовые тигли и вар т в СШ1ИТОВОЙ электропечи при 1000- . в течение О,5-1,0:ч. Расплав стекла гранулируют, вылива  его тонким слоем на массивную металлическую плиту и прокатыва  металлическим валком. Стеклогранул т измельчают в ; порошок дисперсностью / -2000 ,The proposed glass is synthesized from oxides of the indicated components, and its ammonium salt (Ш4) ЗР04о is used for the introduction of the mixture. The mixture is loaded into corundum crucibles and cooked in an SSH electric furnace at 1000-. within Oh, 5-1.0: h The glass melt is granulated by pouring it in a thin layer onto a massive metal plate and rolling it with a metal roller. Glass granules are ground into; powder dispersion / -2000,

Из стеклопорошка и органической св зки готов т пасту, которую нанос т на спаиваемые (или гразуруемые) поверхности деталей электронной техники . Спаивание (или глазурова ни еТ производ т при 490-500 С.A paste is prepared from glass powder and an organic binder, which is applied to the brazed (or groused) surfaces of electronic components. Soldering (or glazing is done at 490-500 C.

Конкретные составы стекол приведены в табл.1, в табл.2 приведены фкзико-химические свойства данных составов.Specific compositions of the glasses are given in Table 1, Table 2 shows the chemical and chemical properties of these compositions.

0505

о со елco have eaten

Ередлагаемый состав по сравнению с известным  вл етс  более легкоплав КИМ и менее токсичным, что позвол ет использовать его дл  спаивани  во локонно- оптических узлов лThe proposed composition, compared with the known, is a more lightly melted IMD and less toxic, which makes it possible to use it for soldering in the fiber-optic units

Форм, ула изобретени Form ula invention

Легкоплавкое электропроводное стекло, включающее УгО  МоОзFusible electrically conductive glass, including UHD MOOS

Температура разм гчени ,с 410Softening temperature, s 410

отличающеес  - тем, что, с целью снижени  температуры спаива-ч ни , оно дополнительно содержит ТеО- и РЬО при следующем соотношении ком понентов, мас«%:characterized by the fact that, in order to reduce the temperature of the solder, it additionally contains TeO- and PBO in the following ratio of components, wt%:

РгО 17-23ProW 17-23

VjPs-5О-58 МоОз7 9VjPs-5O-58 MOZ7 7

ТеОгН8TeOGN8

РЬр1И18Pyr1I18

Та б л и д. а I. .That b l and d. And I..

Таблица 2table 2

405405

395395

420420

415415

Claims (1)

Легкоплавкое электропроводное |θ стекло, включающее Р^О^·» УгО$> MoOj,Fusible electrically conductive | θ glass, including P ^ O ^ · »UGO $> MoOj, НИЯ, оно NII, it дополнительно содержит ТеОх additionally contains TeO x и РЬО при and po at ι следующем соотношении ком— ι the following ratio com понентов, Ponents мас»%: wt "%: Р205 P 2 0 5 17-23 17-23 50-58 50-58 M003 M003 7-9 7-9 Те02 Te0 2 1—8 1-8 РЬО Rio 11-18 11-18
Т а б л и ц ax 1Table A ax 1 Р2°5 P 2 ° 5 22 22 17 17 20 twenty 19 19 23 23 ТеО^. TeO ^. 1 one 8 8 8 8 1 one 5 5 V205 V 2 0 5 ' 50 ' fifty 50 fifty 53 53 58 58 53 53 РЬО Rio 18 eighteen 17 17 11 eleven 13 13 1 1 eleven Мо03 Mo0 3 9 9 8 8 8 8 7 7 8 8
Температура спаивания,°C lg PV, Ом-см ТКЛР,К' Температура размягчения, СSoldering temperature, ° C log PV, Ohm-cm TKLR, K 'Softening temperature, С 495 495 485 485 490 490 500 500 490 490 /7,6 / 7.6 8,0 8.0 7,0 7.0 6,8 6.8 6,3 6.3 79 79 81 81 80 80 77 77 78 78 410 410 405 405 395 395 420 420 415 415
Составитель:Г.БуровцеваCompiled by G. Burovtseva
SU894643878A 1989-01-30 1989-01-30 Low-melting conductive glass SU1609751A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU894643878A SU1609751A1 (en) 1989-01-30 1989-01-30 Low-melting conductive glass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU894643878A SU1609751A1 (en) 1989-01-30 1989-01-30 Low-melting conductive glass

Publications (1)

Publication Number Publication Date
SU1609751A1 true SU1609751A1 (en) 1990-11-30

Family

ID=21425747

Family Applications (1)

Application Number Title Priority Date Filing Date
SU894643878A SU1609751A1 (en) 1989-01-30 1989-01-30 Low-melting conductive glass

Country Status (1)

Country Link
SU (1) SU1609751A1 (en)

Similar Documents

Publication Publication Date Title
DE4201286A1 (en) LEAD- AND CADMIUM-FREE GLASS COMPOSITION FOR GLAZING, ENAMELING AND DECORATING AND THEIR USE
DE2912402A1 (en) GLASS-LIKE MATERIAL FOR ELECTRICAL RESISTANCE AND METHOD FOR MANUFACTURING IT
JPH02289445A (en) Glass composition for coating
DE3023572A1 (en) METHOD FOR PRODUCING A METAL OXIDE VARISTOR
DE1490160B2 (en) GLAZING COMPOUND CONTAINING SILVER AND PALLADIUM FOR THE PRODUCTION OF ELECTRIC RESISTORS
DE2222771A1 (en) High silver oxide glasses and methods of making them
KR100815416B1 (en) Process for producing a conductive coating on glass or on enamelled steel and substrates coated by this process
DE2946753C2 (en)
JPS645629B2 (en)
DE1596851A1 (en) Resistance material and resistor made from this resistance material
DE2809818C3 (en) Conductive composition and its use
DE2650465C2 (en) Material and method for producing conductive connections on electrical metal-ceramic components
JPS60501653A (en) dielectric composition
DE1011348B (en) Vitrifiable flux as well as ceramic object
GB1311141A (en) Electrical resistance elements an to their composition and method of manufacture
SU1609751A1 (en) Low-melting conductive glass
US5001087A (en) Insulating powder and compositions for resistant coating
DE2552181A1 (en) METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONTACT LAYER
DE3016412A1 (en) TEMPERATURE-DEPENDENT ELECTRICAL COMPONENT AND METHOD AND MATERIAL FOR THE PRODUCTION THEREOF
JPS58100306A (en) Conductive paste
DE2835562A1 (en) MATERIAL FOR A GLASS LIKE ELECTRICAL RESISTANCE AND METHOD FOR MANUFACTURING IT
JP2003267750A (en) Glass composition for coating resistive element
DE3525972A1 (en) Enamels with a heterogeneous structure
SU1655928A1 (en) Electroconductive fusible composition
RU2013395C1 (en) Glass