SU1564175A1 - Polymer composition - Google Patents

Abstract

The invention relates to polymer compositions based on epoxy resins used for impregnation, sealing, coatings, as glue, and allows improving dielectric properties, thermal conductivity and improving the processability of the composition while maintaining the bonding strength due to its use in the composition, wt. including: epoxy resin Dianova 100

amine hardener 10-12, additionally modifier-adduct of epoxy resin Dianova with polyarylene-2,5-dioxy-2,4-benzoquinone 0.1-1.0 of the general formula

N = 0.2-0.4

M = 3-4.

Description

The invention relates to epoxy resin-based polymer compositions used for impregnating, sealing coatings, as an adhesive.

The aim of the invention is to increase the dielectric properties and thermal conductivity of the composition, improving its processability while maintaining the bonding strength.

Used in the composition as a modifier, adduct epoxy resin with polyarylene-2,5-dioxy-2,4-benzoquinone is prepared according to the following procedure.

Mix the calculated amounts of epoxy resin and polyarylene-2,5-dioxy-, 4-benzoquinone, mix for 2 hours at. Next, the mixture is cooled to 50t5 ° C, dissolved in acetone, filtered and the residual acetone is evaporated at 50 ± 60 ° C, while simultaneously cleaning the resin with nitrogen sparging for 35-40 hours.

Specific examples of the preparation of the epoxy-diane resin adduct with poly-arylene-2,5-dioxy-1,4-benoquinone are given below.

Example 1. A mixture of 300 ma.ch, an epoxy-diane resin D) D-20 and 0.9 ma.ch, popiarylene 2.5 dioxy-1, 4-benzoquinone (t "3-4) was stirred at 1 20 ° С for 2 hours. After purification of the unreacted polymer and removal of acetone, an ad-, epoxy-ethane resin resin with a polyarylene-2,5-dioxy-4,4-benzoquinone was obtained. Exit 295 MAH.

The content of epoxy groups is 19.5%;

P

eo

,, 1.5620; п§ ° - 1,5522. IR spectrum, cm-: 3500 (OH-group) j

2880-2980 (groups CH, -CH); 1710 (carbonyl group C O).

Found,%: C 79.42; p 17.25; H 3.33.

Calculated,%: C 79.13; O 17.74; H 3.13.

Example 2. Get adduct analogously to example 1, using 300 ma.h. ED-20 epoxy diane resin and 1.5 mach. polyarylene-2,5-dioxy-1,4-benzoquinone (with m 3-4). Exit 295 MAH.

The content of epoxy groups is 19.3%; 1.5606; nf 1.5420.

IR spectrum: 3500 (OH group);

2880-2980 (CH-CH groups); 1710

1715 (carbonyl groups

/

ABOUT)

Found,%: C 79.15; About 16.97; H 3.88.

Calculated,%: C 78.93; O 16.54; H 4.53.

Example 3. The preparation of the adduct is carried out analogously to Example 1 by mixing 300 mas, h, epoxy diane.

0

five

0

0

five

five

0

ED-20 resins with 3 wt.h ,, polyarylene-2,5-dioxy-1,4-benzoquinone. Output 295 wt.h.

The content of epoxy groups is 18.9%; 1,560; 1.5510.

IR spectrum, cm: 3500 (OH-group);

2880-2980 (CIS-CH group); 1710-1712 (XC 0 carbonyl groups).

Found,%: C 78.64; O 16.51; H 4.85.

Calculated,%: C 78.22; O 17.03; H 4.75.

The table shows the compositions and properties of the proposed and known polymer compositions.

The high value of the thermal conductivity, the improvement of the dielectric properties (a decrease in the tangent of dielectric loss angle) and the manufacturability (i.e., low viscosity) of the proposed compositions allows their use in the manufacture of glass plastics (impregnation is facilitated).

Claims (1)

Invention Formula A polymer composition comprising an epoxy resin and an amine remover, characterized in that, in order to increase the dielectric properties and thermal conductivity, improve processability while maintaining the bonding strength, it additionally contains an adduct of epoxy resin with polyarylene-2,5-dioxy-1 epoxy resin benequinone general formula ngs sn-sn2-o-o) o ABOUT p 0,2 ... 0,4; m 3 .. .4, with the following ratio of components, ma.ch .: Epoxy Dianova resin100  CHrCM-CH2-R Jn HE Amine hardener - Adduct of epoxy-diane cmopa c. Poggiarylen-2,5-diokgi-1, 4-benzoquinone of the indicated general formula 10-12 Oh, 1-1, 0 100 JO Components: Epoxy resin ED-20100100 100 hardener: Diethylenetriamine10105 Polyethylenepolyamine - 5Polyarylene-2, 5-dioxy1, 4-benzoquinone (with m 3 and 4 respectively) .- 0,11,0 Epoxy Dioxide Adduct resin with polyarylene 2, 5-dioxy-1,4-benzoquinone by example 1 (ha - 3-4) - - - 0.1 2 (t 3-4) 3 (t - 3-4) - properties: Dynamic viscosity non - 35800 -8900 curing composition, SP at 25 ° С36000 at 45 ° С1450 The tangent of dielectric loss angle (tgS to 10) of the hardened composition at the frequency of 10 Hz3.88 3.54 3.25 Coefficient t-heatconduction-l tm I- -pri25 ° C0,19 8,22 0,29 K l Shear strength Art.Z / Art.Z9.9 Yu 2000 36400 - 2050 920 0.29 0.51 10.1 10.6 Note. The composition is cured at 120 ° C for 1.5 hours 100 5 B 100 12 -8900 36400 - 2050 920 0.5 8500 850 1.0 8100 830 0.29 0.51 0.22 0.26 0.57 0.61 10.6 11.9 10.9