SU1548203A1 - Adhesive composition - Google Patents

Abstract

The invention relates to the production of adhesive unfilled compositions based on epoxy-allyl oligomers, recommended for use as heat-resistant high-strength adhesives, sealants, casting compounds for sealing structures and gluing metals and other materials. The invention improves heat resistance, viability, strength properties - shear resistance, compression of adhesive compositions while maintaining high values of their adhesion properties due to the use in the composition of the adhesive composition based on allyl oligomer-containing epoxy resin (EAO) as an EAO product of the interaction of monoallyl maleate with cycloaliphatic epoxy resin and epoxy resin resin. containing 27 wt.% of epoxy groups, of general formula @ Composition contains, by weight.hour: epoxy resin Dianova 30-70, allyl-containing oligomer 30-70 , alil-containing oligomer 30-70, maleic anhydrite 13.7-38.5, peroxide initiator 1.3. 1 tab.

Description

The composition contains, mac, h .: epoxy resin Dianova 30-70, allyl-containing oligomer 30-70, maleic

anhydride 13.7-38.5, peroxide initiator 1-3. 1 tab.

The invention relates to adhesive compositions based on epoxy-allyl oligomers and can be used for gluing metals and other materials, as well as sealants and potting compounds in engineering, electrical, electronic, aircraft, instrument making and other public enterprises.

The aim of the invention is to increase heat resistance, the viability of strength properties — resistance to static bending and compressing unfilled anhydrite curing adhesive compositions while maintaining a high level of their adhesive properties.

In the proposed composition using epoxy-diane resins ED-16, ED-20, ED-22 maleic anhydride,

tert-butyl perbenzoate, diquimyl perekin.

An allyl-containing oligomer (AGO) is obtained by reacting monoallyl maleate with cycloaliphatic epoxy resin UL-612 Ј3.4-epoxyhydrobeneal -3,4-epoxy-1,1-bis (hydroxymethyl) -cyclohexane.

Monoallyl maleate (MAM) is prepared by esterifying maleic anhydride with allyl alcohol.

Example 1. Getting AGO.

In a three-necked flask with a capacity of 1 l with a stirrer and a reflux condenser, 267 g (1 mol) of the UP-612 epoxy resin (epoxy number 27.0%), 312 g (2 mol) of monoallyl maleinate (acid number 360 mg KOH / g), 150 ml are loaded toluene and 0.6 g of triethylamine. The stirrer is turned on and the contents of the flask are heated to 90 + 5 ° C, kept for 4 hours and then the process is carried out at 105 ± 5 ° C for 10 hours. After the specified time, a sample is taken and the epoxy and acid values are determined. The process is considered complete when the acid number is less than 15 mg KOH / 1 g of the substance and epoxy. Less than 0.3%. Volatiles are distilled at 100 ± 5 ° C and a residual pressure of 4-103 / 5.5103 Pa. The yield of the finished product is 570 g, which is 98.4% of the theoretical.

The product is a dark yellow, viscous, syrup-like liquid with the following characteristics:

Acid number,

mg KOH / g 14,8

Epoxy number,% 0,28

Allyl Iodine

iodine number / g

substances 100 86.0

Maleinate iodine

number, iodine / g

substances 100 84.5

Example 2. Adhesive compositions are prepared by mechanically mixing an epoxy oligomer, for example, ED-16, ED-20 and ED-22, a hardener, AGO,

cn cn cn, o-cc-nc nc-s-o--snC (b & nc osnLL) n ° ft

but

in the following ratio of components, May. including:

Allyl containing

5 oligomer 30-70

Epoxy Dianova Resin

30-70

Q

five

0

about 5

Q

five

0

five

tert-butyl perbenzoate at 7 0-80 ° C in the ratios indicated in the table.

The prepared composition is poured in molds for carrying out physicomechanical tests of polymer specimens on breaking stresses during static bending and compression, cooled to room temperature, and gluing pre-machined and degreased surfaces by combining them and curing under pressure of 20-50 kPa in temperature. at 100 ° C - 2 hours, 130 ° C - 2 hours, 170 ° C - 1 hours. The viability of the proposed adhesive is 4320-4680 hours at 20-30 ° C.

The results of the tests are shown in the table.

Analysis of the data in the table shows that the composition of their ratio of components of the proposed composition provides a high level of adhesive strength (.0 81.3, GcAi6 45.6 MPa) with a significant increase in heat resistance by 35-42 ° С, resistance to static bending by 22- 8 MPa, 22.5-30 MPa compression and technological viability of 108 times. Violation of the ratio between the epoxy-diane allyl-containing oligomer (examples 13,14) and the curing of the individual oligomers (examples 11,12) do not achieve the goal.

Claims (1)

Invention Formula The adhesive composition, which includes an epoxy resin, an allyl containing oligomer resin, a hardener — maleic anhydride and a peroxide initiator, characterized in that, in order to increase heat resistance, strength properties and viability, it has a pattern and a template, which is also a template and has a template and a template, which is also a template and has a template and a template, which is also a template that has a template and a template, which is also a template, and a template and a template will be applied to the composition. with cycloaliphatic epoxy resin containing 27% by weight of epoxy groups, of the following formula Allyl containing oligomer 30-70 Maleic anhydride12,7-38,5 Peroxide initiator 1.0-3.0 Components, ma.Z: ED-16 ED-20- ED-22 condensation product ED-20 with MAM (ASO) Note. The arithmetic average of 5 measurements is given. thirty 40 50 60 70 40 80 20 40 - 100 - 40 thirty