SU1492493A1 - Heat-sink ,particularly, for cooling semiconductor devices - Google Patents

Abstract

The invention relates to the field of instrumentation and can be used in heat-loaded devices. The purpose of the invention is to increase the cooling efficiency, improve the weight and size characteristics and enhance operational capabilities. A radiator with a semiconductor device installed on its heat sink — base 1 transfers heat generated by the device by convection into the surrounding space. In each heat-removing rib 2, there is a through-curved channel in the form of two interconnected parts 3.4. Part 3 is conical in shape with an angle of taper of 6–12 ° and is oriented by the expanding part towards the apex of the corresponding heat-removing fins 2. This provides an increase in the heat-transfer surface area, a decrease in the height of the ribs 2. The heat transfer efficiency per heat-transfer unit increases as a result of higher heating heat transfer ribs 2 due to a decrease in their height. High heat transfer efficiency from the inner conical surface of the through channel part 3 is provided by making the angle of taper equal to 6-12 °, which leads to the operation of part 3 according to the diffuser principle, and the presence of part 4 in the form of at least one cylindrical orifice oriented perpendicularly geometrical axis of the corresponding edge 2, and the presence of two output sections 5.6 of each through curved channel, which are located respectively at the top and bottom of the corresponding edge 2, which allows use forced ventilation for part 3 of the through channel, and also use the radiator as a body part, since the heat sink — base 1 is a solid part. The foregoing provides enhanced operational capabilities. 3 hp f-ly, 3 ill.

Description

The heat transfer device emits the heat generated by the device by connecting it to the surrounding space. Each heatsink 2 has a through-curved channel in the form of two joint parts 3, 4. The part 3 is made conical with a taper angle of 6 - 12 ° and is oriented with the expanding part towards the apex of the corresponding heat-removing rib 2. the heat-transfer surface area, reduction of the height of the ribs 2. The efficiency of heat transfer from the heat-transfer surface unit increases as a result of the higher heating of the heat transfer ribs. 2 due to a decrease in their height. High heat transfer efficiency from the inner conical surface of the part 3 of the through channel

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provided by performing a taper angle equal to 6-12, which leads to the operation of part 3 on the principle of a diffuser, and the presence of part 4 in the form of at least one cylindrical bore, oriented perpendicular to the geometric axis of the corresponding edge 2,

10 and the presence of two exit sections 5.6 for each through-curved channel, which are located respectively at the top and bottom of the corresponding edge 2, which allows the use of

15 forced valve p, Idl of part 3 of the through channel, and also to use a radiator as a body part, since the heat sink-base 1 is a single piece. Above of 20, a false extension provides

operational capabilities, 3 z. p. f-ly, 3 ill.

The invention relates to instrumentation and can be used in high-power semiconductor devices and other radio-electronic nodes.

The purpose of the invention is to increase the cooling efficiency, improve the weight and size characteristics and enhance the operational capabilities.

Goal Achieved by increasing the heat transfer from the walls of the through channels of the heat fin, by increasing the speed of the convective air flow due to a decrease in friction and eddy losses in the through channel, by reducing the height of the edges, the mass of the radiator is improved and the radiator can be used as a body part due to the placement of the outlet openings of the through channels in the limit of the heat dissipation ribs without disturbing the integrity of the heat sink base radiator .

Figure 1 shows a radiator for cooling mainly semiconductor devices, a general view, partially cut-away, with a first embodiment of a through channel; 2 is the same with the second embodiment of skposno-o; .3 view A in FIGS. 1 and 2.

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The radiator for cooling mainly semiconductor devices contains a heat sink base 1 with heat sink ribs 2 of conical shape, in which bent through channels are made in the form of two parts 3 and 4 with two output sections 5 and 6, respectively. Parts 3 and 4 communicate with each other. Part 3 of each through channel is made conical and oriented with its expanding part towards the apex of the corresponding heat sink edge 2 along its geometrical axis and has a taper angle of 6-12 °, part 4 of each through channel is made in the form of at least one hole cylindrical shape, oriented perpendicular to the geometrical axis of the corresponding heat-removing edge 2. The through-curved channels of the heat-removing edges 2 are equally oriented relative to their geometrical dimensions. s. The output sections 5 of the through channels are located on the side of the tops of the heat-removing ribs 2 in their central zones, and their output sections 6 on the side of the bases the heat removal of the cuts of the ribs 2 on their conical surfaces 7. At the same time, the holes of the cylindrical shape 4 of the through channels can

deaf, impregnated with their open sections in one direction relative to the geometrical axes of the heat-removing ribs 2, and can be made through. Heat base - base 1 for hepredine installation of semiconducting instrument 8.

A radiator for cooling mainly semiconductor devices 8 operates as follows.

During operation, the semiconductor device 8 generates heat, which leads to convective heat exchange. The radiator together with the semiconductor device 8 installed on it transfers heat by convection into space. When each heat sink and its fins 2 are bent through a channel in the form of two interconnected parts 3 and D one of which is part 3 of a conical

Claims (3)

1. A radiator for cooling predominantly semiconductor devices containing a heat sink base with a heat sink with conical ribs in which there are through channels, one output section of each of which is located on the verga of the corresponding heat sink, in its central zone differing from that, in order to improve cooling efficiency, improve weight and size characteristics, and enhance operational capabilities, each through channel is made curved in the form of xc between the parts, and its other output section is located on the side of the base of the corresponding heat-removing edge on its conical surface, one part of each through channel thirty shaped with an angle of taper of 6-12, oriented with its expanding part 25 is made conical in shape and oriented toward the apex of the corresponding extension of the expanding part in the side heat-removing fins 2, increasing the tip of the corresponding heat of the heat-releasing surface the fins along its geometry or at the same amount of heat-transfer surface, the overall dimensions are reduced due to a decrease in the height of the heat sink and their fins 2. At the same time, the heat transfer efficiency per unit of heat transfer surface increases as a result of higher heating of the heat dissipating fins 2 due to a decrease in their height. High heat transfer efficiency from the internal cone reached 40 35 The other one is in the form of at least one hole of a cylindrical form1,1 oriented perpendicular to the geometric axis of the corresponding heat radiating edge, while the through channels of the heat radiating edges are aligned equally with the geometric axes of the heat radiating edges. Particularly, it provides for the operation of part 3 as a diffuser with an opening angle of 6-12 ° and making part 4 perpendicular to the geometrical axis of the corresponding heat-removing fins 2 and in the form of a cylindrical hole communicating with the cavity of part 3 of the through-hole, output sections 5 and 6 of through channels located respectively at the tops and bottoms of the respective heat radiating ribs 2, which allows the use of forced ventilation for part 3 of each through curved channel. 45 50 2. The radiator according to claim 1, which is different from the fact that the cylindrical shaped obverse of the through channels are made deaf and are oriented with open bars in one direction relative to the geometrical axes of the heat-removing ribs. 3. The radiator according to claim 1, about tl and - due to the fact that the holes of the cylindrical shape of the through channels are made through. A. The radiator according to claims 1-3, about tl and - due to the fact that a part of the conical shape of each through channel has a taper angle is 1 ×. 2493 F o pm lla and 6 3 o bratis 0 1. A radiator for cooling predominantly semiconductor devices containing a heat sink base with a heat sink with conical ribs in which there are through channels, one output section of each of which is located on the verga of the corresponding heat sink, in its central zone differing from that, in order to improve cooling efficiency, improve weight and size characteristics and increase operational capabilities, each through channel is made curved in the form of communicating together with the parts and its another section disposed at the output side of the heat sink base corresponding ribs on its conical surface, wherein one portion of each through channel 0 5 is made of a conical shape and is oriented by the expanding part towards the verge of the corresponding heat removal edge along its geometrical surface. made of a conical shape and oriented by the expanding part towards the vergain of the corresponding heat removal edge along its geometrical The other one is in the form of at least one hole of a cylindrical form1,1 oriented perpendicular to the geometric axis of the corresponding heat radiating edge, while the through channels of the heat radiating edges are aligned equally with the geometric axes of the heat radiating edges. 2. The radiator according to claim 1, which is different from the fact that the cylindrical shaped holes of the through channels are deaf and are oriented with open bars in one direction relative to the geometrical axes of the heat-removing ribs. 3. The radiator according to claim 1, about tl and - due to the fact that the holes of the cylindrical shape of the through channels are made through. A. The radiator according to claims 1-3, about tl and - due to the fact that a part of the conical shape of each through channel has a taper angle is 1 ×. t F1 / g.1 Vida