SU1471327A1 - Power semiconductor-device assembly - Google Patents

Abstract

This invention relates to electronics and can be used to cool power semiconductor devices containing air or liquid heat sinks. The purpose of the invention is to improve the manufacturability and reliability of the design. The goal is achieved due to the fact that in the block of power semiconductor devices 2.3, the latter are installed on two opposite sides of A, B and heat sink 1 and are pressed by some surfaces to sides A, B of heat sink 1 by means of centering mechanisms 4.5 located on other surfaces x power semiconductor devices 2,3, and springs 6,7, which are mounted on the respective centering mechanisms 4,5, interconnected by studs 8. Studs 8 are rigidly fixed on opposite sides A, B, heat sink 1 in its middle part, eliminates kinks when puff heat sink and stress in the threaded rods 8. The compounds 1-yl.

Description

one

The invention relates to radio electronics, and can be used to cool power semi-conductor devices containing either air or liquid heat radiators.

The purpose of the invention is to improve the manufacturability and reliability of the design.

The drawing shows a block of power semiconductor devices, a general view.

The power semiconductor device block contains a heat sink 1 with power semiconductor devices 2 and 3 pressed to it from two opposite sides A and B and centering mechanisms 4 and 5 fixed on them, springs 6 and 7 transmitting to power semiconductor devices 2 and 3, respectively, the force of tightening the studs with 8 nuts 9. Centering mechanisms 4 and 5 ensure that the axes of force coincide with the axes of the power semiconductor devices 2 and 3 and isolate them from the springs b and 7.

The proposed mounting unit allows you to create a certain force necessary for normal operation of power semiconductor devices 2 and 3, the magnitude of which can be controlled by the deflection of springs 6 and 7. When power semiconductor devices 2 and 3 are working, heat is generated, which is transmitted through the heat sink L passing cooling liquids, which ensures the normal operation of power semiconductor devices 2 and 3 without overheating. Springs 6 and 7 compensate for temperature linear expansions of structural elements due to the deflection.

The assembly of the power semiconductor unit assembly is performed in the following sequence. The studs 8 are screwed into the heat sink 1 and counter-screws 9 s.

its opposite sides A and B. One of the sides A of heat sink 1 is fitted with a power semiconductor device 2 and a centering mechanism 4. Springs are put on studs 8

6 and tightening the nuts 9, the power semiconductor device 2 is pressed to the side A of the heat sink 1. The tightening force is controlled by the deflection of the spring 6. Similarly, the second is assembled

power semiconductor device 3 to the other side B of the heat sink 1.

Claims (1)

Invention Formula A power semiconductor unit containing a heat sink, power semiconductor devices mounted on two opposite sides with centering mechanisms and springs placed on them that are stitched together in a package by means of threaded rods ensuring thermal contact of the power semiconductor devices with the heat drain, different the fact that, in order to improve the manufacturability and reliability of the design, the studs are rigidly fixed on the opposite sides of the heat sink in its middle part.