SU1461593A1 - Arrangement for removing excess solder from holes and surface of printed-circuit boards - Google Patents

Arrangement for removing excess solder from holes and surface of printed-circuit boards Download PDF

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Publication number
SU1461593A1
SU1461593A1 SU874172985A SU4172985A SU1461593A1 SU 1461593 A1 SU1461593 A1 SU 1461593A1 SU 874172985 A SU874172985 A SU 874172985A SU 4172985 A SU4172985 A SU 4172985A SU 1461593 A1 SU1461593 A1 SU 1461593A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solder
circuit boards
nozzles
holes
removing excess
Prior art date
Application number
SU874172985A
Other languages
Russian (ru)
Inventor
Валерий Григорьевич Сокровищук
Евгений Анатольевич Волощук
Василий Леонидович Оборок
Станислав Васильевич Кутаков
Original Assignee
Предприятие П/Я В-2667
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я В-2667 filed Critical Предприятие П/Я В-2667
Priority to SU874172985A priority Critical patent/SU1461593A1/en
Application granted granted Critical
Publication of SU1461593A1 publication Critical patent/SU1461593A1/en

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  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Изобретение относитс  к пайке, а именно к оборудованию дл  изготовлени  печатных плат, в частности; к устройствам дл  гор чего лужени , и может быть использовано в металлур- .гическом производстве дл  металлического покрыти  листового материала. Цель изобретени  - повьшенйе качества и функциональных возможностей. Устройство состоит из верхнего 1 и нижнего 2 сопл, направленньк навстречу одно другому и смещенных одно относительно другого .в сторону перемещени  плат. Задн   стенка каждого из сопл расположена с зазором к плате и выполнена со скруглением или скосом вдоль внутренней кромки. Передн   стенка снабжена эластичными пластинами 7. Перепад статического давлени , возникающий вблизи задних стенок 5, выталкивает припой из отверстий 9 в камеру-коллектор верхнего сопла 1. Далее припой подхватываетс  потоком теплоносител  и выбрасываетс  через зазор в сборник припо . 2кл. слThe invention relates to soldering, in particular to equipment for the manufacture of printed circuit boards, in particular; to devices for hot-melting, and can be used in metallurgical production for metal coating of sheet material. The purpose of the invention is to improve the quality and functionality. The device consists of an upper 1 and lower 2 nozzles, directed towards each other and displaced one relative to the other in the direction of movement of the boards. The back wall of each of the nozzles is located with a gap to the board and is made with a rounding or bevel along the inner edge. The front wall is provided with elastic plates 7. The static pressure drop occurring near the rear walls 5 pushes the solder out of the openings 9 into the upper nozzle chamber-1 collector. Next, the solder is picked up by the flow of the heat transfer medium and is ejected through the gap into the solder container. 2kl. cl

Description

Фи8.2Fi8.2

Claims (1)

Формула изобретенияClaim Устройство для удаления излишков припоя из отверстий и с поверхности печатных плат, содержащее сопло со штуцером для подачи теплоносителя и эластичной пластиной, закрепленной на передней стенке, отличающееся тем, что, с целью повышения качества и функциональных возможностей, оно снабжено дополнительным соплом' с эластичной пластиной на передней стенке, установленным со смещением под первым соплом с образованием общей камеры, а внутренние поверхности задних стенок обоих сопл выполнены профилированными_с„ образованием сужающегося выходного· канала.A device for removing excess solder from the holes and from the surface of the printed circuit boards, containing a nozzle with a nozzle for supplying coolant and an elastic plate mounted on the front wall, characterized in that, in order to improve quality and functionality, it is equipped with an additional nozzle 'with an elastic plate on the front wall mounted with an offset under the first nozzle with the formation of a common chamber, and the inner surfaces of the rear walls of both nozzles are made profiled with the formation of a tapering exit bottom channel
SU874172985A 1987-01-04 1987-01-04 Arrangement for removing excess solder from holes and surface of printed-circuit boards SU1461593A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU874172985A SU1461593A1 (en) 1987-01-04 1987-01-04 Arrangement for removing excess solder from holes and surface of printed-circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU874172985A SU1461593A1 (en) 1987-01-04 1987-01-04 Arrangement for removing excess solder from holes and surface of printed-circuit boards

Publications (1)

Publication Number Publication Date
SU1461593A1 true SU1461593A1 (en) 1989-02-28

Family

ID=21277263

Family Applications (1)

Application Number Title Priority Date Filing Date
SU874172985A SU1461593A1 (en) 1987-01-04 1987-01-04 Arrangement for removing excess solder from holes and surface of printed-circuit boards

Country Status (1)

Country Link
SU (1) SU1461593A1 (en)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Авторское свидетельство СССР 634876, кл. В 23 К 3/00, 1977. *

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