SU1461593A1 - Arrangement for removing excess solder from holes and surface of printed-circuit boards - Google Patents
Arrangement for removing excess solder from holes and surface of printed-circuit boards Download PDFInfo
- Publication number
- SU1461593A1 SU1461593A1 SU874172985A SU4172985A SU1461593A1 SU 1461593 A1 SU1461593 A1 SU 1461593A1 SU 874172985 A SU874172985 A SU 874172985A SU 4172985 A SU4172985 A SU 4172985A SU 1461593 A1 SU1461593 A1 SU 1461593A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- circuit boards
- nozzles
- holes
- removing excess
- Prior art date
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Изобретение относитс к пайке, а именно к оборудованию дл изготовлени печатных плат, в частности; к устройствам дл гор чего лужени , и может быть использовано в металлур- .гическом производстве дл металлического покрыти листового материала. Цель изобретени - повьшенйе качества и функциональных возможностей. Устройство состоит из верхнего 1 и нижнего 2 сопл, направленньк навстречу одно другому и смещенных одно относительно другого .в сторону перемещени плат. Задн стенка каждого из сопл расположена с зазором к плате и выполнена со скруглением или скосом вдоль внутренней кромки. Передн стенка снабжена эластичными пластинами 7. Перепад статического давлени , возникающий вблизи задних стенок 5, выталкивает припой из отверстий 9 в камеру-коллектор верхнего сопла 1. Далее припой подхватываетс потоком теплоносител и выбрасываетс через зазор в сборник припо . 2кл. слThe invention relates to soldering, in particular to equipment for the manufacture of printed circuit boards, in particular; to devices for hot-melting, and can be used in metallurgical production for metal coating of sheet material. The purpose of the invention is to improve the quality and functionality. The device consists of an upper 1 and lower 2 nozzles, directed towards each other and displaced one relative to the other in the direction of movement of the boards. The back wall of each of the nozzles is located with a gap to the board and is made with a rounding or bevel along the inner edge. The front wall is provided with elastic plates 7. The static pressure drop occurring near the rear walls 5 pushes the solder out of the openings 9 into the upper nozzle chamber-1 collector. Next, the solder is picked up by the flow of the heat transfer medium and is ejected through the gap into the solder container. 2kl. cl
Description
Фи8.2Fi8.2
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU874172985A SU1461593A1 (en) | 1987-01-04 | 1987-01-04 | Arrangement for removing excess solder from holes and surface of printed-circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU874172985A SU1461593A1 (en) | 1987-01-04 | 1987-01-04 | Arrangement for removing excess solder from holes and surface of printed-circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
SU1461593A1 true SU1461593A1 (en) | 1989-02-28 |
Family
ID=21277263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU874172985A SU1461593A1 (en) | 1987-01-04 | 1987-01-04 | Arrangement for removing excess solder from holes and surface of printed-circuit boards |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU1461593A1 (en) |
-
1987
- 1987-01-04 SU SU874172985A patent/SU1461593A1/en active
Non-Patent Citations (1)
Title |
---|
Авторское свидетельство СССР 634876, кл. В 23 К 3/00, 1977. * |
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