SU1351953A1 - Composition for wood-particle boards - Google Patents

Abstract

This invention relates to a technology for producing chipboard. The invention makes it possible to increase the strength after 2 hours of boiling three-layer chipboard boards by bending 3-4 times, while stretching perpendicular to the plate 3.5-6 times, to reduce swelling after soaking 1.5-3 times after 2 hours of boiling, 1.5-2.5 times, due to the use of a mixture of resorcinomelamine-formaldehyde resin and an aqueous solution of chromic acid sodium and urea in a mass ratio (75- 90): (I0-25), respectively, with a mass ratio dv chrome-acid sodium, urea and water 1: 1: 1, the composition in the following ratio of components, wt%: fenoloformaldegvdna resin 9,25-13;. 0.75-1.1 modifying agent; wood chips - the rest. 3 tab. from 00 sd d) JV CO

Description

This invention relates to a chipboard technology for use in industry.

The purpose of the invention is to increase the permeability and weather resistance of chipboard.

The composition is prepared by mixing a phenol-formaldehyde resin with a modifying curing agent, and then with wood chips.

Table 1 shows the composition of the modifying-curing additive-,

Table 2 shows the formulations of the composition according to the invention.

Table 3 shows the properties of wood chipboard three-layer plates with a density of 700 kg / m thick. 12 mm for the manufacture of the inner layer which uses the composition according to the invention.

For the outer layers of slabs, reclamation composition containing 87,% wood chips: 13 wt.% Phenol-formaldehyde resin SFZH-3014. Joint external and internal layers in the total mass of the plate 35:65. Birch wood chips, fractionated composition in all layers 5/2, humidity 2-3%.

Table 1 The compositions of modifying curing additives

Resorcinomelamine formaldehyde

resin PM- (component l)

An aqueous solution of sodium bichromic acid and carbamide with a ratio of sodium bichromate acid, carbamide and water 1: 1: 1 (component 2)

Plate pressing modes: press plate temperature 180 ° C, pressing time 0.5 min / mm thickness

plates, pressure 2.2 MPa.

Claims (1)

Invention Formula The chipboard composition 5 comprising wood chips, phenol-formaldehyde resin and modifying-curing additive, characterized in that, in order to increase the strength and weatherability of the plates, as a modifying-curing additive it contains a mixture of resorghinomelamine-formaldehyde resin and a watery substance and a watery substance and a water-resistant curing agent, containing a mixture of resorghinomelamine-formaldehyde resin and a water-soluble hardening agent, and a modifier-hardening additive containing a mixture of resorghinomelamine-formaldehyde resin and a water-soluble halogen-hardening additive contains a mixture of resorghinomelamine-formaldehyde resin and a water-soluble halogen-hardening additive containing a mixture of resorghinomelamine-formaldehyde resin and a water-soluble hardening additive and a water-soluble halogen-formaldehyde resin- sour sodium and carbamide in a weight ratio  7.5-90: 10-25, respectively, with a weight ratio of chromic acid sodium, urea and water 1: 1: 1, with the following ratio of components composition, wt.%: Phenol formaldehyde resin9.25-13 Modifying curing additive 0.75-1.1 Wood chips Remaining 83 17 - 1351953 Table. 2 Wood Chip Formulations Modifying additive composition 1 composition 2 composition 3 Comparative properties of three-layer chipboard based on the composition according to the invention, the control and known 1.1 1.1 0.75 Table3