SU1333492A1 - Installation for soldering cases of electronic device - Google Patents

Abstract

The invention relates to soldering, in particular, to a device for soldering electronic housing. The aim of the invention is to improve the quality of the soldering of large-scale enclosures. The installation contains an ultrasonic device, made in the form of knife-shaped waveguides and reference waveguides, which form a closed-loop circuit, which are mounted on the membrane of the magnetostrictive transducer. Longitudinal grooves are made in knife waveguides, in which are placed: quartz-halogen lamps. The cooled reflector, through the holes of which the reference waveguides pass, is also placed in the longitudinal grooves of the knife waveguides. The intensity of the light flux and its uniformity were regulated by the system for moving the lamps in height. The quality of soldering is made possible by increasing the strength of the weld seam, it is possible to carry out non-soldered soldering due to ultrasonic action, thereby eliminating the failure of a very expensive product, eliminating the overheating of electronic components. 1 hp f-ly, 2 ill., 1 tab. with S (L with with

Description

one

The invention relates to soldering, in particular, to devices for hermetic soldering of large-sized enclosures of electronic products (IET) and for low-temperature flux-free soldering of extended welds of modules with ultrasonic action.

The aim of the invention is to improve the quality of the soldering of large buildings.

Figure 1 shows schematically the installation of soldering electronic housing, side view; figure 2 - ultrasound device.

The installation includes a frame 1 with a fixed bottom plate 2 and a movable top plate 3,

The ultrasonic device includes a magnetostrictive transducer 4, a membrane 5, and knife waveguides 6 and 7, forming an internal volume 8. Longitudinal grooves 9 are made in the knife waveguides 6, in which quartz halogen lamps 10 with fastening elements 11 are placed. The reflector 12 has the ability to move thanks to the fastening elements 13 located in the longitudinal grooves 14 and is cooled by water. On the membrane 5, reference waveguides 15 are fixed, passing through the openings 16 in the reflector 12. Static clamping is performed through the upper movable plate 3 using a pneumatic device 7, whose pressure is measured by a pressure gauge 18. On the console 19, the cooling mechanism 20 is fixed. On the movable top plate 3 fixed holders 21 of the housing 22.

The installation works as follows.

On the blade 6 and 7 and the reference 5 waveguides, the cover 23 and the housing 22 are positioned so that they adjoin the previously trimmed surfaces. Using the pneumatic device 17 create the desired static clamping force. The heating of the quartz-halogen lamps 10 is turned on and the cover 23 and case 22 are heated to the melting point of the solder. At the time of melting, the solders include a magnetostrictive transducer 4 and excite ultrasonic oscillations in knife 6 and 7 and reference 15 waveguides, and even level field is created in knife waveguides (without clearly defined nodes).

3334922

oscillations), which provides high-quality non-spindle soldering. The heating and ultrasonic vibrations are then turned off and the product is cooled by the cooling mechanism 20.

When decoupling for repair work, they are installed with cover 23 on knife waveguides 6 and

10 7 and reference waveguides 15. A portion of the coolant from the cooling mechanism 20 is poured into the sump of the housing 22 and the quartz halogen lamps are turned on 10. The heater 23 with the housing 15 and 22 is heated to the solder melting temperature, while the temperature of the housing sump is maintained within acceptable limits 90 C). Using the pneumatic device 17, the plate 3 rises along with the housing 22 fixed by the holders 21. At the same time, with the help of the holders 21, the cap 23 is fired off, remaining on the waveguides 6.7 and 15, and after turning off the lamps

25 10 is cooled.

The cap 23 is shot off during desoldering as follows.

20

0

five

Before heating the decoupling product, the body 22 of the product is fixed rigidly with the help of holders 21 to the movable plate 3. In order to carry out the shooting operation, the holders 21 have a spring device consisting of two cooperating plate and spiral springs. With the aid of a pneumatic device 17, the body 22 is pressed by the Krsch plane 23 to the waveguides 6.7 and 15.

0 The force of the spring is compressed. A plate spring (not shown), compressed, rests against the seam and the soldered cap 23. When the solder melts in the seams under the influence of heat, a pneumatic device 17 is turned on, which raises the housing 22 fixed in the holders 21, working on stretching, the cap 23 is shot, remaining on the waveguides.

At the installation, the module case was sealed (with dimensions of 120x230x75 mm) by means of ultrasonic soldering using POI-50 solder. Dpina contour seams around the perimeter of about 700 mm. The total length of the weld seams is 1000 mm. Surfaces krppki and

five

0

the cases to be soldered are tinned with POIN-50 solder (Tpl, 127 ° C) using an ultrasonic joint UZP2-0.025. PMS 6-22 with a membrane was used as a magnetostriction converter. The knife and support waveguides of half-wave length (A / 2 120 mm) were made of aluminum alloy D16T. Longitudinal grooves were made in the knife waveguides, which contribute to the formation of a flattened ultrasonic floor at their working ends.

In the longitudinal grooves placed 10 halogen-halogen lamps of the type KG1000-220-5 each 1.0 kW power.

The intensity of the luminous flux and its uniformity were regulated by this theme of the movement of lamps in height.

The reflector was cooled with water and installed in the desired position using fasteners.

An ultrasonic generator UZGZ-0.4 was used with an output power of 0.4 kW. The amplitude of oscillation of waveguides was 3-5 µm.

For comparison, two batches of module housings (in JO pieces) were soldered on the known and proposed installations.

The results are tabulated.

The use of the proposed installation allows to improve the quality of soldering by increasing the strength of the weld seam, to ensure the possibility of conducting flux-free soldering, thereby eliminating the possibility of over-exposure due to corrosion during prolonged

five

0

five

about

five

storage (over 15 years), eliminate defects due to overheating of electronic circuit elements, increase productivity by 1.5 times and ensure the possibility of repeated repair of products.

Claims (2)

1. Installation of soldering of electronic device housings, including a frame with a fixed bottom plate, a static pressure mechanism with a movable top plate fixed on it, a heater and an ultrasonic device with a magnetostrictive transducer, which, in order to improve the quality of soldering of 1 large-sized cases, ultrasonic device made in the form of a closed loop of knife waveguides and reference waveguides mounted on the membrane of the magnetostrictive converter inside a closed th contour waveguides heaters installed in the form of lamps kvartsevogalogennyh cooled reflector, through holes which extend the supporting waveguide, wherein the end portions of lamps and kvartsevogalogennyh refpektora attachment elements arranged in longitudinal grooves knife waveguides, with adjustment movement. 2. Installation according to claim 1, about tl and - that, in order to expand technological capabilities, it is equipped with spring-loaded holders mounted on a movable top plate. 18 20 Vui. one Editor A.Lezhnina Compiled by L.Abrosimova Tehred V.Kadar Order 3908/13 Circulation 974 Subscription VNIIPI USSR State Committee for inventions and discoveries 113035, Moscow, Zh-35, Raushsk nab, 4/5 Production and printing company, Uzhgorod, Projecto st., 4 Proofreader L. Beskid