SU1226693A1 - Cooler for power semiconductor device - Google Patents

Abstract

The invention can be used in the design of power semiconductor devices. The purpose of the invention is to increase the cooling efficiency. The case of the cooler 1 has a platform 2 for the semiconductor device 3 and the ribs 4, in which grooves 5 are made. Tubes 6 of metal, the length of which corresponds to the length of the cooler, are installed in the grooves 5 of the ribs 4. The presence of metal tubes 6 ensuring close contact with adjacent ribs, allows for power diodes and thyristors for currents of 300-500 A, while increasing their weight by 6% and cost by 10%, to obtain an improvement in heat transfer by 2-2.5 times. 1 il. About S (L

Description

This invention relates to metal finned coolers for power semiconductor devices with forced air cooling.

The purpose of the invention is to increase the cooling efficiency.

The goal is achieved due to the fact that the cooler is equipped with metal tubes, and in the side surfaces of the ribs facing one another, symmetrical cylindrical grooves are made in which metal tubes are installed ensuring tight contact with the adjacent ribs.

The drawing shows a cooler for a power semiconductor device.

The case 1 is cool; the cytel has a pad 2 for dl - fastening the semiconductor device 3 and the ribs 4, in which the notches 5 are made with metal tubes 6 tightly fixed in them, the length of the tubes 6 corresponding to the length of the cooler

The device works as follows.

in a way.

Heat released in the skpov semiconductor device 3 is transferred through pad 2 to the fins 4, the surfaces of which are cooled by air flow blown in the direction parallel to the planes of the ribs. through its exterior and interior surfaces. The airflow area of the ribs 4 is approximately equal to S, where

but 4-12);

H - height of edges}

L is the length of the cooler. The area of Bsb) 1.7p (d9T) b,

3 ((, 1 to 2пцНЪ, - the number of edges (usually Editor O. Bugir Order 2148/60

Compiled by I.Krinsky

Tehred Vokadar Proofreader M. Maksimishinets

Circulation 765

VNIIPI USSR State Committee

for inventions and discoveries 113035, Moscow, Z-ZZ, Raushsk nab., 4/5

Production and printing company, Uzhgorod, Projecto st., 4

26693

Where

1.7 - coefficient taking into account that part of the outer surface of the tubes 6, which are in contact with the surface of the recesses 5, does not participate in heat transfer;

p, | -, - the number of tubes,

D is their diameter.

If you accept

(6)

(1-3) p .., then

heat transfer surface increases by 2-3.5 times. At the same time, the weight of the cooler 1 is not significantly increased by (6-8%), and due to the small thickness of the tube walls there is no additional resistance to air.

The technical and economic efficiency of the invention is determined by the possibility of surface heat transfer compared with the widely used finned coolers. In typical coolers designed for power diodes and thyristors for currents of 300-500 A, with an increase in their weight by 6% and a cost by 10%, an improvement in heat transfer by 2-2.5 times is possible.

Claims (1)

Invention Formula A cooler for a power semiconductor device, made in the form of a base with a mounting pad and with flat edges, of which Bj; and in order to increase the cooling efficiency, it is equipped with metal tubes, and in the side surfaces of adjacent ribs facing one another, symmetrical grooves are made in which the tubes are installed parallel to the base with the possibility of thermal contact between the mating surfaces corresponding grooves and metal tubes.