SU1220497A1 - Current contacting paste - Google Patents

Description

Composition number 3:

polybutylmethacrylate 3-7%

terpineol50-80%

lanolin15-25%

EXAMPLE 1. A float glass substrate of 120 + 133 mm in size was screened using 128 electrodes with a width of 0.15 ± 0.05 mm using a conductive paste of the following composition, wt.h.

Fine

gold powder76

Fine

low-melting powder

C82-3 glass size

particles from 5 to 20 microns, 1.5

Fine

low-melting powder

crystallizes

glass SCP-89 with size

particles from 0.5 to 10 microns3,5

Organic binder

(5% solution

ethyl cellulose

in terpineole) 19

Then the paste is dried by infrared radiation at a temperature of 120 ° C for 10 minutes and burned at a temperature of 590 ° C for 50 minutes. Thereafter, a screen of low-melting glass based on lead oxide was applied by screen printing and determined at a temperature of 570 ° C for 50 minutes. Breaks in the conductor coating is not detected.

Example 2. A screen printing method of 256 electrodes with a width of 0.15 ± 0.05 mm of conductive paste of the following composition, wt.ch .:

Fine

gold powder70

Fine

low-melting powder

C84 glass size

particles of 0.2-12 micron

Fine

low-melting powder

crystallizing

glass SCP-89 size

particles 0.5-10 micron6

Organic binder

(8% solution

ethyl cellulose

vterpineole) 21

Then the paste is dried at 120 ° C for 12 minutes and burned at 570 ° C for 30 minutes. After that, dielectric coatings of low-melting glass based on lead oxide are formed and the integrity of the electrodes is checked. Breaks in the conductor coating is not detected.

PRI me R 3. 128 electrodes were applied to a float glass substrate from a conductive paste of the following composition, wt.ch .:

Fine

polyhumoride powder

nickel .74,5

Fine

low-melting powder

C80-4 glass size

particles 7-21 microns1,5

Fine

low-melting powder

crystallizing glass

СЦН-84 size

particles 5-26 microns 3,0

Organic

binder

(57o polybutylmethacrylate,

75% terpineol and

20% lanolin) 21.0

Then the paste is dried and burned at a temperature of 550 ° C for 30 minutes. After that, a dielectric coating of low-melting glass based on lead oxide is formed and the integrity of the electrodes is checked. Breaks in the conductor coating is not detected.

PRI me R 4. 128 electrodes of a conductive paste of the following composition were deposited onto a float glass substrate, wt.ch .:

Fine

popuborin powder

nickel 70

Fine

low-melting powder

glass C 90-2 size

particles of 3-18 microns

Fine

low-melting powder

crystallizing

glass SCP-82

particle size of 0.9-5 microns 6

Organic

binder

(60% lanolin and

40% 2% solution

ethyl cellulose

in terpineopa) 22.

Then were carried out the same as in example 3 technological operations. Breaks in the conductor coating is not detected. The research results are summarized in table 3.

Thus, the proposed composition of the conductive paste can improve the quality of the conductive paste.

coatings under a layer of glassfrits, i.e. reduce cliffs in conductor

layer.

Table 1

table 2

Table 3

Claims (1)

Conducting paste containing fine powders of metal, for example gold, low-melting glass based on lead oxide, an organic binder, characterized in that, in order to improve the quality of the coating, it additionally contains fine powder of low-melting crystallizing glass based on lead oxide at the following content of components wt.h .: Fine metal powder 65-80 Fine powder of fusible glass based on lead oxide 1-3 Fine powder of fusible crystallizing glass based on lead oxide 3-7 Organic binder 10-30