SU1196141A1 - Method of machining with chip-breaking - Google Patents

Abstract

METHOD OF MACHINING WITH chip control comprising applying struzhkorazdelitelnyh obrabatshaemuyu grooves on the surface prior to or during the cutting by the action of laser radiation pulses with subsequent machining cutting tool, wherein .chto, in order to increase the reliability of chip breaking process and increasing durability of the cutting tool, pulsed- the impact is carried out at an angle equal to the main angle in terms of the cutting tool in the plane of its front surface surface. With s

Description

with

ABOUT)

The invention relates to methods for metal cutting and can be used on machine tools with numerical control.

The purpose of the invention is to increase the reliability and leveling of the chip breaking process, reducing the work of cutting forces, by reducing the dynamic loads on the cutting tool, and increasing the resistance of the cutting tool.

The proposed method is based on the fact that laser radiation has the property of monochromaticity and high energy density of radiation. This makes it possible to disrupt the continuity of the surface being treated, with the result that when cutting off the surface layer in etrh places, the formation of fracture chips occurs.

The application of blind channels in the treated surface can be carried out in advance, but it is more expedient to combine it with the processing process. In this case, the mode of operation may be different. In the case of a pulsed mode of operation, based on the required chip length, the pulse period T is determined by the formula:

r UcTp / pe3, (O

where the required chip length;

 - chip shrinkage rate Vppj-cutting speed. The axis of any blind channel must intersect the axis of rotation of the workpiece.

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and makes an angle with it equal to the angle in terms of the cutting tool, which reduces the work of the cutting forces. The length of the channels should be less than the ratio of the cutting depth to the sine of the main angle in terms of the cutting tool so that there is no damaged machined surface.

The method is carried out as follows.

Depending on the problem being solved, a continuous or pulsed laser is selected. The surface to be machined is preliminarily subjected to or during the cutting process by the laser radiation. The pulse period T is determined depending on the required chip length using formula (1).

The laser is rigidly connected to the tool holder: m, or it is mounted on an additional stand. In this case, the law of motion of the laser beam is set from additional technological considerations.

However, in order to reduce the work of cutting forces, it is necessary that the angle between the axis of rotation of the workpiece and the laser beam be equal to the main angle in terms of the cutting tool, and the mental continuation of the direction of the beam must cross the axis of rotation of the workpiece. The length of the channels should be less than the ratio of the depth of cut to the sine of the main angle in terms of the cutting tool. This will ensure the formation of chips overlap and will protect the new surface from damage.

Claims (1)

METHOD OF MECHANICAL PROCESSING WITH CRUSHING OF CHIP, including applying chip cutting grooves to the surface to be preliminarily or during cutting by means of laser radiation pulses followed by mechanical processing by a cutting tool, characterized in that, in order to increase the reliability of the chip cutting process and increase the resistance of the cutting tool , the pulse action is carried out at an angle equal to the main angle in terms of the cutting tool in the plane of its front surface ti _'with SU, 1196141>