SU1107995A1 - Flux for soldering with quick solders - Google Patents

Abstract

1. FLUSHING FOR SOLDERING WITH EASY SUSTAINING SODES, mainly for nickel, silver and copper coatings, containing a product of partial hydrolysis of gelatin and a solvent, differing from the fact that, in order to increase the activity of the flux, it additionally contains copper acetate at the following ratio of components, wt.%: The product of partial hydrolysis of gelatin 8-12 Copper acetate 1.6-2.4 Solvent Remaining 2. Flux pop. 1, which is also distinguished by the fact that, in order to improve the wettability of the brazed metal, it additionally contains urea in number Twe 8-14 wt.% and the surfactant of non-ionic type in the amount of 0.050, 2 wt.%. 3. Flux POP.1, characterized in that it additionally contains rosin in an amount of 25-50% by weight. k /) 4. Flux according to claims 1-3, characterized in that it additionally contains polyethylene glycol in an amount of 10-20% by weight.

Description

with

have eaten The invention relates to a felted production, in particular, soldering fluids and tinning fusible solders for coatings of various metals and alloys used, for example, in the electronic, instrument-making and other industries. Known flux for soldering and tinning on metal surfaces 1, predominantly nickel, containing, in May.%: Ethylene glycol 7.5-AO Organic solvent or water 1-70 Maleic anhydride 18-75 The disadvantage of the known flux is low activity at low temperature soldering knots and parts for nickel and silver coatings 1.1-1.3 relative units The closest in composition to the proposed component is a flux containing, in wt.%: The product of partial hydrolysis of gelatin 3-15 Water soluble salt of hypophosphorous acid 0.001-0.1 Water or aqueous organic solvent, for example, a mixture of water, ethyl alcohol and (glypha) glycerin The introduction of a water-soluble salt of a phosphorous acid to the composition of the flux increases its surface activity, which is manifested in an increase in the rate of wetting of the surface of the metal being soldered and solder and in an increase in the flux foamability. After soldering, the flux residues are water-soluble, do not contain resinous substances and therefore are easily and completely removed with cold water. 2 3 However, this flux is characterized by low soldering activity over nickel, silver and copper coatings. The purpose of the invention is to increase the flux activity. The goal is achieved by the fact that the flux containing the product of partial hydrolysis of gelatin and solvent, additionally contains 95 copper acetate in the following ratio, wt.% :; The product of partial hydrolysis of gelatin is 8-12 Copper acetate 1.6-2.4 Solvent Remaining To improve the wettability of the brazed metal, the flux may additionally contain an additive of a complexing agent - urea 8-14 wt.% And a non-ionic surfactant of type 0.050, 2 wt. .%. The flux may contain another complexing agent - rosin 25-50 wt.%. To increase the elasticity of the flux, it additionally contains polyethylene glycol 10-20% by weight. Addition of copper acetate 1.6-2.4 Vss.% Reduces the surface tension of the molten solder and improves its fluidity, resulting in an increase in the flux activity during brazing on nickel, silver and other metal surfaces. Fluxes are prepared using standard equipment simple by mixing the components. In order to accelerate the formation of a homogeneous composition, it is permissible to lightly heat the mixtures in a water bath at eo-BO c. Specific examples of flux compositions and fluxing activity on various metal coatings with POSSu 61-0.5 brand solder at a soldering temperature of 280 ° C are given in Tables 1 and 2. The flux compositions given in Table 1 are primarily intended for manual and group printed rations. boards The content of the active component in the flux - a product of partial hydrolysis of gelatin in combination with an additional active component - copper acetate. It allows to obtain high results of fluxing activity on nickel, silver and copper coatings. Reducing the content of these components leads to a deterioration in the results of fluxing activity, and an increase in their content is inexpedient, since it does not lead to a further increase in the results of lusuyuschuyu activity on these surfaces. Additions of complexing agents about 8–14 wt.% and 0.05–0.2 wt.% surfactants of a non-ionic type improve the wettability of the soldered metal with solder and thereby increase the results of the fluxing activity. With a decrease in their quantitative content, the desired effect is not achieved, and an increase in the content of these components does not entail a further increase in the results of fluxing activity. The flux compositions given in Table 2 are primarily intended for brazing in tunnel kilns and high frequency currents (HDTV), for example for soldering and sealing nickel-plated contact assemblies of metal film capacitors. The introduction of the active component of the product of partial hydrolysis of gelatin of 8-12 wt.% In combination with the additional active component — copper acetate to 1.6-2.4 wt.% Gives high results of fluxing activity on nickel, silver Copper coatings. A decrease in the content of these components leads to a decrease in the results of fluxing activity, and an increase in their content is impractical because it does not lead to a further increase in the results of flux activity. Additives to the complexing agent — urea — 8–12 wt.% And, according to Table 1 of a non-ionic type surface-active substance, 0.05–0.1 wt.%, Improve the wettability of the brazed metal with solder; and the addition of a plasticizer - polyethylene glycol 10-20 wt.% increases the elasticity of the flux, which in aggregate. This leads to an increase in the results of flux activity. With a decrease in the quantitative content of these components, the desired effect of increasing the flux activity is not achieved, and an increase in their content above the specified limits does not lead to a further increase in the amount of flux activity. This key has a high cleansing effect on the oxide film of the melted metal surface and increased activity, provides good flowability and penetration of solder into the gaps, which allows to achieve high tightness and mechanical strength of the soldered joint. This flux provides soldering using a wide range of low-melting solders and can be used in advanced installations of mechanized soldering, when soldering in tunnel kilns, as well as when soldering and sealing products. HDTV

1.6 1.6 1.6

2.4

12 12 12 2.4 2.4

22,6

22,6

45.2 21.4

21.4

42,8

1 2 3

4 5 6 7 8 9 10

0.05

0.2

Continuation of table 1

Continuation of table 1

0.05 Note:

Continued- Table T

Table 2 Provocell is the trade name of ethoxylated alkylphenol. Sintanol DS-10 is the trade name of ethoxylated dodecyl alcohol. I

10 Continuation of table 2

Claims (4)

1. FLUX FOR REFRIGERATION BY REFLECTIVE SALTS, mainly on nickel, silver and copper coatings, containing a product of partial hydrolysis of gelatin and a solvent, characterized in that, in order to increase the activity of flux, it additionally contains copper acetate in the following ratio of components, wt.% : The product of partial hydrolysis of gelatin 8-12 Copper Acetate Solvent 2. The flux according to claim 1, about s and th with the fact that, 1.6-2.4 The rest of t and h and in order to improve the wettability of the soldered metal, it additionally contains urea in the amount of 8-14 wt.% And a non-ionic surfactant in the amount of 0.050.2 wt.%. 3. Flux pop 1, characterized in that it additionally contains rosin in an amount of 25-50 wt.%. 4. The flux according to claims 1 to 3, characterized in that it further comprises polyethylene glycol in ve 10-20 wt.%. su; „1107995 1 . 1107995