SG89385A1 - Method for joining metals and device produced thereby - Google Patents

Method for joining metals and device produced thereby

Info

Publication number
SG89385A1
SG89385A1 SG200101811A SG200101811A SG89385A1 SG 89385 A1 SG89385 A1 SG 89385A1 SG 200101811 A SG200101811 A SG 200101811A SG 200101811 A SG200101811 A SG 200101811A SG 89385 A1 SG89385 A1 SG 89385A1
Authority
SG
Singapore
Prior art keywords
device produced
joining metals
joining
metals
produced
Prior art date
Application number
SG200101811A
Inventor
Shoji Takashi
Amita Hitoshi
Murase Noriko
Nagasaki Shunsuke
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of SG89385A1 publication Critical patent/SG89385A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Molten Solder (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
SG200101811A 2000-03-27 2001-03-21 Method for joining metals and device produced thereby SG89385A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000086803A JP2001269772A (en) 2000-03-27 2000-03-27 Method for joining metal and metal and joined product

Publications (1)

Publication Number Publication Date
SG89385A1 true SG89385A1 (en) 2002-06-18

Family

ID=18602914

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200101811A SG89385A1 (en) 2000-03-27 2001-03-21 Method for joining metals and device produced thereby

Country Status (4)

Country Link
JP (1) JP2001269772A (en)
DE (1) DE10114191A1 (en)
SG (1) SG89385A1 (en)
TW (1) TW564197B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20121992U1 (en) * 2001-08-28 2003-10-23 Behr GmbH & Co. KG, 70469 Stuttgart Flux composition used for hard-soldering parts made of aluminum or its alloys, especially motor vehicle radiators contains flux, solvent and binder
JP3819767B2 (en) * 2001-11-29 2006-09-13 ニホンハンダ株式会社 Soldering flux and cream solder
US7357291B2 (en) 2002-01-30 2008-04-15 Showa Denko K.K. Solder metal, soldering flux and solder paste
FI20050726A (en) * 2005-07-06 2007-01-07 Outokumpu Copper Products Oy Method for making solder suitable for joining two metal pieces, solder and use of solder
EP2056360A1 (en) * 2007-10-29 2009-05-06 Atomic Energy Council - Institute of Nuclear Energy Research Solar Cell Dissipation Package
ES2448790T3 (en) * 2009-09-04 2014-03-17 Senju Metal Industry Co., Ltd Lead-free solder alloy, joint element and manufacturing process, and electronic component
JP5878290B2 (en) * 2010-12-14 2016-03-08 株式会社日本スペリア社 Lead-free solder alloy
CN103988297B (en) * 2011-12-12 2018-11-23 三菱综合材料株式会社 Power module and its manufacturing method
ES2702240T3 (en) * 2011-12-27 2019-02-28 Senju Metal Industry Co Lead-free solder alloy based on Sn-Cu-Al-Ti
CN104364046A (en) * 2012-06-11 2015-02-18 千住金属工业株式会社 Flux composition, liquid flux, resin flux cored solder, and solder paste

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3441440A1 (en) * 1983-11-23 1985-05-30 Société de Paris et du Rhône, Lyon, Rhône Method of joining aluminium wire to a copper part by welding or soldering
DE4020785A1 (en) * 1990-06-27 1992-01-02 Cuba Acad Ciencias Solder alloys for semiconductor elements - contg. copper as well as aluminium and germanium for shorter soldering time at lower temp.
US5328521A (en) * 1993-03-08 1994-07-12 E. I. Du Pont De Nemours And Company Kinetic solder paste composition
US5334261A (en) * 1991-05-27 1994-08-02 Mec Co., Ltd. Soldering flux composition and solder paste composition
DE19743886A1 (en) * 1997-10-04 1999-04-08 Eurotec Ges Fuer Energiesparte Solder paste contains copper or nickel-plated aluminium balls
US6015082A (en) * 1994-10-28 2000-01-18 Kivilahti; Jorma Method for joining metals by soldering

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3441440A1 (en) * 1983-11-23 1985-05-30 Société de Paris et du Rhône, Lyon, Rhône Method of joining aluminium wire to a copper part by welding or soldering
DE4020785A1 (en) * 1990-06-27 1992-01-02 Cuba Acad Ciencias Solder alloys for semiconductor elements - contg. copper as well as aluminium and germanium for shorter soldering time at lower temp.
US5334261A (en) * 1991-05-27 1994-08-02 Mec Co., Ltd. Soldering flux composition and solder paste composition
US5328521A (en) * 1993-03-08 1994-07-12 E. I. Du Pont De Nemours And Company Kinetic solder paste composition
US6015082A (en) * 1994-10-28 2000-01-18 Kivilahti; Jorma Method for joining metals by soldering
DE19743886A1 (en) * 1997-10-04 1999-04-08 Eurotec Ges Fuer Energiesparte Solder paste contains copper or nickel-plated aluminium balls

Also Published As

Publication number Publication date
TW564197B (en) 2003-12-01
DE10114191A1 (en) 2001-10-25
JP2001269772A (en) 2001-10-02

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