SG84511A1 - Method of forming solder ball contact in ball grid array device - Google Patents

Method of forming solder ball contact in ball grid array device

Info

Publication number
SG84511A1
SG84511A1 SG9801442A SG1998001442A SG84511A1 SG 84511 A1 SG84511 A1 SG 84511A1 SG 9801442 A SG9801442 A SG 9801442A SG 1998001442 A SG1998001442 A SG 1998001442A SG 84511 A1 SG84511 A1 SG 84511A1
Authority
SG
Singapore
Prior art keywords
grid array
array device
forming solder
solder ball
contact
Prior art date
Application number
SG9801442A
Inventor
Teng Eng Kian
Chin Fong Kok
Original Assignee
Texas Instr Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instr Singapore Pte Ltd filed Critical Texas Instr Singapore Pte Ltd
Priority to SG9801442A priority Critical patent/SG84511A1/en
Publication of SG84511A1 publication Critical patent/SG84511A1/en

Links

SG9801442A 1998-06-17 1998-06-17 Method of forming solder ball contact in ball grid array device SG84511A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9801442A SG84511A1 (en) 1998-06-17 1998-06-17 Method of forming solder ball contact in ball grid array device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9801442A SG84511A1 (en) 1998-06-17 1998-06-17 Method of forming solder ball contact in ball grid array device

Publications (1)

Publication Number Publication Date
SG84511A1 true SG84511A1 (en) 2001-11-20

Family

ID=20430029

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9801442A SG84511A1 (en) 1998-06-17 1998-06-17 Method of forming solder ball contact in ball grid array device

Country Status (1)

Country Link
SG (1) SG84511A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08162767A (en) * 1994-12-08 1996-06-21 Nec Corp Mounting structure for ball grid array
US5722160A (en) * 1994-10-28 1998-03-03 Hitachi, Ltd. Packaging method of BGA type electronic component
JPH10116927A (en) * 1996-10-09 1998-05-06 Sumitomo Metal Ind Ltd Connecting terminal and method for its formation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5722160A (en) * 1994-10-28 1998-03-03 Hitachi, Ltd. Packaging method of BGA type electronic component
JPH08162767A (en) * 1994-12-08 1996-06-21 Nec Corp Mounting structure for ball grid array
JPH10116927A (en) * 1996-10-09 1998-05-06 Sumitomo Metal Ind Ltd Connecting terminal and method for its formation

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