SG81927A1 - A semiconductor package and a method for forming same - Google Patents

A semiconductor package and a method for forming same

Info

Publication number
SG81927A1
SG81927A1 SG9801004A SG1998001004A SG81927A1 SG 81927 A1 SG81927 A1 SG 81927A1 SG 9801004 A SG9801004 A SG 9801004A SG 1998001004 A SG1998001004 A SG 1998001004A SG 81927 A1 SG81927 A1 SG 81927A1
Authority
SG
Singapore
Prior art keywords
semiconductor package
forming same
forming
same
package
Prior art date
Application number
SG9801004A
Inventor
Boon Hua James How
Chin Long Wong
Tjandran Janto
Zhihua Yuan
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to SG9801004A priority Critical patent/SG81927A1/en
Publication of SG81927A1 publication Critical patent/SG81927A1/en

Links

SG9801004A 1998-05-04 1998-05-04 A semiconductor package and a method for forming same SG81927A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9801004A SG81927A1 (en) 1998-05-04 1998-05-04 A semiconductor package and a method for forming same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9801004A SG81927A1 (en) 1998-05-04 1998-05-04 A semiconductor package and a method for forming same

Publications (1)

Publication Number Publication Date
SG81927A1 true SG81927A1 (en) 2001-07-24

Family

ID=20429993

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9801004A SG81927A1 (en) 1998-05-04 1998-05-04 A semiconductor package and a method for forming same

Country Status (1)

Country Link
SG (1) SG81927A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5319242A (en) * 1992-03-18 1994-06-07 Motorola, Inc. Semiconductor package having an exposed die surface
WO1997008748A1 (en) * 1995-08-22 1997-03-06 Hitachi, Ltd. Chip-size package, method of manufacturing same, and second level packaging

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5319242A (en) * 1992-03-18 1994-06-07 Motorola, Inc. Semiconductor package having an exposed die surface
WO1997008748A1 (en) * 1995-08-22 1997-03-06 Hitachi, Ltd. Chip-size package, method of manufacturing same, and second level packaging

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