SG79950A1 - Double sided single inline memory module - Google Patents

Double sided single inline memory module

Info

Publication number
SG79950A1
SG79950A1 SG9703827A SG1997003827A SG79950A1 SG 79950 A1 SG79950 A1 SG 79950A1 SG 9703827 A SG9703827 A SG 9703827A SG 1997003827 A SG1997003827 A SG 1997003827A SG 79950 A1 SG79950 A1 SG 79950A1
Authority
SG
Singapore
Prior art keywords
memory module
double sided
inline memory
sided single
single inline
Prior art date
Application number
SG9703827A
Inventor
Teng Eng Kian
Pew Chan Boon
Original Assignee
Texas Instr Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instr Singapore Pte Ltd filed Critical Texas Instr Singapore Pte Ltd
Priority to SG9703827A priority Critical patent/SG79950A1/en
Publication of SG79950A1 publication Critical patent/SG79950A1/en

Links

SG9703827A 1997-10-22 1997-10-22 Double sided single inline memory module SG79950A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9703827A SG79950A1 (en) 1997-10-22 1997-10-22 Double sided single inline memory module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9703827A SG79950A1 (en) 1997-10-22 1997-10-22 Double sided single inline memory module

Publications (1)

Publication Number Publication Date
SG79950A1 true SG79950A1 (en) 2001-04-17

Family

ID=20429764

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9703827A SG79950A1 (en) 1997-10-22 1997-10-22 Double sided single inline memory module

Country Status (1)

Country Link
SG (1) SG79950A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4996587A (en) * 1989-04-10 1991-02-26 International Business Machines Corporation Integrated semiconductor chip package
US5107328A (en) * 1991-02-13 1992-04-21 Micron Technology, Inc. Packaging means for a semiconductor die having particular shelf structure
US5243497A (en) * 1992-09-29 1993-09-07 Texas Instruments Chip on board assembly
US5280192A (en) * 1990-04-30 1994-01-18 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4996587A (en) * 1989-04-10 1991-02-26 International Business Machines Corporation Integrated semiconductor chip package
US5280192A (en) * 1990-04-30 1994-01-18 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
US5107328A (en) * 1991-02-13 1992-04-21 Micron Technology, Inc. Packaging means for a semiconductor die having particular shelf structure
US5243497A (en) * 1992-09-29 1993-09-07 Texas Instruments Chip on board assembly

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