SG79950A1 - Double sided single inline memory module - Google Patents
Double sided single inline memory moduleInfo
- Publication number
- SG79950A1 SG79950A1 SG9703827A SG1997003827A SG79950A1 SG 79950 A1 SG79950 A1 SG 79950A1 SG 9703827 A SG9703827 A SG 9703827A SG 1997003827 A SG1997003827 A SG 1997003827A SG 79950 A1 SG79950 A1 SG 79950A1
- Authority
- SG
- Singapore
- Prior art keywords
- memory module
- double sided
- inline memory
- sided single
- single inline
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9703827A SG79950A1 (en) | 1997-10-22 | 1997-10-22 | Double sided single inline memory module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9703827A SG79950A1 (en) | 1997-10-22 | 1997-10-22 | Double sided single inline memory module |
Publications (1)
Publication Number | Publication Date |
---|---|
SG79950A1 true SG79950A1 (en) | 2001-04-17 |
Family
ID=20429764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9703827A SG79950A1 (en) | 1997-10-22 | 1997-10-22 | Double sided single inline memory module |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG79950A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4996587A (en) * | 1989-04-10 | 1991-02-26 | International Business Machines Corporation | Integrated semiconductor chip package |
US5107328A (en) * | 1991-02-13 | 1992-04-21 | Micron Technology, Inc. | Packaging means for a semiconductor die having particular shelf structure |
US5243497A (en) * | 1992-09-29 | 1993-09-07 | Texas Instruments | Chip on board assembly |
US5280192A (en) * | 1990-04-30 | 1994-01-18 | International Business Machines Corporation | Three-dimensional memory card structure with internal direct chip attachment |
-
1997
- 1997-10-22 SG SG9703827A patent/SG79950A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4996587A (en) * | 1989-04-10 | 1991-02-26 | International Business Machines Corporation | Integrated semiconductor chip package |
US5280192A (en) * | 1990-04-30 | 1994-01-18 | International Business Machines Corporation | Three-dimensional memory card structure with internal direct chip attachment |
US5107328A (en) * | 1991-02-13 | 1992-04-21 | Micron Technology, Inc. | Packaging means for a semiconductor die having particular shelf structure |
US5243497A (en) * | 1992-09-29 | 1993-09-07 | Texas Instruments | Chip on board assembly |
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