SG74724A1 - Cmp method and apparatus for simultaneously polishing product and conditioning the polishing pad - Google Patents

Cmp method and apparatus for simultaneously polishing product and conditioning the polishing pad

Info

Publication number
SG74724A1
SG74724A1 SG1999001966A SG1999001966A SG74724A1 SG 74724 A1 SG74724 A1 SG 74724A1 SG 1999001966 A SG1999001966 A SG 1999001966A SG 1999001966 A SG1999001966 A SG 1999001966A SG 74724 A1 SG74724 A1 SG 74724A1
Authority
SG
Singapore
Prior art keywords
conditioning
polishing
cmp method
product
polishing pad
Prior art date
Application number
SG1999001966A
Inventor
Quk Ser Wee
Jimmy Lo
Charles Lin
Original Assignee
Chartered Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chartered Semiconductor Mfg filed Critical Chartered Semiconductor Mfg
Publication of SG74724A1 publication Critical patent/SG74724A1/en

Links

SG1999001966A 1998-08-13 1999-04-27 Cmp method and apparatus for simultaneously polishing product and conditioning the polishing pad SG74724A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13335598A 1998-08-13 1998-08-13

Publications (1)

Publication Number Publication Date
SG74724A1 true SG74724A1 (en) 2000-08-22

Family

ID=22458207

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200004127A SG97899A1 (en) 1998-08-13 1999-04-27 Cmp method and apparatus for simultaneously polishing product and conditioning the polishing pad
SG1999001966A SG74724A1 (en) 1998-08-13 1999-04-27 Cmp method and apparatus for simultaneously polishing product and conditioning the polishing pad

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200004127A SG97899A1 (en) 1998-08-13 1999-04-27 Cmp method and apparatus for simultaneously polishing product and conditioning the polishing pad

Country Status (1)

Country Link
SG (2) SG97899A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996038262A1 (en) * 1995-06-01 1996-12-05 Rodel, Inc. Compositions for polishing silicon wafers and methods
US5569062A (en) * 1995-07-03 1996-10-29 Speedfam Corporation Polishing pad conditioning
JP3697775B2 (en) * 1996-03-19 2005-09-21 ヤマハ株式会社 Polishing equipment

Also Published As

Publication number Publication date
SG97899A1 (en) 2003-08-20

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