SG52489A1 - Process for electroplating nonconductive surface - Google Patents

Process for electroplating nonconductive surface

Info

Publication number
SG52489A1
SG52489A1 SG1996005161A SG1996005161A SG52489A1 SG 52489 A1 SG52489 A1 SG 52489A1 SG 1996005161 A SG1996005161 A SG 1996005161A SG 1996005161 A SG1996005161 A SG 1996005161A SG 52489 A1 SG52489 A1 SG 52489A1
Authority
SG
Singapore
Prior art keywords
electroplating
nonconductive surface
nonconductive
electroplating nonconductive
Prior art date
Application number
SG1996005161A
Inventor
Yoshihiro Sakamoto
Sachiko Nakamura
Original Assignee
Mec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mec Co Ltd filed Critical Mec Co Ltd
Publication of SG52489A1 publication Critical patent/SG52489A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
SG1996005161A 1993-01-29 1994-01-21 Process for electroplating nonconductive surface SG52489A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3240393 1993-01-29

Publications (1)

Publication Number Publication Date
SG52489A1 true SG52489A1 (en) 1998-09-28

Family

ID=12357996

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996005161A SG52489A1 (en) 1993-01-29 1994-01-21 Process for electroplating nonconductive surface

Country Status (5)

Country Link
CN (1) CN1093892C (en)
DE (1) DE4402413C2 (en)
GB (1) GB2274853B (en)
SG (1) SG52489A1 (en)
TW (1) TW222313B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07268682A (en) * 1994-03-28 1995-10-17 Mec Kk Method for electroplating surface of electric nonconductor
JP3481379B2 (en) * 1995-08-23 2003-12-22 メック株式会社 Electroplating method
GB2338715B (en) * 1998-06-24 2003-03-19 Hang Fung Jewellery Co Ltd A method of depositing a metal on an article
US6375731B1 (en) * 2000-01-06 2002-04-23 Electrochemicals Inc. Conditioning of through holes and glass
CN105231604A (en) * 2014-05-27 2016-01-13 中色金银贸易中心有限公司 Gold jewelry
CN114351197B (en) * 2021-11-30 2023-04-28 武汉格智新材料有限公司 Graphite shadow metallization auxiliary agent and preparation method and application thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB476042A (en) * 1936-03-27 1937-11-29 Albert Henry Stuart Improvements in and relating to coating compositions and the coating of surfaces
US3163588A (en) * 1955-02-14 1964-12-29 Technograph Printed Electronic Method of interconnecting pathway patterns of printed circuit products
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
US4619741A (en) * 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
US4964959A (en) * 1990-04-12 1990-10-23 Olin Hunt Specialty Products Inc. Process for preparing a nonconductive substrate for electroplating
JPH06506984A (en) * 1991-04-22 1994-08-04 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング Method for selectively coating a nonconductor with carbon particles and use of a copper-containing solution in the method
US5139642A (en) * 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating
JP3118103B2 (en) * 1992-12-21 2000-12-18 矢崎総業株式会社 Conductive member for electric circuit, electric circuit body and method of manufacturing the same
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating

Also Published As

Publication number Publication date
GB2274853A (en) 1994-08-10
DE4402413C2 (en) 1998-08-06
CN1093892C (en) 2002-11-06
GB9401134D0 (en) 1994-03-16
CN1092118A (en) 1994-09-14
DE4402413A1 (en) 1994-08-04
TW222313B (en) 1994-04-11
GB2274853B (en) 1996-05-15

Similar Documents

Publication Publication Date Title
GB2287958B (en) Process for electroplating nonconductive surface
SG53044A1 (en) Tin electroplating process
IL108936A (en) Electrolytic producer apparatus
SG47508A1 (en) Interlace printing process
EP0701436A4 (en) Process
AU2001692A (en) Improved process for preparing a nonconductive substrate for electroplating
EP0298298A3 (en) Electroplating process
EP0905285A4 (en) Method for electroplating nonconductive material
GB2234260B (en) Electroplating process
AU6539090A (en) Improved process for preparing a nonconductive substrate for electroplating
GB9002638D0 (en) Electrolytic process
GB2247468B (en) Electroplating process
PL339776A1 (en) Electroplating process
AU5536090A (en) Process for electroplating metals
GB2279280B (en) Apparatus for surface machining
SG52489A1 (en) Process for electroplating nonconductive surface
EP0405222A3 (en) Alpha-olefin process
SG47086A1 (en) Hydrotreating process
EP0472936A3 (en) Process for modifying surfaces
GB9300309D0 (en) Process
GB9308152D0 (en) Plating processes
HU910713D0 (en) Electrolytic granulating method
HK200096A (en) Electroplating process
EP0523580A3 (en) Process for chromium electroplating
SG68543A1 (en) Automated electroplating process