SG44517A1 - Method of forming solder mask - Google Patents

Method of forming solder mask

Info

Publication number
SG44517A1
SG44517A1 SG1996001299A SG1996001299A SG44517A1 SG 44517 A1 SG44517 A1 SG 44517A1 SG 1996001299 A SG1996001299 A SG 1996001299A SG 1996001299 A SG1996001299 A SG 1996001299A SG 44517 A1 SG44517 A1 SG 44517A1
Authority
SG
Singapore
Prior art keywords
solder mask
forming solder
forming
mask
solder
Prior art date
Application number
SG1996001299A
Other languages
English (en)
Inventor
Yoshikazu Yamagami
Akio Kashihara
Mamoru Seio
Hisaki Tanabe
Original Assignee
Nippon Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Paint Co Ltd filed Critical Nippon Paint Co Ltd
Publication of SG44517A1 publication Critical patent/SG44517A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1355—Powder coating of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
SG1996001299A 1991-11-06 1992-11-06 Method of forming solder mask SG44517A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28983991 1991-11-06
JP10095692 1992-04-21

Publications (1)

Publication Number Publication Date
SG44517A1 true SG44517A1 (en) 1997-12-19

Family

ID=26441890

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996001299A SG44517A1 (en) 1991-11-06 1992-11-06 Method of forming solder mask

Country Status (6)

Country Link
EP (2) EP0541111B1 (de)
KR (1) KR930010613A (de)
CA (1) CA2082328A1 (de)
DE (1) DE69218341T2 (de)
SG (1) SG44517A1 (de)
TW (1) TW287247B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5389497A (en) * 1992-06-03 1995-02-14 Nippon Paint Co., Ltd. Method for forming patterned solder mask
US6584123B1 (en) * 2000-01-03 2003-06-24 At&T Corp. Apparatus for utilizing spare E1 channels
WO2005094147A1 (en) * 2004-03-25 2005-10-06 Dsm Ip Assets B.V. A process of forming a solder mask
CN109076705A (zh) * 2016-04-19 2018-12-21 株式会社钟化 印刷电路板及其制造方法
CN113453439B (zh) * 2021-07-15 2022-11-11 吉安满坤科技股份有限公司 一种传感控制Touch技术印制电路板及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63246890A (ja) * 1987-04-02 1988-10-13 関西ペイント株式会社 プリント回路の形成方法
EP0286594A2 (de) * 1987-04-06 1988-10-12 Ciba-Geigy Ag Verfahren zur Herstellung von photostrukturierbaren Ueberzügen
GB8920540D0 (en) * 1989-09-11 1989-10-25 Coates Brothers Plc Resists

Also Published As

Publication number Publication date
TW287247B (de) 1996-10-01
KR930010613A (ko) 1993-06-22
DE69218341T2 (de) 1997-08-07
DE69218341D1 (de) 1997-04-24
EP0711105A2 (de) 1996-05-08
EP0541111B1 (de) 1997-03-19
EP0541111A1 (de) 1993-05-12
CA2082328A1 (en) 1993-05-07
EP0711105A3 (de) 1998-10-14

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