SG37187G - Thermal treatment apparatus and method - Google Patents

Thermal treatment apparatus and method

Info

Publication number
SG37187G
SG37187G SG371/87A SG37187A SG37187G SG 37187 G SG37187 G SG 37187G SG 371/87 A SG371/87 A SG 371/87A SG 37187 A SG37187 A SG 37187A SG 37187 G SG37187 G SG 37187G
Authority
SG
Singapore
Prior art keywords
treatment apparatus
thermal treatment
thermal
treatment
Prior art date
Application number
SG371/87A
Other languages
English (en)
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of SG37187G publication Critical patent/SG37187G/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/12—Travelling or movable supports or containers for the charge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J4/00—Feed or outlet devices; Feed or outlet control devices
    • B01J4/001—Feed or outlet devices as such, e.g. feeding tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/02—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated of multiple-chamber type

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG371/87A 1981-10-07 1987-04-23 Thermal treatment apparatus and method SG37187G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56158822A JPS5862489A (ja) 1981-10-07 1981-10-07 ソフトランデイング装置

Publications (1)

Publication Number Publication Date
SG37187G true SG37187G (en) 1987-07-24

Family

ID=15680128

Family Applications (1)

Application Number Title Priority Date Filing Date
SG371/87A SG37187G (en) 1981-10-07 1987-04-23 Thermal treatment apparatus and method

Country Status (8)

Country Link
US (1) US4468195A (zh)
JP (1) JPS5862489A (zh)
KR (1) KR910001908B1 (zh)
DE (1) DE3237047A1 (zh)
GB (1) GB2109519B (zh)
HK (2) HK71487A (zh)
MY (1) MY8700607A (zh)
SG (1) SG37187G (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208824A (ja) * 1983-05-12 1984-11-27 ノ−トン・カンパニ− 半導体部材等の加熱装置
US4557657A (en) * 1983-10-05 1985-12-10 Advanced Semiconductor Materials America, Inc. Article handling apparatus and method
US4620832A (en) * 1984-03-07 1986-11-04 Motion Manufacturing, Inc. Furnace loading system
GB8410251D0 (en) * 1984-04-19 1984-05-31 Heraeus Schott Quarzschmelze Handling semiconductor wafers
US4543059A (en) * 1984-07-18 1985-09-24 Quartz Engineering & Materials, Inc. Slotted cantilever diffusion tube system and method and apparatus for loading
US4752219A (en) * 1984-10-04 1988-06-21 Btu Engineering Corporation Wafer softlanding system and cooperative door assembly
US4671726A (en) * 1984-11-07 1987-06-09 Breed Corporation Cantilevered soft landing boat loader for semiconductor processing furnaces
US4624638A (en) * 1984-11-29 1986-11-25 Btu Engineering Corporation CVD boat loading mechanism having a separable, low profile cantilevered paddle assembly
US4636140A (en) * 1985-04-03 1987-01-13 Thermco Systems, Inc. Method of loading and unloading a furnace
US4721424A (en) * 1985-04-03 1988-01-26 Thermco Systems, Inc. Semiconductor wafer boat loader releaseable mounting
US4872799A (en) * 1985-05-16 1989-10-10 Btu Engineering Corporation Boat transfer and queuing furnace elevator and method
JPS61283117A (ja) * 1985-06-10 1986-12-13 Toshiba Ceramics Co Ltd 石英ガラス製ウエハボ−ト搬送治具
JPS6298616A (ja) * 1985-10-25 1987-05-08 Hitachi Tokyo Electron Co Ltd 処理装置
US4767251A (en) * 1986-05-06 1988-08-30 Amtech Systems, Inc. Cantilever apparatus and method for loading wafer boats into cantilever diffusion tubes
JPH01110722A (ja) * 1987-10-23 1989-04-27 Tel Sagami Ltd 半導体ウェアの搬入方法
JP2660206B2 (ja) * 1987-11-18 1997-10-08 東京エレクトロン株式会社 熱処理装置
KR0133678B1 (ko) * 1987-11-18 1998-04-23 후세 노보루 피열처리체를 로에 출입시키는 방법 및 그 장치
JPH01187811A (ja) * 1988-01-22 1989-07-27 Tel Sagami Ltd ソフトランディング装置用搬送治具およびソフトランディング装置
US5069591A (en) * 1988-03-24 1991-12-03 Tel Sagami Limited Semiconductor wafer-processing apparatus
KR0148384B1 (ko) * 1990-09-26 1998-12-01 이노우에 다케시 종형열처리장치
US5163832A (en) * 1990-10-30 1992-11-17 Tokyo Electron Sagami Limited Vertical heat-treating apparatus
IT226255Z2 (it) * 1992-02-18 1997-06-02 Miralfin Srl Struttura di radiatore particolarmente per il riscaldamento di locali
US5461214A (en) * 1992-06-15 1995-10-24 Thermtec, Inc. High performance horizontal diffusion furnace system
US6133550A (en) * 1996-03-22 2000-10-17 Sandia Corporation Method and apparatus for thermal processing of semiconductor substrates
US6030167A (en) * 1997-08-12 2000-02-29 United Microeletronics Corp. Apparatus for loading wafers into a horizontal quartz tube
KR101054016B1 (ko) * 2009-08-25 2011-08-03 (주)리드엔지니어링 태양전지 제조용 확산장치의 로더 스테이션
RU2768810C1 (ru) * 2020-11-02 2022-03-24 Общество с ограниченной ответственностью ТОРГОВЫЙ ДОМ "ЭЛЕКТРОМАШ" (ООО ТД "ЭЛЕКТРОМАШ") Установка обжиговая с камерой дожига

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE117143C (zh) *
ES378214A1 (es) * 1969-05-19 1973-01-01 Ibm Un sistema para tratar material, especialmente semiconduc- tor.
US3710757A (en) * 1970-12-09 1973-01-16 Texas Instruments Inc Continuous deposition system
US3749383A (en) * 1971-04-29 1973-07-31 Rca Corp Apparatus for processing semiconductor devices
US3790404A (en) * 1972-06-19 1974-02-05 Ibm Continuous vapor processing apparatus and method
DD117143A1 (zh) * 1974-06-04 1975-12-20
US4008815A (en) * 1975-04-14 1977-02-22 Applied Materials, Inc. Reactor loading apparatus
US4075972A (en) * 1975-08-20 1978-02-28 Nippondenso Co., Ltd. Apparatus for thermal diffusion of semiconductor devices
DE2830589C2 (de) * 1978-07-12 1985-04-18 Ibm Deutschland Gmbh, 7000 Stuttgart Durchlaufofen zum Prozessieren von Halbleiterplättchen

Also Published As

Publication number Publication date
JPS5862489A (ja) 1983-04-13
HK70487A (en) 1987-10-09
KR840002158A (ko) 1984-06-11
MY8700607A (en) 1987-12-31
DE3237047A1 (de) 1983-05-26
GB2109519B (en) 1986-02-05
GB2109519A (en) 1983-06-02
KR910001908B1 (en) 1991-03-30
HK71487A (en) 1987-10-09
JPH0227592B2 (zh) 1990-06-18
US4468195A (en) 1984-08-28

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