SG33785G - Hermetically sealed package - Google Patents
Hermetically sealed packageInfo
- Publication number
- SG33785G SG33785G SG337/85A SG33785A SG33785G SG 33785 G SG33785 G SG 33785G SG 337/85 A SG337/85 A SG 337/85A SG 33785 A SG33785 A SG 33785A SG 33785 G SG33785 G SG 33785G
- Authority
- SG
- Singapore
- Prior art keywords
- hermetically sealed
- sealed package
- package
- hermetically
- sealed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55121624A JPS5745955A (en) | 1980-09-02 | 1980-09-02 | Sealing container |
Publications (1)
Publication Number | Publication Date |
---|---|
SG33785G true SG33785G (en) | 1986-05-02 |
Family
ID=14815861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG337/85A SG33785G (en) | 1980-09-02 | 1985-05-02 | Hermetically sealed package |
Country Status (6)
Country | Link |
---|---|
US (1) | US4420652A (xx) |
JP (1) | JPS5745955A (xx) |
DE (1) | DE3134557A1 (xx) |
GB (1) | GB2086140B (xx) |
HK (1) | HK57085A (xx) |
SG (1) | SG33785G (xx) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1281810C (en) * | 1984-02-20 | 1991-03-19 | Stephen P. Rogerson | Mounting of saw devices |
US4577056A (en) * | 1984-04-09 | 1986-03-18 | Olin Corporation | Hermetically sealed metal package |
US4654472A (en) * | 1984-12-17 | 1987-03-31 | Samuel Goldfarb | Electronic component package with multiconductive base forms for multichannel mounting |
FR2587857B1 (fr) * | 1985-09-24 | 1987-12-24 | Centre Nat Rech Scient | Oscillateur thermostate miniature |
JPS6386554A (ja) * | 1986-09-30 | 1988-04-16 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | 電子的パッケ−ジ |
US4945399A (en) * | 1986-09-30 | 1990-07-31 | International Business Machines Corporation | Electronic package with integrated distributed decoupling capacitors |
US4792880A (en) * | 1986-10-03 | 1988-12-20 | Westinghouse Electric Corp. | Terminal module |
US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
US5032692A (en) * | 1989-05-09 | 1991-07-16 | Avx Corporation | Process for manufactoring hermetic high temperature filter packages and the products produced thereby |
DE4014918A1 (de) * | 1990-05-10 | 1991-11-14 | Grundfos Int | Elektromotor |
DE4217837B4 (de) * | 1991-05-29 | 2006-04-27 | Mitsubishi Denki K.K. | Hermetisch abgeschlossenes Gehäuse |
JP2667104B2 (ja) * | 1993-08-04 | 1997-10-27 | 飯島精密工業株式会社 | 円筒の精度検査装置 |
JPH0718381U (ja) * | 1993-09-06 | 1995-03-31 | 住友電装株式会社 | コネクタ |
DE4419439C2 (de) * | 1994-06-03 | 1997-09-11 | Philips Patentverwaltung | Anordnung mit einem elektrische Bauelemente enthaltenden Behälter und einer weitere Bauelemente tragenden Leiterplatte |
US5500628A (en) * | 1995-01-24 | 1996-03-19 | Motorola, Inc. | Double-sided oscillator package and method of coupling components thereto |
US5620476A (en) * | 1995-11-13 | 1997-04-15 | Pacesetter, Inc. | Implantable medical device having shielded and filtered feedthrough assembly and methods for making such assembly |
WO1998001732A1 (en) * | 1996-07-09 | 1998-01-15 | Panex Corporation | Quartz transducer |
US6121678A (en) | 1997-12-19 | 2000-09-19 | Stmicroelectronics, Inc. | Wrap-around interconnect for fine pitch ball grid array |
US6349025B1 (en) | 1999-11-30 | 2002-02-19 | Medtronic, Inc. | Leak testable capacitive filtered feedthrough for an implantable medical device |
US6414835B1 (en) | 2000-03-01 | 2002-07-02 | Medtronic, Inc. | Capacitive filtered feedthrough array for an implantable medical device |
US6590158B1 (en) * | 2002-03-15 | 2003-07-08 | Alstom Schilling Robotics | Pressure container with layered seal assembly |
DE10236278A1 (de) * | 2002-08-08 | 2004-02-26 | Schott Glas | Hermetisches TO-Gehäuse mit Keramikanschluss für erhöhte Datenraten |
EP1711233B1 (en) | 2004-01-14 | 2010-05-26 | Royce Mckim | Automatic stove top fire suppression module |
US6992251B1 (en) * | 2004-08-31 | 2006-01-31 | Sung Jung Minute Industry Co., Ltd. | Rectification chip terminal structure |
US20110048770A1 (en) | 2009-08-31 | 2011-03-03 | Medtronic Inc. | Injection molded ferrule for cofired feedthroughs |
US8644002B2 (en) | 2011-05-31 | 2014-02-04 | Medtronic, Inc. | Capacitor including registration feature for aligning an insulator layer |
US20130058004A1 (en) | 2011-09-01 | 2013-03-07 | Medtronic, Inc. | Feedthrough assembly including underfill access channel and electrically insulating material |
US8644936B2 (en) | 2012-01-09 | 2014-02-04 | Medtronic, Inc. | Feedthrough assembly including electrical ground through feedthrough substrate |
USD817376S1 (en) | 2015-12-08 | 2018-05-08 | Carl Zeiss Sports Optics Gmbh | Spotting scope |
USD818512S1 (en) | 2015-12-08 | 2018-05-22 | Carl Zeiss Sports Optics Gmbh | Spotting scope |
US10765428B2 (en) | 2016-08-15 | 2020-09-08 | Covidien Lp | Hermetic force sensors for surgical devices |
US10345165B2 (en) | 2016-09-08 | 2019-07-09 | Covidien Lp | Force sensor for surgical devices |
EP3381510A1 (en) | 2017-03-27 | 2018-10-03 | Greatbatch Ltd. | Feedthrough assembly and flexible substrate assembly therefor |
US10973142B2 (en) | 2017-05-18 | 2021-04-06 | Covidien Lp | Hermetically sealed printed circuit boards |
US10667408B2 (en) | 2017-05-18 | 2020-05-26 | Covidien Lp | Fully encapsulated electronics and printed circuit boards |
US10588231B2 (en) | 2017-05-18 | 2020-03-10 | Covidien Lp | Hermetically sealed printed circuit boards |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3339117A (en) * | 1965-03-18 | 1967-08-29 | Cons Electronics Ind | Printed circuit board forming closure for electrical relay |
US3828210A (en) * | 1973-01-22 | 1974-08-06 | Motorola Inc | Temperature compensated mounting structure for coupled resonator crystals |
US4152671A (en) * | 1977-07-25 | 1979-05-01 | Atari, Inc. | Oscillator-modulator apparatus and method therefor |
DE2936715C2 (de) * | 1979-09-11 | 1983-11-24 | Siemens AG, 1000 Berlin und 8000 München | Geschirmte Baugruppe |
-
1980
- 1980-09-02 JP JP55121624A patent/JPS5745955A/ja active Granted
-
1981
- 1981-08-27 GB GB8126170A patent/GB2086140B/en not_active Expired
- 1981-08-28 US US06/297,411 patent/US4420652A/en not_active Expired - Fee Related
- 1981-09-01 DE DE19813134557 patent/DE3134557A1/de active Granted
-
1985
- 1985-05-02 SG SG337/85A patent/SG33785G/en unknown
- 1985-08-01 HK HK570/85A patent/HK57085A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE3134557C2 (xx) | 1987-10-15 |
GB2086140A (en) | 1982-05-06 |
DE3134557A1 (de) | 1982-06-24 |
US4420652A (en) | 1983-12-13 |
JPS5745955A (en) | 1982-03-16 |
JPS6119116B2 (xx) | 1986-05-15 |
HK57085A (en) | 1985-08-09 |
GB2086140B (en) | 1984-05-10 |
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