SG188295A1 - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- SG188295A1 SG188295A1 SG2013013933A SG2013013933A SG188295A1 SG 188295 A1 SG188295 A1 SG 188295A1 SG 2013013933 A SG2013013933 A SG 2013013933A SG 2013013933 A SG2013013933 A SG 2013013933A SG 188295 A1 SG188295 A1 SG 188295A1
- Authority
- SG
- Singapore
- Prior art keywords
- housing
- assembly
- connector assembly
- recited
- display
- Prior art date
Links
- 238000007789 sealing Methods 0.000 claims abstract description 47
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 239000006059 cover glass Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 37
- 230000001681 protective effect Effects 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 230000007246 mechanism Effects 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 11
- 229910001220 stainless steel Inorganic materials 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 8
- 238000003384 imaging method Methods 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 3
- 238000011109 contamination Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000004044 response Effects 0.000 claims 1
- 230000008685 targeting Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 description 34
- 238000005452 bending Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 14
- 239000007767 bonding agent Substances 0.000 description 11
- 230000006870 function Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000011213 glass-filled polymer Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000013500 data storage Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 240000007643 Phytolacca americana Species 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
- H01R13/504—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0221—Laser welding
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Casings For Electric Apparatus (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Telephone Set Structure (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37889510P | 2010-08-31 | 2010-08-31 | |
| US37884310P | 2010-08-31 | 2010-08-31 | |
| US37873510P | 2010-08-31 | 2010-08-31 | |
| US12/984,241 US8632363B2 (en) | 2010-08-31 | 2011-01-04 | Heat sealed connector assembly |
| US13/014,430 US8872997B2 (en) | 2010-08-31 | 2011-01-26 | Display assembly |
| US13/098,367 US8388385B2 (en) | 2010-08-31 | 2011-04-29 | Connector assembly |
| PCT/US2011/048471 WO2012030563A1 (fr) | 2010-08-31 | 2011-08-19 | Dispositif électronique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG188295A1 true SG188295A1 (en) | 2013-04-30 |
Family
ID=45773207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013013933A SG188295A1 (en) | 2010-08-31 | 2011-08-19 | Electronic device |
Country Status (4)
| Country | Link |
|---|---|
| CN (2) | CN202678556U (fr) |
| BR (1) | BR112013004953A2 (fr) |
| SG (1) | SG188295A1 (fr) |
| WO (1) | WO2012030563A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9137918B2 (en) * | 2012-09-28 | 2015-09-15 | Htc Corporation | Electronic apparatus and method for assembling the same |
| US9047044B2 (en) | 2012-10-19 | 2015-06-02 | Apple Inc. | Trimless glass enclosure interface |
| US9743536B2 (en) | 2014-11-24 | 2017-08-22 | Microsoft Technology Licensing, Llc | Mobile device assembly |
| CN111491475B (zh) * | 2020-04-29 | 2021-06-01 | 广东电网有限责任公司东莞供电局 | 具有加热功能的电箱 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3914502A (en) * | 1973-02-02 | 1975-10-21 | Toyo Boseki | Heat-adhesive laminated film |
| US5151327A (en) * | 1990-03-15 | 1992-09-29 | Nitto Denko Corporation | Adhesive sheet for reinforcing thin rigid plates |
| US5427535A (en) * | 1993-09-24 | 1995-06-27 | Aries Electronics, Inc. | Resilient electrically conductive terminal assemblies |
| ES2172082T3 (es) * | 1993-11-10 | 2002-09-16 | Minnesota Mining & Mfg | Estratificado adhesivo. |
| US6554646B1 (en) * | 1998-12-14 | 2003-04-29 | Berg Electronics Group, Inc. | Electrical connector assembly |
| US5967846A (en) * | 1997-04-22 | 1999-10-19 | The Whitaker Corporation | Shields for electrical connector mated pair |
| JP2000068295A (ja) * | 1998-08-25 | 2000-03-03 | Tomoegawa Paper Co Ltd | 電子部品用接着フィルム |
| JP2000323233A (ja) * | 1999-05-10 | 2000-11-24 | Molex Inc | コネクタ装置 |
| WO2000077887A1 (fr) * | 1999-06-16 | 2000-12-21 | Fci 's-Hertogenbosch B.V. | Connecteur, procede de fabrication d'un tel connecteur, et element de contact pour un connecteur |
| KR100863998B1 (ko) * | 2002-06-19 | 2008-10-16 | 삼성전자주식회사 | 액정표시모듈 및 이를 이용한 액정표시장치 |
| CN2932689Y (zh) * | 2006-04-10 | 2007-08-08 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
| JP2009036842A (ja) * | 2007-07-31 | 2009-02-19 | Nec Lcd Technologies Ltd | 表示装置 |
| US8472203B2 (en) * | 2007-09-04 | 2013-06-25 | Apple Inc. | Assembly of a handheld electronic device |
| US7841910B2 (en) * | 2007-11-06 | 2010-11-30 | Apple Inc. | Mini displayport |
| US8537543B2 (en) * | 2008-04-11 | 2013-09-17 | Apple Inc. | Portable electronic device housing structures |
| US7697281B2 (en) * | 2008-09-05 | 2010-04-13 | Apple Inc. | Handheld computing device |
| EP2178020A1 (fr) * | 2008-10-17 | 2010-04-21 | Gemalto SA | Procédé d'assemblage d'un module SIM, connecteur associé, et dispositif comprenant un tel module |
| CN201498790U (zh) * | 2009-08-25 | 2010-06-02 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
-
2011
- 2011-08-19 SG SG2013013933A patent/SG188295A1/en unknown
- 2011-08-19 BR BR112013004953A patent/BR112013004953A2/pt not_active IP Right Cessation
- 2011-08-19 WO PCT/US2011/048471 patent/WO2012030563A1/fr active Application Filing
- 2011-08-31 CN CN 201120451888 patent/CN202678556U/zh not_active Expired - Fee Related
- 2011-08-31 CN CN201110362127.4A patent/CN102544887B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN202678556U (zh) | 2013-01-16 |
| CN102544887B (zh) | 2015-12-16 |
| CN102544887A (zh) | 2012-07-04 |
| BR112013004953A2 (pt) | 2016-08-16 |
| WO2012030563A1 (fr) | 2012-03-08 |
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