SG157241A1 - Method and apparatus for integrated circuit inspection - Google Patents
Method and apparatus for integrated circuit inspectionInfo
- Publication number
- SG157241A1 SG157241A1 SG200803699-8A SG2008036998A SG157241A1 SG 157241 A1 SG157241 A1 SG 157241A1 SG 2008036998 A SG2008036998 A SG 2008036998A SG 157241 A1 SG157241 A1 SG 157241A1
- Authority
- SG
- Singapore
- Prior art keywords
- substrates
- integrated circuit
- circuit inspection
- receiving rack
- inspection
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
- G01N35/026—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations having blocks or racks of reaction cells or cuvettes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/00029—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor provided with flat sample substrates, e.g. slides
- G01N2035/00089—Magazines
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
A system for inspection and collating substrates comprising a receiving rack in communication with a reflow oven; said receiving rack arranged to receive a plurality of substrates from said reflow oven; an inspection device for inspecting said substrates and recording a status of each inspected substrate; a collector for receiving said substrates from said receiving rack, the collector including a racking device for collating the substrates according to the recorded status. Figure 2B
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200803699-8A SG157241A1 (en) | 2008-05-13 | 2008-05-13 | Method and apparatus for integrated circuit inspection |
PCT/SG2009/000172 WO2009139728A1 (en) | 2008-05-13 | 2009-05-13 | Method and apparatus for integrated circuit inspection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200803699-8A SG157241A1 (en) | 2008-05-13 | 2008-05-13 | Method and apparatus for integrated circuit inspection |
Publications (1)
Publication Number | Publication Date |
---|---|
SG157241A1 true SG157241A1 (en) | 2009-12-29 |
Family
ID=41318934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200803699-8A SG157241A1 (en) | 2008-05-13 | 2008-05-13 | Method and apparatus for integrated circuit inspection |
Country Status (2)
Country | Link |
---|---|
SG (1) | SG157241A1 (en) |
WO (1) | WO2009139728A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN211965066U (en) * | 2020-04-23 | 2020-11-20 | 苏州必为智能控制科技有限公司 | Visual defect detection equipment |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0318769A (en) * | 1989-06-15 | 1991-01-28 | Tanaka Kikinzoku Kogyo Kk | Automatic wiring inspecting machine |
JPH03229499A (en) * | 1990-02-05 | 1991-10-11 | Taiyo Yuden Co Ltd | Apparatus for visual inspection of electronic circuit board |
JP2002368500A (en) * | 2001-06-04 | 2002-12-20 | Fuji Photo Film Co Ltd | Printed-wiring board inspection apparatus |
-
2008
- 2008-05-13 SG SG200803699-8A patent/SG157241A1/en unknown
-
2009
- 2009-05-13 WO PCT/SG2009/000172 patent/WO2009139728A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2009139728A1 (en) | 2009-11-19 |
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