SG155084A1 - Thermally and electrically conductive and adhesive composition for semiconductor packaging - Google Patents
Thermally and electrically conductive and adhesive composition for semiconductor packagingInfo
- Publication number
- SG155084A1 SG155084A1 SG200801685-9A SG2008016859A SG155084A1 SG 155084 A1 SG155084 A1 SG 155084A1 SG 2008016859 A SG2008016859 A SG 2008016859A SG 155084 A1 SG155084 A1 SG 155084A1
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive composition
- electrically conductive
- thermally
- semiconductor packaging
- integers
- Prior art date
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Abstract
A heat and electrically conductive adhesive composition for die attach comprises of a filler comprising substantially of silver (Ag) aggregate, in an amount of 70 to 90% by weight of the adhesive composition; an epoxy resin in liquid form comprising at least two epoxy groups; a curing or hardening agent; and a silane coupling agent comprising at least a primary mercapto group. The silane coupling agent may comprise of sulfidosilane, preferably bis-sulfur silane, and may generally be represented by Formula 2 below: wherein: - R1 and R3 are each an alkoxyl group with 1 to 10 carbon atoms, wherein R1 and R3 may or may not be the same; - R2 and R4 are each an alkyl group with 1 to 10 carbon atoms, wherein R2 and R4 may or may not be the same; - and b are integers of 1 to 3; - n is an integer of 2 to 4; and - m1 and m2 are integers of 1 to 5. There is no suitable figure to accompany the abstract.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200801685-9A SG155084A1 (en) | 2008-02-28 | 2008-02-28 | Thermally and electrically conductive and adhesive composition for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200801685-9A SG155084A1 (en) | 2008-02-28 | 2008-02-28 | Thermally and electrically conductive and adhesive composition for semiconductor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG155084A1 true SG155084A1 (en) | 2009-09-30 |
Family
ID=41212356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200801685-9A SG155084A1 (en) | 2008-02-28 | 2008-02-28 | Thermally and electrically conductive and adhesive composition for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| SG (1) | SG155084A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939077A (en) * | 2016-08-05 | 2022-01-14 | 藤森工业株式会社 | Conductive adhesive sheet for FPC and FPC |
-
2008
- 2008-02-28 SG SG200801685-9A patent/SG155084A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939077A (en) * | 2016-08-05 | 2022-01-14 | 藤森工业株式会社 | Conductive adhesive sheet for FPC and FPC |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PH12015501480A1 (en) | Thermally-conductive, electrically-conductive adhesive composition | |
| MY143836A (en) | Adhesive composition and ahdesive film therefrom | |
| SG195098A1 (en) | Resin composition, prepreg and laminate | |
| MY144047A (en) | Epoxy resin composition, process for providing latency to the composition and a semiconductor device | |
| EP2557103A4 (en) | Epoxy compound, curable composition, and cured product thereof | |
| EP2540759A3 (en) | Thermosetting resin composition and cured product of the same | |
| TW201129666A (en) | Adhesive composition for semiconductor device and die attach film | |
| ATE522577T1 (en) | THERMOPLASTIC POLYAMIDES WITH POLYETHERAMINES | |
| HK1142348A1 (en) | Epoxy resin composition | |
| PL2119737T3 (en) | Electronic packaging | |
| MY171190A (en) | Curable composition, cured product, and method for using curable composition | |
| MY157414A (en) | Epoxy resin composition and semiconductor device | |
| DE602006002808D1 (en) | HARDENABLE SILICONE COMPOSITION AND ELECTRONIC DEVICE MANUFACTURED THEREFROM | |
| TW200718750A (en) | Liquid epoxy resin composition | |
| TW200738770A (en) | Active energy ray-curable resin composition and use thereof | |
| MY148293A (en) | Epoxy resin composition for encapsulating semiconductor and semiconductor device | |
| TW200801062A (en) | Epoxy resin molding material for sealing and device of electronic part | |
| TW200513508A (en) | Epoxy compound, preparation method thereof, and use thereof | |
| MY152420A (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | |
| TW200420646A (en) | Epoxy resin compositions, methods of preparing, and articles made therefrom | |
| SG155084A1 (en) | Thermally and electrically conductive and adhesive composition for semiconductor packaging | |
| CN107841284A (en) | A kind of power type LED encapsulation glue | |
| WO2009011335A1 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device | |
| TW200740872A (en) | Liquid epoxy resin, epoxy resin composition, and cured article | |
| MY151085A (en) | Curable epoxy resin composition, cured body thereof, and use thereof |