SG148123A1 - Surface mount type electronic components - Google Patents

Surface mount type electronic components

Info

Publication number
SG148123A1
SG148123A1 SG200803812-7A SG2008038127A SG148123A1 SG 148123 A1 SG148123 A1 SG 148123A1 SG 2008038127 A SG2008038127 A SG 2008038127A SG 148123 A1 SG148123 A1 SG 148123A1
Authority
SG
Singapore
Prior art keywords
surface mount
type electronic
mount type
electronic components
degree
Prior art date
Application number
SG200803812-7A
Inventor
Naoshi Saito
Kiichi Kometani
Original Assignee
Ueno Fine Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Fine Chemical Ind filed Critical Ueno Fine Chemical Ind
Publication of SG148123A1 publication Critical patent/SG148123A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/02—Liquid crystal materials characterised by optical, electrical or physical properties of the components, in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2219/00—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used
    • C09K2219/01—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used in the form of fibres, e.g. fibres after polymerisation of LC precursor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
  • Details Of Resistors (AREA)

Abstract

SURFACE MOUNT TYPE ELECTRONIC COMPONENTS Provided is a surface mount type electronic component which is obtained by molding a liquid crystalline polymer composition comprising: 100 parts by weight of a wholly aromatic liquid crystalline polymer having a crystalline melting temperature of 310-410 degree C, and 5-100 parts by weight of a glass fiber having a number average diameter of 4-84m and a number average length of 100- 200 μm, wherein the LCP composition has a deflection temperature under load (DTUL) of 280-360 degree C.
SG200803812-7A 2007-05-14 2008-05-14 Surface mount type electronic components SG148123A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007128030A JP5230122B2 (en) 2007-05-14 2007-05-14 Electronic components for surface mounting

Publications (1)

Publication Number Publication Date
SG148123A1 true SG148123A1 (en) 2008-12-31

Family

ID=40123869

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200803812-7A SG148123A1 (en) 2007-05-14 2008-05-14 Surface mount type electronic components

Country Status (5)

Country Link
JP (1) JP5230122B2 (en)
KR (1) KR101484311B1 (en)
CN (1) CN101307174B (en)
SG (1) SG148123A1 (en)
TW (1) TWI456710B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6177191B2 (en) * 2014-05-30 2017-08-09 上野製薬株式会社 Liquid crystal polyester blend
CN109719422B (en) * 2017-10-27 2022-03-29 株式会社田村制作所 Solder composition and electronic substrate
US11917753B2 (en) * 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
EP3834980B1 (en) * 2019-12-10 2023-02-22 Heraeus Deutschland GmbH & Co. KG Solder paste
CN113201229A (en) * 2021-05-14 2021-08-03 金发科技股份有限公司 Liquid crystal polymer composite material and application thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227456A (en) * 1992-03-20 1993-07-13 Hoechst Celanese Corp. Wholly aromatic liquid crystalline polymers containing sulfonated ionic monomer units and laminates thereof
JP3487656B2 (en) * 1994-11-21 2004-01-19 ポリプラスチックス株式会社 Electronic components for surface mounting
JP4118425B2 (en) * 1998-12-18 2008-07-16 ポリプラスチックス株式会社 Liquid crystalline polymer composition for connector and connector
JP4339966B2 (en) 1999-07-23 2009-10-07 新日本石油株式会社 A thermotropic liquid crystal resin composition, a heating device support and a heat-resistant heat insulating material formed by molding the same.
JP2001279066A (en) * 2000-03-31 2001-10-10 Sumitomo Chem Co Ltd Liquid crystal polyester resin composition
JP2001288342A (en) * 2000-04-04 2001-10-16 Sumitomo Chem Co Ltd Liquid crystal polyester resin composition, method for producing the same and its molded product
TW538094B (en) * 2000-04-20 2003-06-21 Ueno Seiyaku Oyo Kenkyujo Kk Liquid crystal polyester resin composition
JP4644933B2 (en) * 2000-12-14 2011-03-09 住友化学株式会社 Method for producing molten liquid crystalline resin
JP4368079B2 (en) * 2001-10-30 2009-11-18 Ｄｉｃ株式会社 Liquid crystalline polyester resin composition
JP2003173848A (en) * 2001-12-05 2003-06-20 Idemitsu Petrochem Co Ltd Connector
JP2003268252A (en) * 2002-03-19 2003-09-25 Polyplastics Co Liquid crystalline polymer composition
US7164197B2 (en) * 2003-06-19 2007-01-16 3M Innovative Properties Company Dielectric composite material
JP4625340B2 (en) * 2005-01-31 2011-02-02 上野製薬株式会社 Liquid crystal polyester resin and method for producing the same
JP5085863B2 (en) * 2005-12-14 2012-11-28 上野製薬株式会社 Liquid crystal polymer composition
JP2007254716A (en) * 2006-02-27 2007-10-04 Toray Ind Inc Liquid crystalline resin composition and molded article consisting of the same
JP2008133416A (en) * 2006-10-26 2008-06-12 Matsushita Electric Works Ltd Liquid crystal polyester resin composition and connector

Also Published As

Publication number Publication date
TW200905818A (en) 2009-02-01
CN101307174B (en) 2013-05-29
CN101307174A (en) 2008-11-19
JP5230122B2 (en) 2013-07-10
KR101484311B1 (en) 2015-01-19
JP2008280478A (en) 2008-11-20
KR20080100790A (en) 2008-11-19
TWI456710B (en) 2014-10-11

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