SG144026A1 - Non-invasive thermal management processes for restorating metallic details bonded to substrates - Google Patents

Non-invasive thermal management processes for restorating metallic details bonded to substrates

Info

Publication number
SG144026A1
SG144026A1 SG200717190-3A SG2007171903A SG144026A1 SG 144026 A1 SG144026 A1 SG 144026A1 SG 2007171903 A SG2007171903 A SG 2007171903A SG 144026 A1 SG144026 A1 SG 144026A1
Authority
SG
Singapore
Prior art keywords
thermal management
metallic
bonding material
restorating
substrates
Prior art date
Application number
SG200717190-3A
Other languages
English (en)
Inventor
William Bogue
John M Robertson
Gary Shubert
Original Assignee
United Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Technologies Corp filed Critical United Technologies Corp
Publication of SG144026A1 publication Critical patent/SG144026A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/01—Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
SG200717190-3A 2006-12-12 2007-10-25 Non-invasive thermal management processes for restorating metallic details bonded to substrates SG144026A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/637,296 US7645479B2 (en) 2006-12-12 2006-12-12 Non-invasive thermal management processes for restorating metallic details bonded to substrates

Publications (1)

Publication Number Publication Date
SG144026A1 true SG144026A1 (en) 2008-07-29

Family

ID=39133771

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200717190-3A SG144026A1 (en) 2006-12-12 2007-10-25 Non-invasive thermal management processes for restorating metallic details bonded to substrates

Country Status (4)

Country Link
US (1) US7645479B2 (ja)
EP (1) EP1936001A3 (ja)
JP (1) JP2008161939A (ja)
SG (1) SG144026A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9541540B2 (en) 2012-10-04 2017-01-10 United Technologies Corporation Non-destructive test inspection method for evaluating thermal degradation of bismaleimide resin

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534371A (en) * 1995-05-22 1996-07-09 International Business Machines Corporation Repaired apertured laser metal mask
US5915743A (en) * 1997-06-30 1999-06-29 The Boeing Company Metal spray tool repair system

Also Published As

Publication number Publication date
US7645479B2 (en) 2010-01-12
US20080138511A1 (en) 2008-06-12
JP2008161939A (ja) 2008-07-17
EP1936001A2 (en) 2008-06-25
EP1936001A3 (en) 2011-07-20

Similar Documents

Publication Publication Date Title
TW200739671A (en) Method and structure for fabricating bonded substrates structure using thermal processing to remove oxygen species
DE602006020921D1 (de) Haftartikel, verbundartikel und herstellungsverfahren dafür
SG139648A1 (en) A method of direct bonding two substrates used in electronics, optics, or optoelectronics
TW200704622A (en) Bonded body, wafer support member using the same, and wafer treatment method
TW200725060A (en) Electro-optical device, electronic apparatus, protective member, and method of manufacturing protective member
WO2007057866A3 (en) Improved cleaning substrate
JP2012500325A5 (ja)
TW200744796A (en) Polishing pad, a polishing apparatus, and a process for using the polishing pad
WO2006081006A3 (en) Light polarizing products and method of making same
NZ613479A (en) Abrasive article and method of forming
WO2010025047A3 (en) Layered body and method for manufacturing thin substrate using the layered body
TW200746375A (en) Thermal interconnect and interface systems, methods of production and uses thereof
TW200712159A (en) Sticking member and method for sticking an optical article
TW200736781A (en) Pressure sensitive electrochromic device and method of fabricating the same
TW200640283A (en) Method of manufacturing an organic electronic device
TW200618096A (en) Method of grinding multilayer body and method of manufacturing solid state image pickup device
DK1856211T3 (da) Trykfremgangsmåde til fremstilling af partikelformige produkter
TW200741934A (en) Wafer-shaped measuring apparatus and method for manufacturing the same
WO2008146849A1 (ja) 熱剥離型粘着シート
SG144153A1 (en) Lithographic apparatus and device manufacturing method
DE602004019646D1 (de) Thermisch aktivierbare, entfernbare klebebänder
SG162785A1 (en) Microwave process for forming a coating
SG133541A1 (en) Method and material for cleaning a substrate
TW200738357A (en) Method and apparatus for cleaning a semiconductor substrate
JP2007025639A5 (ja)