SG130074A1 - Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices - Google Patents

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Info

Publication number
SG130074A1
SG130074A1 SG200505618-9A SG2005056189A SG130074A1 SG 130074 A1 SG130074 A1 SG 130074A1 SG 2005056189 A SG2005056189 A SG 2005056189A SG 130074 A1 SG130074 A1 SG 130074A1
Authority
SG
Singapore
Prior art keywords
methods
substrates
microelectronic
forming
packaging
Prior art date
Application number
SG200505618-9A
Inventor
Chin Hui Chong
Choon Kuan Lee
David J Corisis
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200505618-9A priority Critical patent/SG130074A1/en
Publication of SG130074A1 publication Critical patent/SG130074A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Abstract

Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes forming a conductive trace on a first side of a sheet of non-conductive material, and forming a via through the non-conductive material from a second side of the sheet to the conductive trace. The method further includes removing a section of the non-conductive material to form an edge of the non-conductive material extending across at least a portion of the via. In one embodiment, forming the edge across the via exposes at least a portion of the second conductive trace for subsequent attachment to a terminal on a microelectronic die.
SG200505618-9A 2005-09-01 2005-09-01 Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices SG130074A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200505618-9A SG130074A1 (en) 2005-09-01 2005-09-01 Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200505618-9A SG130074A1 (en) 2005-09-01 2005-09-01 Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Publications (1)

Publication Number Publication Date
SG130074A1 true SG130074A1 (en) 2007-03-20

Family

ID=38787688

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200505618-9A SG130074A1 (en) 2005-09-01 2005-09-01 Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Country Status (1)

Country Link
SG (1) SG130074A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6214641B1 (en) * 1996-06-25 2001-04-10 Micron Technology, Inc. Method of fabricating a multi-chip module
US20030116866A1 (en) * 2001-12-20 2003-06-26 Cher 'khng Victor Tan Semiconductor package having substrate with multi-layer metal bumps
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US20030164303A1 (en) * 2002-03-04 2003-09-04 Fu-Yu Huang Method of metal electro-plating for IC package substrate
US20050112871A1 (en) * 2000-05-31 2005-05-26 Micron Technology, Inc. Multilevel copper interconnect with double passivation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6214641B1 (en) * 1996-06-25 2001-04-10 Micron Technology, Inc. Method of fabricating a multi-chip module
US20050112871A1 (en) * 2000-05-31 2005-05-26 Micron Technology, Inc. Multilevel copper interconnect with double passivation
US20030116866A1 (en) * 2001-12-20 2003-06-26 Cher 'khng Victor Tan Semiconductor package having substrate with multi-layer metal bumps
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US20030164303A1 (en) * 2002-03-04 2003-09-04 Fu-Yu Huang Method of metal electro-plating for IC package substrate

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