SG122823A1 - Rapid temperature compensation module for semiconductor tool - Google Patents

Rapid temperature compensation module for semiconductor tool

Info

Publication number
SG122823A1
SG122823A1 SG200403376A SG200403376A SG122823A1 SG 122823 A1 SG122823 A1 SG 122823A1 SG 200403376 A SG200403376 A SG 200403376A SG 200403376 A SG200403376 A SG 200403376A SG 122823 A1 SG122823 A1 SG 122823A1
Authority
SG
Singapore
Prior art keywords
temperature compensation
compensation module
rapid temperature
semiconductor tool
semiconductor
Prior art date
Application number
SG200403376A
Other languages
English (en)
Inventor
Hsueh-Chang Wu
Chih-Tien Chang
Jhi-Cherng Lu
Bing-Hung Chen
Mei-Sheng Zhou
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Publication of SG122823A1 publication Critical patent/SG122823A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/04—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/06—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B5/14—Arrangements of heating devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/06—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B5/18—Arrangement of controlling, monitoring, alarm or like devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D21/00—Arrangements of monitoring devices; Arrangements of safety devices
    • F27D21/0014—Devices for monitoring temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F27D2019/0028—Regulation
    • F27D2019/0034—Regulation through control of a heating quantity such as fuel, oxidant or intensity of current
    • F27D2019/0037—Quantity of electric current

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
SG200403376A 2004-01-05 2004-06-17 Rapid temperature compensation module for semiconductor tool SG122823A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/753,253 US20050145614A1 (en) 2004-01-05 2004-01-05 Rapid temperature compensation module for semiconductor tool

Publications (1)

Publication Number Publication Date
SG122823A1 true SG122823A1 (en) 2006-06-29

Family

ID=34711760

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200403376A SG122823A1 (en) 2004-01-05 2004-06-17 Rapid temperature compensation module for semiconductor tool

Country Status (4)

Country Link
US (1) US20050145614A1 (zh)
CN (2) CN1638031A (zh)
SG (1) SG122823A1 (zh)
TW (1) TWI249187B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070221125A1 (en) * 2006-03-24 2007-09-27 Tokyo Electron Limited Semiconductor processing system with wireless sensor network monitoring system incorporated therewith
US8026113B2 (en) * 2006-03-24 2011-09-27 Tokyo Electron Limited Method of monitoring a semiconductor processing system using a wireless sensor network
US8490432B2 (en) * 2009-11-30 2013-07-23 Corning Incorporated Method and apparatus for making a glass sheet with controlled heating
JP5644187B2 (ja) * 2010-05-31 2014-12-24 株式会社島津製作所 カラムオーブン
CN103137515B (zh) * 2011-11-23 2015-07-01 北京中电科电子装备有限公司 一种电主轴热漂移的控制装置、补偿方法及划片机
US8939760B2 (en) * 2012-02-09 2015-01-27 Applied Materials, Inc. Spike anneal residence time reduction in rapid thermal processing chambers
CN103338535A (zh) * 2013-06-13 2013-10-02 浙江光普太阳能科技有限公司 硅片测试前加热装置制作方法
CN104076842B (zh) * 2014-06-30 2016-10-26 北京七星华创电子股份有限公司 热处理设备的温度补偿方法、温度控制方法及系统
CN104102247B (zh) * 2014-06-30 2016-07-20 北京七星华创电子股份有限公司 热处理设备的温度补偿方法、温度控制方法及系统
US11802340B2 (en) * 2016-12-12 2023-10-31 Applied Materials, Inc. UHV in-situ cryo-cool chamber
CN111816594B (zh) * 2020-08-28 2022-12-02 上海华力微电子有限公司 快速热退火设备
CN112947634B (zh) * 2021-02-01 2022-12-30 泉芯集成电路制造(济南)有限公司 一种热盘温度调整方法及一种热盘装置
TWI773483B (zh) * 2021-08-12 2022-08-01 國立臺東專科學校 感測資料處理方法
EP4343250A1 (en) * 2022-09-20 2024-03-27 Datapaq Limited Internal data acquisition device for vacuum furnace

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5926615A (en) * 1997-07-08 1999-07-20 National Science Council Temperature compensation method for semiconductor wafers in rapid thermal processor using separated heat conducting rings as susceptors
US5841110A (en) * 1997-08-27 1998-11-24 Steag-Ast Gmbh Method and apparatus for improved temperature control in rapid thermal processing (RTP) systems
JP2000286200A (ja) * 1999-03-31 2000-10-13 Kokusai Electric Co Ltd 熱処理方法および熱処理装置
US6324341B1 (en) * 1999-04-30 2001-11-27 Advanced Micro Devices, Inc. Lot-to-lot rapid thermal processing (RTP) chamber preheat optimization
CA2285723C (en) * 1999-10-07 2009-09-15 Nova Chemicals Corporation Multimodal polyolefin pipe
DE10059665C1 (de) * 2000-12-01 2002-07-11 Steag Hamatech Ag Verfahren zum thermischen Behandeln von Substraten
US6768084B2 (en) * 2002-09-30 2004-07-27 Axcelis Technologies, Inc. Advanced rapid thermal processing (RTP) using a linearly-moving heating assembly with an axisymmetric and radially-tunable thermal radiation profile

Also Published As

Publication number Publication date
TW200523996A (en) 2005-07-16
CN1638031A (zh) 2005-07-13
CN2796093Y (zh) 2006-07-12
US20050145614A1 (en) 2005-07-07
TWI249187B (en) 2006-02-11

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