SG117493A1 - Integrated circuit chip packaging process - Google Patents

Integrated circuit chip packaging process

Info

Publication number
SG117493A1
SG117493A1 SG200402826A SG200402826A SG117493A1 SG 117493 A1 SG117493 A1 SG 117493A1 SG 200402826 A SG200402826 A SG 200402826A SG 200402826 A SG200402826 A SG 200402826A SG 117493 A1 SG117493 A1 SG 117493A1
Authority
SG
Singapore
Prior art keywords
integrated circuit
circuit chip
packaging process
chip packaging
integrated
Prior art date
Application number
SG200402826A
Inventor
Hsiung Liu Ming
Original Assignee
Lingsen Precision Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lingsen Precision Ind Ltd filed Critical Lingsen Precision Ind Ltd
Priority to SG200402826A priority Critical patent/SG117493A1/en
Publication of SG117493A1 publication Critical patent/SG117493A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
SG200402826A 2004-05-12 2004-05-12 Integrated circuit chip packaging process SG117493A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200402826A SG117493A1 (en) 2004-05-12 2004-05-12 Integrated circuit chip packaging process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200402826A SG117493A1 (en) 2004-05-12 2004-05-12 Integrated circuit chip packaging process

Publications (1)

Publication Number Publication Date
SG117493A1 true SG117493A1 (en) 2005-12-29

Family

ID=35668191

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200402826A SG117493A1 (en) 2004-05-12 2004-05-12 Integrated circuit chip packaging process

Country Status (1)

Country Link
SG (1) SG117493A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006673A (en) * 1989-12-07 1991-04-09 Motorola, Inc. Fabrication of pad array carriers from a universal interconnect structure
US5091770A (en) * 1990-05-18 1992-02-25 Fujitsu Limited Semiconductor device having a ceramic package
JPH07135270A (en) * 1993-11-11 1995-05-23 Hitachi Ltd Manufacture of semiconductor integrated circuit device
JP2002110716A (en) * 2000-09-29 2002-04-12 Kyocera Corp Manufacturing method of semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006673A (en) * 1989-12-07 1991-04-09 Motorola, Inc. Fabrication of pad array carriers from a universal interconnect structure
US5091770A (en) * 1990-05-18 1992-02-25 Fujitsu Limited Semiconductor device having a ceramic package
JPH07135270A (en) * 1993-11-11 1995-05-23 Hitachi Ltd Manufacture of semiconductor integrated circuit device
JP2002110716A (en) * 2000-09-29 2002-04-12 Kyocera Corp Manufacturing method of semiconductor device

Similar Documents

Publication Publication Date Title
GB2411765B (en) Integrated circuit package
EP1851799A4 (en) Integrated circuit chip package and method
TWI341015B (en) Cavity chip package
GB2455224B (en) Integrated circuit photodetetectors
TWI371921B (en) Semiconductor integrated circuit device
EP2021848A4 (en) Optically-enabled integrated circuit package
TWI315570B (en) Electronic package
EP1989739A4 (en) Multiple die integrated circuit package
EP1780782A4 (en) Apparatus for producing ic chip package
EP1782535A4 (en) High speed integrated circuit
HK1119482A1 (en) Integrated circuit package and its manufacturing process
EP1905081A4 (en) Multi-level interconnections for an integrated circuit chip
TWI372450B (en) Semiconductor package
GB0701007D0 (en) Integrated circuit chip that supports through-chip electromagnetic communication
SG136138A1 (en) Chip scale package with open substrate
GB0506556D0 (en) Communication semiconductor integrated circuit
EP2031510A4 (en) Semiconductor integrated circuit
EP1886389A4 (en) Integrated chip
SG109612A1 (en) Semiconductor integrated circuit
EP1933326A4 (en) Semiconductor integrated circuit
TWI317815B (en) Semiconductor package sorting method
TWI368055B (en) Lightwave circuit chip
AU2003232716A8 (en) An integrated circuit package
TWI341084B (en) Semiconductor integrated circuit
EP1953819A4 (en) Semiconductor package, electronic parts, and electronic device