SG114568A1 - Novel epoxy resin compositions - Google Patents

Novel epoxy resin compositions

Info

Publication number
SG114568A1
SG114568A1 SG200205614A SG200205614A SG114568A1 SG 114568 A1 SG114568 A1 SG 114568A1 SG 200205614 A SG200205614 A SG 200205614A SG 200205614 A SG200205614 A SG 200205614A SG 114568 A1 SG114568 A1 SG 114568A1
Authority
SG
Singapore
Prior art keywords
epoxy resin
resin compositions
novel epoxy
novel
compositions
Prior art date
Application number
SG200205614A
Inventor
Thian Ngan Ooi
Naoki Mogi
Fan Shin Hong
Original Assignee
Sumitomo Bakelite Singapore Pt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Singapore Pt filed Critical Sumitomo Bakelite Singapore Pt
Priority to SG200205614A priority Critical patent/SG114568A1/en
Publication of SG114568A1 publication Critical patent/SG114568A1/en

Links

SG200205614A 2002-09-17 2002-09-17 Novel epoxy resin compositions SG114568A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200205614A SG114568A1 (en) 2002-09-17 2002-09-17 Novel epoxy resin compositions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200205614A SG114568A1 (en) 2002-09-17 2002-09-17 Novel epoxy resin compositions

Publications (1)

Publication Number Publication Date
SG114568A1 true SG114568A1 (en) 2005-09-28

Family

ID=35125839

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200205614A SG114568A1 (en) 2002-09-17 2002-09-17 Novel epoxy resin compositions

Country Status (1)

Country Link
SG (1) SG114568A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0753667A (en) * 1993-08-11 1995-02-28 Toshiba Chem Corp Epoxy resin composition and sealed semiconductor device
JPH07179569A (en) * 1993-12-24 1995-07-18 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPH0940748A (en) * 1995-07-31 1997-02-10 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing
JP2000128960A (en) * 1998-10-22 2000-05-09 Nitto Denko Corp Epoxy resin composition for sealing semiconductor and semiconductor device using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0753667A (en) * 1993-08-11 1995-02-28 Toshiba Chem Corp Epoxy resin composition and sealed semiconductor device
JPH07179569A (en) * 1993-12-24 1995-07-18 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPH0940748A (en) * 1995-07-31 1997-02-10 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing
JP2000128960A (en) * 1998-10-22 2000-05-09 Nitto Denko Corp Epoxy resin composition for sealing semiconductor and semiconductor device using the same

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