SG114453A1 - Semiconductor device with a heat sink and method of producing the heat sink - Google Patents

Semiconductor device with a heat sink and method of producing the heat sink

Info

Publication number
SG114453A1
SG114453A1 SG9601276A SG1996001276A SG114453A1 SG 114453 A1 SG114453 A1 SG 114453A1 SG 9601276 A SG9601276 A SG 9601276A SG 1996001276 A SG1996001276 A SG 1996001276A SG 114453 A1 SG114453 A1 SG 114453A1
Authority
SG
Singapore
Prior art keywords
heat sink
producing
semiconductor device
sink
heat
Prior art date
Application number
SG9601276A
Inventor
Otsuki Tetsuya
Hama Norikata
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to SG9601276A priority Critical patent/SG114453A1/en
Publication of SG114453A1 publication Critical patent/SG114453A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SG9601276A 1994-12-16 1994-12-16 Semiconductor device with a heat sink and method of producing the heat sink SG114453A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9601276A SG114453A1 (en) 1994-12-16 1994-12-16 Semiconductor device with a heat sink and method of producing the heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9601276A SG114453A1 (en) 1994-12-16 1994-12-16 Semiconductor device with a heat sink and method of producing the heat sink

Publications (1)

Publication Number Publication Date
SG114453A1 true SG114453A1 (en) 2005-09-28

Family

ID=35125827

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9601276A SG114453A1 (en) 1994-12-16 1994-12-16 Semiconductor device with a heat sink and method of producing the heat sink

Country Status (1)

Country Link
SG (1) SG114453A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218046A (en) * 1985-07-16 1987-01-27 Toshiba Corp Semiconductor device
EP0548497A1 (en) * 1991-12-20 1993-06-30 STMicroelectronics S.r.l. Plastic encapsulated semiconductor device incorporating a heat sink of metal having controlled roughness contact surfaces, and method of making the same
JPH0653390A (en) * 1992-06-03 1994-02-25 Seiko Epson Corp Semiconductor device and manufacture thereof
JPH06106144A (en) * 1992-09-30 1994-04-19 Kokusai Denki Erutetsuku:Kk Ultrasonic cleaning method and device therefor
JPH0774287A (en) * 1993-07-08 1995-03-17 Seiko Epson Corp Semiconductor device with heat sink and manufacture of heat sink
EP0723293A1 (en) * 1994-12-16 1996-07-24 Seiko Epson Corporation Semiconductor device with a heat sink and method of producing the heat sink
US5652461A (en) * 1992-06-03 1997-07-29 Seiko Epson Corporation Semiconductor device with a convex heat sink

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218046A (en) * 1985-07-16 1987-01-27 Toshiba Corp Semiconductor device
EP0548497A1 (en) * 1991-12-20 1993-06-30 STMicroelectronics S.r.l. Plastic encapsulated semiconductor device incorporating a heat sink of metal having controlled roughness contact surfaces, and method of making the same
JPH0653390A (en) * 1992-06-03 1994-02-25 Seiko Epson Corp Semiconductor device and manufacture thereof
US5652461A (en) * 1992-06-03 1997-07-29 Seiko Epson Corporation Semiconductor device with a convex heat sink
US5653891A (en) * 1992-06-03 1997-08-05 Seiko Epson Corporation Method of producing a semiconductor device with a heat sink
US5686361A (en) * 1992-06-03 1997-11-11 Seiko Epson Corporation Method for manufacturing a semiconductor device having a heat radiator
US5693984A (en) * 1992-06-03 1997-12-02 Seiko Epson Corporation Semiconductor device having a heat radiator
JPH06106144A (en) * 1992-09-30 1994-04-19 Kokusai Denki Erutetsuku:Kk Ultrasonic cleaning method and device therefor
JPH0774287A (en) * 1993-07-08 1995-03-17 Seiko Epson Corp Semiconductor device with heat sink and manufacture of heat sink
EP0723293A1 (en) * 1994-12-16 1996-07-24 Seiko Epson Corporation Semiconductor device with a heat sink and method of producing the heat sink
EP0723293B1 (en) * 1994-12-16 2001-08-01 Seiko Epson Corporation Semiconductor device with a heat sink and method of producing the heat sink

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