SG11202112885XA - Baffle implementation for improving bottom purge gas flow uniformity - Google Patents
Baffle implementation for improving bottom purge gas flow uniformityInfo
- Publication number
- SG11202112885XA SG11202112885XA SG11202112885XA SG11202112885XA SG11202112885XA SG 11202112885X A SG11202112885X A SG 11202112885XA SG 11202112885X A SG11202112885X A SG 11202112885XA SG 11202112885X A SG11202112885X A SG 11202112885XA SG 11202112885X A SG11202112885X A SG 11202112885XA
- Authority
- SG
- Singapore
- Prior art keywords
- baffle
- implementation
- gas flow
- purge gas
- flow uniformity
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32633—Baffles
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN201941022440 | 2019-06-06 | ||
PCT/US2020/035764 WO2020247397A1 (en) | 2019-06-06 | 2020-06-02 | Baffle implementation for improving bottom purge gas flow uniformity |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202112885XA true SG11202112885XA (en) | 2021-12-30 |
Family
ID=73650795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202112885XA SG11202112885XA (en) | 2019-06-06 | 2020-06-02 | Baffle implementation for improving bottom purge gas flow uniformity |
Country Status (7)
Country | Link |
---|---|
US (1) | US20200388470A1 (en) |
JP (1) | JP2022535430A (en) |
KR (1) | KR20220027888A (en) |
CN (1) | CN113906159A (en) |
SG (1) | SG11202112885XA (en) |
TW (1) | TW202113143A (en) |
WO (1) | WO2020247397A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023034003A (en) * | 2021-08-30 | 2023-03-13 | 東京エレクトロン株式会社 | Apparatus for depositing film on substrate and method for depositing film on substrate |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100274754B1 (en) * | 1993-08-18 | 2000-12-15 | 히가시 데쓰로 | Film growth apparatus and film growth method |
JP3430277B2 (en) * | 1995-08-04 | 2003-07-28 | 東京エレクトロン株式会社 | Single wafer heat treatment equipment |
US6013319A (en) * | 1998-04-28 | 2000-01-11 | Dietze; Gerald R. | Method and apparatus for increasing deposition quality of a chemical vapor deposition system |
KR100406176B1 (en) * | 2000-06-19 | 2003-11-19 | 주식회사 하이닉스반도체 | Showerhead and an Apparatus for Supplying a Liquid Raw Materials Using the Same |
US20030198754A1 (en) * | 2001-07-16 | 2003-10-23 | Ming Xi | Aluminum oxide chamber and process |
US6905737B2 (en) * | 2002-10-11 | 2005-06-14 | Applied Materials, Inc. | Method of delivering activated species for rapid cyclical deposition |
US7981262B2 (en) * | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
KR20070069122A (en) * | 2007-06-20 | 2007-07-02 | 주식회사 테스 | Semiconductor manufacturing apparatus |
JP4985183B2 (en) * | 2007-07-26 | 2012-07-25 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
JP5820143B2 (en) * | 2010-06-22 | 2015-11-24 | 株式会社ニューフレアテクノロジー | Semiconductor manufacturing apparatus, semiconductor manufacturing method, and semiconductor manufacturing apparatus cleaning method |
FR3002242B1 (en) * | 2013-02-21 | 2015-04-03 | Altatech Semiconductor | CHEMICAL VAPOR DEPOSITION DEVICE |
FR3002241B1 (en) * | 2013-02-21 | 2015-11-20 | Altatech Semiconductor | CHEMICAL VAPOR DEPOSITION DEVICE |
CN105981140B (en) * | 2014-03-26 | 2018-08-31 | 株式会社日立国际电气 | The manufacturing method of substrate processing device and semiconductor devices |
US10312076B2 (en) * | 2017-03-10 | 2019-06-04 | Applied Materials, Inc. | Application of bottom purge to increase clean efficiency |
JP6749295B2 (en) * | 2017-08-22 | 2020-09-02 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Film forming method by epitaxial growth and epitaxial growth apparatus |
-
2020
- 2020-06-02 JP JP2021572000A patent/JP2022535430A/en active Pending
- 2020-06-02 CN CN202080041335.1A patent/CN113906159A/en active Pending
- 2020-06-02 KR KR1020217043381A patent/KR20220027888A/en unknown
- 2020-06-02 SG SG11202112885XA patent/SG11202112885XA/en unknown
- 2020-06-02 WO PCT/US2020/035764 patent/WO2020247397A1/en active Application Filing
- 2020-06-03 US US16/891,626 patent/US20200388470A1/en active Pending
- 2020-06-05 TW TW109118955A patent/TW202113143A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20220027888A (en) | 2022-03-08 |
CN113906159A (en) | 2022-01-07 |
WO2020247397A1 (en) | 2020-12-10 |
TW202113143A (en) | 2021-04-01 |
US20200388470A1 (en) | 2020-12-10 |
JP2022535430A (en) | 2022-08-08 |
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