SG11202112521YA - Process for handling mems wafers - Google Patents

Process for handling mems wafers

Info

Publication number
SG11202112521YA
SG11202112521YA SG11202112521YA SG11202112521YA SG11202112521YA SG 11202112521Y A SG11202112521Y A SG 11202112521YA SG 11202112521Y A SG11202112521Y A SG 11202112521YA SG 11202112521Y A SG11202112521Y A SG 11202112521YA SG 11202112521Y A SG11202112521Y A SG 11202112521YA
Authority
SG
Singapore
Prior art keywords
mems wafers
handling
handling mems
wafers
mems
Prior art date
Application number
SG11202112521YA
Inventor
Nicolas Arnal
Troy Quimpo
Angus North
Original Assignee
Memjet Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memjet Technology Ltd filed Critical Memjet Technology Ltd
Publication of SG11202112521YA publication Critical patent/SG11202112521YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
SG11202112521YA 2019-06-03 2020-05-11 Process for handling mems wafers SG11202112521YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962856627P 2019-06-03 2019-06-03
PCT/EP2020/063071 WO2020244890A1 (en) 2019-06-03 2020-05-11 Process for handling mems wafers

Publications (1)

Publication Number Publication Date
SG11202112521YA true SG11202112521YA (en) 2021-12-30

Family

ID=70681853

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202112521YA SG11202112521YA (en) 2019-06-03 2020-05-11 Process for handling mems wafers

Country Status (7)

Country Link
US (2) US11355383B2 (en)
EP (1) EP3956143B1 (en)
CN (1) CN113905891B (en)
AU (1) AU2020287207B2 (en)
SG (1) SG11202112521YA (en)
TW (1) TW202114873A (en)
WO (1) WO2020244890A1 (en)

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19628341C2 (en) * 1996-07-13 1998-09-17 Sihl Gmbh Aqueous ink jet recording material and use for making waterfast and lightfast recordings on this material
US6235387B1 (en) * 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
US6425971B1 (en) 2000-05-10 2002-07-30 Silverbrook Research Pty Ltd Method of fabricating devices incorporating microelectromechanical systems using UV curable tapes
US6755509B2 (en) 2002-11-23 2004-06-29 Silverbrook Research Pty Ltd Thermal ink jet printhead with suspended beam heater
US7441865B2 (en) 2004-01-21 2008-10-28 Silverbrook Research Pty Ltd Printhead chip having longitudinal ink supply channels
JP4638499B2 (en) * 2004-10-08 2011-02-23 シルバーブルック リサーチ ピーティワイ リミテッド Method for manufacturing an inkjet printer head integrated circuit
US7605009B2 (en) * 2007-03-12 2009-10-20 Silverbrook Research Pty Ltd Method of fabrication MEMS integrated circuits
TW200908164A (en) 2007-05-20 2009-02-16 Silverbrook Res Pty Co Ltd Die picker with laser die heater
US7866795B2 (en) 2007-06-15 2011-01-11 Silverbrook Research Pty Ltd Method of forming connection between electrode and actuator in an inkjet nozzle assembly
US7678667B2 (en) * 2007-06-20 2010-03-16 Silverbrook Research Pty Ltd Method of bonding MEMS integrated circuits
US8012363B2 (en) * 2007-11-29 2011-09-06 Silverbrook Research Pty Ltd Metal film protection during printhead fabrication with minimum number of MEMS processing steps
EP2543514B1 (en) 2008-01-16 2015-05-06 Memjet Technology Limited Printer with zero insertion force printhead cartridge
US8833919B2 (en) 2010-05-17 2014-09-16 Memjet Technology Ltd. Method of shaping media at printhead
US8529028B2 (en) 2010-05-17 2013-09-10 Zamtec Ltd Fluid distribution system having printhead bypass from container
US8557679B2 (en) * 2010-06-30 2013-10-15 Corning Incorporated Oxygen plasma conversion process for preparing a surface for bonding
JP2012206869A (en) * 2011-03-29 2012-10-25 Seiko Instruments Inc Method for cutting glass body, method for producing package, package, piezoelectric vibrator, oscillator, electronic equipment, and radio-controlled watch
JP2012256846A (en) * 2011-05-16 2012-12-27 Elpida Memory Inc Manufacturing method of semiconductor device
US8632162B2 (en) * 2012-04-24 2014-01-21 Eastman Kodak Company Nozzle plate including permanently bonded fluid channel
US9044945B2 (en) 2013-07-30 2015-06-02 Memjet Technology Ltd. Inkjet nozzle device having high degree of symmetry
US9899285B2 (en) * 2015-07-30 2018-02-20 Semtech Corporation Semiconductor device and method of forming small Z semiconductor package
JP6845134B2 (en) * 2015-11-09 2021-03-17 古河電気工業株式会社 Mask integrated surface protection tape
US11456268B2 (en) * 2019-01-21 2022-09-27 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and manufacturing method thereof

Also Published As

Publication number Publication date
EP3956143A1 (en) 2022-02-23
TW202114873A (en) 2021-04-16
AU2020287207B2 (en) 2023-03-16
US11355383B2 (en) 2022-06-07
CN113905891A (en) 2022-01-07
AU2020287207A1 (en) 2021-12-16
EP3956143B1 (en) 2022-10-12
US20220285201A1 (en) 2022-09-08
US11823943B2 (en) 2023-11-21
WO2020244890A1 (en) 2020-12-10
US20200381284A1 (en) 2020-12-03
CN113905891B (en) 2023-05-09

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