SG11202111289UA - Rf electrostatic chuck filter circuit - Google Patents

Rf electrostatic chuck filter circuit

Info

Publication number
SG11202111289UA
SG11202111289UA SG11202111289UA SG11202111289UA SG11202111289UA SG 11202111289U A SG11202111289U A SG 11202111289UA SG 11202111289U A SG11202111289U A SG 11202111289UA SG 11202111289U A SG11202111289U A SG 11202111289UA SG 11202111289U A SG11202111289U A SG 11202111289UA
Authority
SG
Singapore
Prior art keywords
filter circuit
electrostatic chuck
chuck filter
electrostatic
circuit
Prior art date
Application number
SG11202111289UA
Inventor
Zheng John Ye
Edward Haywood
Adam Fischbach
Timothy Joseph Franklin
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11202111289UA publication Critical patent/SG11202111289UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202111289UA 2019-04-26 2020-02-17 Rf electrostatic chuck filter circuit SG11202111289UA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962839301P 2019-04-26 2019-04-26
US16/791,875 US11189517B2 (en) 2019-04-26 2020-02-14 RF electrostatic chuck filter circuit
PCT/US2020/018512 WO2020219147A1 (en) 2019-04-26 2020-02-17 Rf electrostatic chuck filter circuit

Publications (1)

Publication Number Publication Date
SG11202111289UA true SG11202111289UA (en) 2021-11-29

Family

ID=72917237

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202111289UA SG11202111289UA (en) 2019-04-26 2020-02-17 Rf electrostatic chuck filter circuit

Country Status (7)

Country Link
US (1) US11189517B2 (en)
JP (1) JP2022530380A (en)
KR (1) KR20210147078A (en)
CN (1) CN113692637A (en)
SG (1) SG11202111289UA (en)
TW (1) TW202106904A (en)
WO (1) WO2020219147A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023548929A (en) * 2020-11-18 2023-11-21 ラム リサーチ コーポレーション Uniformity control circuit for impedance matching device
US20220399184A1 (en) * 2021-06-09 2022-12-15 Applied Materials, Inc. Plasma uniformity control in pulsed dc plasma chamber

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0918246A (en) 1995-07-04 1997-01-17 Matsushita Electric Ind Co Ltd High frequency amplifier circuit
JP2000151207A (en) * 1998-11-12 2000-05-30 Mitsubishi Electric Corp Low pass filter
JP5031252B2 (en) * 2006-03-30 2012-09-19 東京エレクトロン株式会社 Plasma processing equipment
JP5042661B2 (en) 2007-02-15 2012-10-03 東京エレクトロン株式会社 Plasma processing apparatus and filter unit
JP5301812B2 (en) * 2007-11-14 2013-09-25 東京エレクトロン株式会社 Plasma processing equipment
US10153139B2 (en) * 2015-06-17 2018-12-11 Applied Materials, Inc. Multiple electrode substrate support assembly and phase control system
CN108369921B (en) * 2015-12-07 2023-12-12 应用材料公司 Method and apparatus for clamping and unclamping a substrate using an electrostatic chuck
US10435789B2 (en) 2016-12-06 2019-10-08 Asm Ip Holding B.V. Substrate treatment apparatus
KR102269344B1 (en) * 2017-07-25 2021-06-28 주식회사 원익아이피에스 Apparatus for processing substrate

Also Published As

Publication number Publication date
CN113692637A (en) 2021-11-23
KR20210147078A (en) 2021-12-06
US20200343123A1 (en) 2020-10-29
WO2020219147A1 (en) 2020-10-29
JP2022530380A (en) 2022-06-29
US11189517B2 (en) 2021-11-30
TW202106904A (en) 2021-02-16

Similar Documents

Publication Publication Date Title
EP3746879A4 (en) Secure blockchain integrated circuit
EP3748765A4 (en) Radio frequency filter
TWI799671B (en) High frequency multilayer filter
EP3432353A4 (en) High frequency circuit
EP3921870A4 (en) Antenna-on-package integrated circuit device
EP3761491A4 (en) Switching circuit
EP3484002A4 (en) Electrostatic protection circuit
EP3667809A4 (en) High frequency filter
IL279285A (en) Slotted electrostatic chuck
EP3780059A4 (en) Circuit breaker
SG11202111289UA (en) Rf electrostatic chuck filter circuit
EP3783634A4 (en) Dc circuit breaker
EP3921867A4 (en) Antenna-on-package integrated circuit device
SG11202110823VA (en) Electrostatic chucking process
EP3896465A4 (en) Frequency detection circuit
EP3791428A4 (en) Integrated circuit including vertical capacitors
GB2603735B (en) Integrated circuit manufacturing process
TWI800702B (en) Integrated circuit
EP4060806A4 (en) Dielectric ceramic filter
EP3852135A4 (en) Electrostatic chuck
EP3889987A4 (en) Circuit breaker
EP4044426A4 (en) Oscillator circuit
GB201916243D0 (en) Current limiting circuit
HUE060041T2 (en) Four ways circuit breaker
EP3770939A4 (en) Circuit interrupter