SG11202106326PA - System and method for modification of substrates - Google Patents
System and method for modification of substratesInfo
- Publication number
- SG11202106326PA SG11202106326PA SG11202106326PA SG11202106326PA SG11202106326PA SG 11202106326P A SG11202106326P A SG 11202106326PA SG 11202106326P A SG11202106326P A SG 11202106326PA SG 11202106326P A SG11202106326P A SG 11202106326PA SG 11202106326P A SG11202106326P A SG 11202106326PA
- Authority
- SG
- Singapore
- Prior art keywords
- substrates
- modification
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000012986 modification Methods 0.000 title 1
- 230000004048 modification Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/205—Ink jet for printing a discrete number of tones
- B41J2/2054—Ink jet for printing a discrete number of tones by the variation of dot disposition or characteristics, e.g. dot number density, dot shape
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
- G05B13/042—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators in which a parameter or coefficient is automatically adjusted to optimise the performance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Evolutionary Computation (AREA)
- Medical Informatics (AREA)
- Software Systems (AREA)
- Automation & Control Theory (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862779091P | 2018-12-13 | 2018-12-13 | |
PCT/US2019/066207 WO2020123929A1 (en) | 2018-12-13 | 2019-12-13 | System and method for modification of substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202106326PA true SG11202106326PA (en) | 2021-07-29 |
Family
ID=71077022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202106326PA SG11202106326PA (en) | 2018-12-13 | 2019-12-13 | System and method for modification of substrates |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220013417A1 (en) |
EP (1) | EP3894097A4 (en) |
JP (1) | JP2022514245A (en) |
SG (1) | SG11202106326PA (en) |
TW (1) | TWI794566B (en) |
WO (1) | WO2020123929A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11908711B2 (en) * | 2020-09-30 | 2024-02-20 | Canon Kabushiki Kaisha | Planarization process, planarization system and method of manufacturing an article |
US11869813B2 (en) * | 2020-12-15 | 2024-01-09 | Canon Kabushiki Kaisha | Planarization apparatus, planarization process, and method of manufacturing an article |
TWI744203B (en) * | 2021-03-09 | 2021-10-21 | 聯華電子股份有限公司 | Method for bonding two semiconductor structures |
JP2024133776A (en) * | 2023-03-20 | 2024-10-03 | ソニーセミコンダクタソリューションズ株式会社 | Semiconductor Device |
CN117173176B (en) * | 2023-11-02 | 2024-01-26 | 张家港中贺自动化科技有限公司 | Multi-layer photoetching process hot spot detection method based on image processing |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7032324B2 (en) * | 2000-09-24 | 2006-04-25 | 3M Innovative Properties Company | Coating process and apparatus |
US7363099B2 (en) * | 2002-06-07 | 2008-04-22 | Cadence Design Systems, Inc. | Integrated circuit metrology |
TWI423306B (en) * | 2008-06-09 | 2014-01-11 | Univ Texas | Adaptive nanotopography sculpting |
TW201218397A (en) * | 2010-07-09 | 2012-05-01 | Applied Materials Inc | High performance multi-layer back contact stack for silicon solar cells |
US9252375B2 (en) * | 2013-03-15 | 2016-02-02 | LuxVue Technology Corporation | Method of fabricating a light emitting diode display with integrated defect detection test |
US9718096B2 (en) * | 2013-08-19 | 2017-08-01 | Board Of Regents, The University Of Texas System | Programmable deposition of thin films of a user-defined profile with nanometer scale accuracy |
JP6437387B2 (en) * | 2015-05-25 | 2018-12-12 | 東芝メモリ株式会社 | Substrate flattening method |
IL258703B2 (en) | 2015-10-15 | 2023-11-01 | Univ Texas | Versatile process for precision nanoscale manufacturing |
US10191368B2 (en) * | 2015-11-05 | 2019-01-29 | Board Of Regents, The University Of Texas System | Multi-field overlay control in jet and flash imprint lithography |
US10717646B2 (en) * | 2016-05-20 | 2020-07-21 | Board Of Regents, The University Of Texas System | Precision alignment of the substrate coordinate system relative to the inkjet coordinate system |
US11669009B2 (en) * | 2016-08-03 | 2023-06-06 | Board Of Regents, The University Of Texas System | Roll-to-roll programmable film imprint lithography |
-
2019
- 2019-12-13 US US17/413,523 patent/US20220013417A1/en active Pending
- 2019-12-13 EP EP19896567.5A patent/EP3894097A4/en active Pending
- 2019-12-13 TW TW108145747A patent/TWI794566B/en active
- 2019-12-13 SG SG11202106326PA patent/SG11202106326PA/en unknown
- 2019-12-13 JP JP2021534137A patent/JP2022514245A/en active Pending
- 2019-12-13 WO PCT/US2019/066207 patent/WO2020123929A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3894097A1 (en) | 2021-10-20 |
EP3894097A4 (en) | 2022-12-21 |
TW202038321A (en) | 2020-10-16 |
JP2022514245A (en) | 2022-02-10 |
WO2020123929A1 (en) | 2020-06-18 |
TWI794566B (en) | 2023-03-01 |
US20220013417A1 (en) | 2022-01-13 |
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