SG11202103724SA - Die ejector - Google Patents

Die ejector

Info

Publication number
SG11202103724SA
SG11202103724SA SG11202103724SA SG11202103724SA SG11202103724SA SG 11202103724S A SG11202103724S A SG 11202103724SA SG 11202103724S A SG11202103724S A SG 11202103724SA SG 11202103724S A SG11202103724S A SG 11202103724SA SG 11202103724S A SG11202103724S A SG 11202103724SA
Authority
SG
Singapore
Prior art keywords
die ejector
ejector
die
Prior art date
Application number
SG11202103724SA
Inventor
Fabian Hurschler
Stefan Behler
Brian Pulis
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of SG11202103724SA publication Critical patent/SG11202103724SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG11202103724SA 2018-10-15 2019-10-15 Die ejector SG11202103724SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01254/18A CH715447B1 (en) 2018-10-15 2018-10-15 chip ejector.
PCT/IB2019/058780 WO2020079589A1 (en) 2018-10-15 2019-10-15 Die ejector

Publications (1)

Publication Number Publication Date
SG11202103724SA true SG11202103724SA (en) 2021-05-28

Family

ID=68240782

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202103724SA SG11202103724SA (en) 2018-10-15 2019-10-15 Die ejector

Country Status (7)

Country Link
US (1) US20210391205A1 (en)
KR (1) KR20210061433A (en)
CN (1) CN113228244A (en)
CH (1) CH715447B1 (en)
DE (1) DE112019005141A5 (en)
SG (1) SG11202103724SA (en)
WO (1) WO2020079589A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240053715A (en) 2022-10-17 2024-04-25 세메스 주식회사 Die ejecting apparatus and die bonding equipment including the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3384236A (en) * 1966-08-31 1968-05-21 Corning Glass Works Machine for automatically testing and orienting miniature semiconductor chips
SU738864A1 (en) * 1977-12-20 1980-06-05 Предприятие П/Я М-5057 Industrial robot
JP2002141392A (en) * 2000-11-06 2002-05-17 Mitsubishi Electric Corp Pickup method and equipment for semiconductor chip and die bonding equipment provided therewith
JP3925337B2 (en) * 2002-07-22 2007-06-06 株式会社村田製作所 Chip parts transfer and holding device
JP2006093363A (en) * 2004-09-24 2006-04-06 Nidec Tosok Corp Lift head
KR20090120208A (en) * 2008-05-19 2009-11-24 삼성테크윈 주식회사 Apparatus for supplying die and method for supplying die using the same
MY150953A (en) * 2008-11-05 2014-03-31 Esec Ag Die-ejector
CH699851A1 (en) * 2008-11-05 2010-05-14 Esec Ag Die ejector for mounting semiconductor chips from foil in frame, has path-like opening that is different from plate to plate such that plates are displaced in predetermined sequence in desired direction when pin is moved along path
DE202011002247U1 (en) * 2011-02-02 2011-04-21 Kuhnke Automation Gmbh & Co. Kg rotary magnet
CH706280B1 (en) * 2012-03-30 2016-03-15 Esec Ag A method for detaching a semiconductor chip from a foil.
KR200466085Y1 (en) * 2012-08-31 2013-04-03 세메스 주식회사 Die ejecting apparatus
KR200468690Y1 (en) * 2012-08-31 2013-08-29 세메스 주식회사 Die ejecting apparatus
DE102012021386B4 (en) * 2012-10-31 2019-09-19 Anvis Deutschland Gmbh Spring function component for a hydroelastic bearing and hydroelastic bearing
KR101496024B1 (en) * 2013-08-13 2015-02-25 세메스 주식회사 Apparatus for ejecting a die
CN103730333B (en) * 2013-12-23 2016-04-20 华中科技大学 A kind of many thimbles chip peeling apparatus
CN203649397U (en) * 2013-12-31 2014-06-18 昆山优磁电子有限公司 UF type magnetic core die
KR101585316B1 (en) * 2014-01-29 2016-01-13 세메스 주식회사 Apparatus for ejecting a die
DE102014006510B3 (en) * 2014-05-02 2015-10-29 Festo Ag & Co. Kg valve assembly
CN104347457B (en) * 2014-09-17 2017-01-11 华中科技大学 Chip peeling device applicable to fast replacement of ejector pin
US9915305B2 (en) * 2016-06-08 2018-03-13 Deere & Company Retention pin having foot for holding spring in disc brake pack reaction plate during assembly and for operating stator disc

Also Published As

Publication number Publication date
CH715447B1 (en) 2022-01-14
DE112019005141A5 (en) 2021-07-01
JP2022504581A (en) 2022-01-13
WO2020079589A1 (en) 2020-04-23
CH715447A2 (en) 2020-04-15
US20210391205A1 (en) 2021-12-16
KR20210061433A (en) 2021-05-27
CN113228244A (en) 2021-08-06

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