SG11202013113RA - Metal sublayer sensing in multi-layer workpiece hole drilling - Google Patents

Metal sublayer sensing in multi-layer workpiece hole drilling

Info

Publication number
SG11202013113RA
SG11202013113RA SG11202013113RA SG11202013113RA SG11202013113RA SG 11202013113R A SG11202013113R A SG 11202013113RA SG 11202013113R A SG11202013113R A SG 11202013113RA SG 11202013113R A SG11202013113R A SG 11202013113RA SG 11202013113R A SG11202013113R A SG 11202013113RA
Authority
SG
Singapore
Prior art keywords
sensing
hole drilling
workpiece hole
metal sublayer
layer workpiece
Prior art date
Application number
SG11202013113RA
Other languages
English (en)
Inventor
Guy Soffer
Original Assignee
Drilliant Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Drilliant Ltd filed Critical Drilliant Ltd
Publication of SG11202013113RA publication Critical patent/SG11202013113RA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
SG11202013113RA 2018-06-28 2019-06-27 Metal sublayer sensing in multi-layer workpiece hole drilling SG11202013113RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/022,052 US10932370B2 (en) 2018-06-28 2018-06-28 Metal sublayer sensing in multi-layer workpiece hole drilling
PCT/IL2019/050716 WO2020003318A1 (en) 2018-06-28 2019-06-27 Metal sublayer sensing in multi-layer workpiece hole drilling

Publications (1)

Publication Number Publication Date
SG11202013113RA true SG11202013113RA (en) 2021-01-28

Family

ID=68986107

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202013113RA SG11202013113RA (en) 2018-06-28 2019-06-27 Metal sublayer sensing in multi-layer workpiece hole drilling

Country Status (4)

Country Link
US (2) US10932370B2 (de)
EP (1) EP3814760B1 (de)
SG (1) SG11202013113RA (de)
WO (1) WO2020003318A1 (de)

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786864A (en) 1985-03-29 1988-11-22 International Business Machines Corporation Photon assisted tunneling testing of passivated integrated circuits
US4789770A (en) 1987-07-15 1988-12-06 Westinghouse Electric Corp. Controlled depth laser drilling system
DE3733489A1 (de) 1987-10-03 1989-04-20 Telemit Electronic Gmbh Verfahren und vorrichtung zur materialbearbeitung mit hilfe eines lasers
US4988877A (en) * 1989-10-03 1991-01-29 Tencor Instruments Via hole checker
US6317514B1 (en) 1998-09-09 2001-11-13 Applied Materials, Inc. Method and apparatus for inspection of patterned semiconductor wafers
JP3749107B2 (ja) * 1999-11-05 2006-02-22 ファブソリューション株式会社 半導体デバイス検査装置
DE10060407C2 (de) 2000-12-05 2003-04-30 Lpkf Laser & Electronics Ag Vorrichtung zum Laserstrahlbohren
JP4738610B2 (ja) 2001-03-02 2011-08-03 株式会社トプコン 基板表面の汚染評価方法及び汚染評価装置と半導体装置の製造方法
US20050061779A1 (en) 2003-08-06 2005-03-24 Walter Blumenfeld Laser ablation feedback spectroscopy
TWI382795B (zh) 2005-03-04 2013-01-11 Hitachi Via Mechanics Ltd A method of opening a printed circuit board and an opening device for a printed circuit board
US8598490B2 (en) * 2008-03-31 2013-12-03 Electro Scientific Industries, Inc. Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
DE102009016125A1 (de) 2009-04-03 2010-10-14 Schott Ag Verfahren und Vorrichtung zur Bearbeitung, insbesondere zur Trennung, von Werkstücken
US9254536B2 (en) 2009-05-15 2016-02-09 Paul Hoff Method and apparatus for controlled laser ablation of material
US8525073B2 (en) * 2010-01-27 2013-09-03 United Technologies Corporation Depth and breakthrough detection for laser machining
JP2012098113A (ja) 2010-11-01 2012-05-24 Renesas Electronics Corp 半導体装置の製造方法
EP2858102B1 (de) 2012-05-31 2020-04-22 Kabushiki Kaisha Nihon Micronics Halbleitersonde zum testen von quantenzellen sowie testvorrichtung und testverfahren
DE102012219196B3 (de) 2012-10-22 2014-02-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Bearbeitungsmaschine zum Einstechen, Bohren oder Schneiden metallischer Werkstücke
WO2017109787A1 (en) 2015-12-22 2017-06-29 Drilliant Ltd. Metal sublayer sensing in multi-layer workpiece hole drilling

Also Published As

Publication number Publication date
US11792940B2 (en) 2023-10-17
EP3814760A1 (de) 2021-05-05
US20200008303A1 (en) 2020-01-02
EP3814760A4 (de) 2022-03-30
US20210161017A1 (en) 2021-05-27
EP3814760B1 (de) 2024-03-20
WO2020003318A1 (en) 2020-01-02
US10932370B2 (en) 2021-02-23

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